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EP1590415A1 - Matiere collante thermoactivable destinee au collage de cartes de circuits imprimes flexibles - Google Patents

Matiere collante thermoactivable destinee au collage de cartes de circuits imprimes flexibles

Info

Publication number
EP1590415A1
EP1590415A1 EP04705391A EP04705391A EP1590415A1 EP 1590415 A1 EP1590415 A1 EP 1590415A1 EP 04705391 A EP04705391 A EP 04705391A EP 04705391 A EP04705391 A EP 04705391A EP 1590415 A1 EP1590415 A1 EP 1590415A1
Authority
EP
European Patent Office
Prior art keywords
adhesive film
adhesive
concrete
fpcb
film according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04705391A
Other languages
German (de)
English (en)
Inventor
Marