[go: up one dir, main page]

EP1628336A3 - Cleaning liquid and cleaning method - Google Patents

Cleaning liquid and cleaning method Download PDF

Info

Publication number
EP1628336A3
EP1628336A3 EP05107342A EP05107342A EP1628336A3 EP 1628336 A3 EP1628336 A3 EP 1628336A3 EP 05107342 A EP05107342 A EP 05107342A EP 05107342 A EP05107342 A EP 05107342A EP 1628336 A3 EP1628336 A3 EP 1628336A3
Authority
EP
European Patent Office
Prior art keywords
cleaning liquid
cleaning
liquid
wirings
corroding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05107342A
Other languages
German (de)
French (fr)
Other versions
EP1628336A2 (en
EP1628336B1 (en
Inventor
Kenji c/o Mitsubishi Gas Chem. C. Inc. Shimada
Kojiro c/o Mitsubishi Gas Chem. C. Inc Abe
Masaru c/o Mitsubishi Gas Chem. C. Inc Ohto
Hiroshi c/o Mitusbishi Gas C. C. Inc. Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of EP1628336A2 publication Critical patent/EP1628336A2/en
Publication of EP1628336A3 publication Critical patent/EP1628336A3/en
Application granted granted Critical
Publication of EP1628336B1 publication Critical patent/EP1628336B1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/042—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/044—Hydroxides or bases
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/046—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/08—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/10—Salts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32138—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only pre- or post-treatments, e.g. anti-corrosion processes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)

Abstract

A cleaning liquid is provided, which comprises an aqueous solution containing nitric acid, sulfuric acid, a fluorine compound, and a basic compound. The concentration of water in the cleaning liquid is 80% by weight or more, and the pH value of the cleaning liquid is from 1 to less than 3. The cleaning liquid is effective for removing etching residues formed in a dry etching process from semiconductor devices and display devices without oxidizing and corroding their metal wirings, particularly, copper wirings and the materials of insulating films.
EP05107342A 2004-08-18 2005-08-10 Cleaning liquid and cleaning method Ceased EP1628336B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004238256 2004-08-18

Publications (3)

Publication Number Publication Date
EP1628336A2 EP1628336A2 (en) 2006-02-22
EP1628336A3 true EP1628336A3 (en) 2008-09-17
EP1628336B1 EP1628336B1 (en) 2012-01-04

Family

ID=35457847

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05107342A Ceased EP1628336B1 (en) 2004-08-18 2005-08-10 Cleaning liquid and cleaning method

Country Status (5)

Country Link
US (1) US7572758B2 (en)
EP (1) EP1628336B1 (en)
KR (1) KR101132878B1 (en)
SG (1) SG120271A1 (en)
TW (1) TWI368272B (en)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1715510B2 (en) 2004-02-09 2016-02-24 Mitsubishi Chemical Corporation Substrate cleaning liquid for semiconductor device and cleaning method
TWI244135B (en) * 2004-12-31 2005-11-21 Ind Tech Res Inst Method of making solar cell
JP4988165B2 (en) * 2005-03-11 2012-08-01 関東化学株式会社 Photoresist stripping composition and method for stripping photoresist
JP5251128B2 (en) * 2005-12-01 2013-07-31 三菱瓦斯化学株式会社 Cleaning liquid and cleaning method for semiconductor element or display element
TW200741031A (en) * 2006-03-03 2007-11-01 Mec Co Ltd Surface treating agent and method for manufacturing coating using the same
US20070232511A1 (en) * 2006-03-28 2007-10-04 Matthew Fisher Cleaning solutions including preservative compounds for post CMP cleaning processes
US7772128B2 (en) * 2006-06-09 2010-08-10 Lam Research Corporation Semiconductor system with surface modification
US9058975B2 (en) * 2006-06-09 2015-06-16 Lam Research Corporation Cleaning solution formulations for substrates
US7947637B2 (en) * 2006-06-30 2011-05-24 Fujifilm Electronic Materials, U.S.A., Inc. Cleaning formulation for removing residues on surfaces
JP4642001B2 (en) * 2006-10-24 2011-03-02 関東化学株式会社 Composition for removing photoresist residue and polymer residue
WO2008061258A2 (en) * 2006-11-17 2008-05-22 Sachem, Inc. Selective metal wet etch composition and process
KR101223061B1 (en) * 2006-12-29 2013-01-17 엘지전자 주식회사 Method of preparing solar cell and solar cell prepared by the same
KR20090005489A (en) * 2007-07-09 2009-01-14 삼성전자주식회사 Semiconductor wet etchant and wiring structure formation method using the same
KR20100044777A (en) * 2007-07-26 2010-04-30 미츠비시 가스 가가쿠 가부시키가이샤 Composition for cleaning and rust prevention and process for producing semiconductor element or display element
KR101132303B1 (en) * 2009-02-16 2012-04-05 주식회사 하이닉스반도체 Method for forming copper wiring of semiconductor device
RU2011139105A (en) * 2009-02-25 2013-04-10 Авантор Перформанс Матириалз, Инк. COMPOSITIONS FOR REMOVING A PHOTORESIST FOR CLEANING ION-IMPLANTED PHOTORESIST FROM PLATES OF SEMICONDUCTOR DEVICES
US8765653B2 (en) 2009-07-07 2014-07-01 Air Products And Chemicals, Inc. Formulations and method for post-CMP cleaning
WO2011009764A1 (en) * 2009-07-22 2011-01-27 Basf Se Etchant composition and etching process for titanium-aluminum complex metal layer
JP5206622B2 (en) * 2009-08-07 2013-06-12 三菱瓦斯化学株式会社 Treatment liquid for suppressing pattern collapse of metal microstructure and method for producing metal microstructure using the same
US20110045203A1 (en) * 2009-08-21 2011-02-24 E. I. Du Pont De Nemours And Company Process for inhibiting oxide formation on copper surfaces
WO2011094568A2 (en) * 2010-01-29 2011-08-04 Advanced Technology Materials, Inc. Cleaning agent for semiconductor provided with metal wiring
KR101829399B1 (en) * 2010-03-04 2018-03-30 삼성전자주식회사 photosensitive-resin remover composition and method of fabricating semiconductor device using the same
SG187756A1 (en) * 2010-09-01 2013-03-28 Basf Se Aqueous acidic solution and etching solution and method for texturizing surface of single crystal and polycrystal silicon substrates
JP2013133458A (en) * 2011-12-27 2013-07-08 Idemitsu Kosan Co Ltd Aqueous detergent
US9070625B2 (en) * 2012-01-04 2015-06-30 International Business Machines Corporation Selective etch chemistry for gate electrode materials
EP2876669B1 (en) * 2012-07-19 2021-07-07 Nissan Chemical Corporation Cleaning fluid for semiconductor, and cleaning method using same
US9058976B2 (en) * 2012-11-06 2015-06-16 International Business Machines Corporation Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof
JP6344812B2 (en) * 2012-12-28 2018-06-20 日東電工株式会社 Water-dispersed pressure-sensitive adhesive composition for transparent conductive layer, pressure-sensitive adhesive layer for transparent conductive layer, optical film with pressure-sensitive adhesive layer, and liquid crystal display device
CN104102028A (en) * 2013-04-10 2014-10-15 第一毛织株式会社 Organic solution for surface treatment of induim zinc oxide substrate and method of preparing display substrate using the same
TWI642777B (en) * 2013-11-08 2018-12-01 日商富士軟片和光純藥股份有限公司 Semiconductor substrate cleaner and method for treating semiconductor substrate surface
JP6274926B2 (en) * 2014-03-17 2018-02-07 株式会社ディスコ Cutting method
KR102456079B1 (en) * 2014-12-24 2022-11-21 삼성디스플레이 주식회사 Cleaning composition for removing oxide and method of cleaning using the same
CN107406810A (en) * 2015-03-31 2017-11-28 弗萨姆材料美国有限责任公司 cleaning preparation
TWI608311B (en) * 2016-03-25 2017-12-11 達興材料股份有限公司 A photoresist stripper composition and a photolithography process for manufacturing a electronic device utilizing the same
IL278257B2 (en) 2018-04-27 2025-03-01 Mitsubishi Gas Chemical Co Aqueous composition and cleaning method using the same
CN112349807B (en) * 2019-08-09 2022-06-14 泰州隆基乐叶光伏科技有限公司 A method of extracting battery slices
CN113774391B (en) * 2021-08-12 2023-08-04 上海新阳半导体材料股份有限公司 Application of cleaning liquid after chemical mechanical polishing
CN114774936B (en) * 2022-04-20 2023-04-07 武汉大学 Flexible acid pickling method for hollow copper conductor oxide of generator

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339340A (en) * 1975-11-26 1982-07-13 Tokyo Shibaura Electric Co., Ltd. Surface-treating agent adapted for intermediate products of a semiconductor device
US20030192859A1 (en) * 2002-03-26 2003-10-16 Ikuo Uematsu Method of manufacturing electronic device
US20040106531A1 (en) * 2002-07-12 2004-06-03 Renesas Technology Corp. Cleaning composition for removing resists and method of manufacturing semiconductor device
US20040137736A1 (en) * 2002-10-22 2004-07-15 Jerome Daviot Aqueous phosphoric acid compositions for cleaning semiconductor devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5466389A (en) * 1994-04-20 1995-11-14 J. T. Baker Inc. PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US6413466B1 (en) * 2000-06-30 2002-07-02 Schmalbach-Lubeca Ag Plastic container having geometry minimizing spherulitic crystallization below the finish and method
US6391794B1 (en) * 2000-12-07 2002-05-21 Micron Technology, Inc. Composition and method for cleaning residual debris from semiconductor surfaces
EP1389496A1 (en) * 2001-05-22 2004-02-18 Mitsubishi Chemical Corporation Method for cleaning surface of substrate
KR20030010180A (en) * 2001-07-25 2003-02-05 김경진 Cleaning solution of semiconductor device and method of cleaning using the same
SG129274A1 (en) * 2003-02-19 2007-02-26 Mitsubishi Gas Chemical Co Cleaaning solution and cleaning process using the solution
US20040188285A1 (en) * 2003-03-28 2004-09-30 Toshiyuki Yoshikawa Clothes container
JP4440689B2 (en) * 2004-03-31 2010-03-24 東友ファインケム株式会社 Resist stripper composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339340A (en) * 1975-11-26 1982-07-13 Tokyo Shibaura Electric Co., Ltd. Surface-treating agent adapted for intermediate products of a semiconductor device
US20030192859A1 (en) * 2002-03-26 2003-10-16 Ikuo Uematsu Method of manufacturing electronic device
US20040106531A1 (en) * 2002-07-12 2004-06-03 Renesas Technology Corp. Cleaning composition for removing resists and method of manufacturing semiconductor device
US20040137736A1 (en) * 2002-10-22 2004-07-15 Jerome Daviot Aqueous phosphoric acid compositions for cleaning semiconductor devices

Also Published As

Publication number Publication date
EP1628336A2 (en) 2006-02-22
SG120271A1 (en) 2006-03-28
US20060040838A1 (en) 2006-02-23
US7572758B2 (en) 2009-08-11
TWI368272B (en) 2012-07-11
KR20060050430A (en) 2006-05-19
TW200614362A (en) 2006-05-01
EP1628336B1 (en) 2012-01-04
KR101132878B1 (en) 2012-04-05

Similar Documents

Publication Publication Date Title
EP1628336A3 (en) Cleaning liquid and cleaning method
TWI518206B (en) Etching solution for copper/titanium multilayer film
SG129274A1 (en) Cleaaning solution and cleaning process using the solution
Venkatesh et al. Characterization of TMAH based cleaning solution for post Cu-CMP application
JP5753180B2 (en) Etching solution composition
EP1724824A3 (en) Equipment and method for measuring silicon concentration in phosphoric acid solution
JPH09181028A (en) Semiconductor element cleaning liquid
EP1688798A3 (en) Aqueous based residue removers comprising fluoride
US20110257057A1 (en) Cleaning solution for stainless steel and cleaning method using same
WO2005022592A3 (en) Novel aqueous based metal etchant
JPH08316187A (en) Cleaning method
JP5010873B2 (en) Etching composition for titanium and aluminum metal laminate film
JP2012505293A5 (en)
WO2006017108A3 (en) System and method for pre-gate cleaning of substrates
JP4535232B2 (en) Titanium or titanium alloy etchant
KR101190907B1 (en) Remover composition
JP4661206B2 (en) Semiconductor substrate cleaning solution
WO2005096747A3 (en) Highly selective silicon oxide etching compositions
TWI359866B (en) Cleaning composition and method
JP2002115083A5 (en)
JP2008216843A (en) Photoresist stripping composition
JP5251977B2 (en) Cleaning method of semiconductor element
JP4637010B2 (en) Release agent composition
Thanu et al. Dilute HF solutions for copper cleaning during BEOL processes: effect of aeration on selectivity and copper corrosion
RU2376676C1 (en) Method of processing silicon crystals

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

17P Request for examination filed

Effective date: 20081222

17Q First examination report despatched

Effective date: 20090211

AKX Designation fees paid

Designated state(s): IT

REG Reference to a national code

Ref country code: DE

Ref legal event code: 8566

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): IT

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20121005

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20140819

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150810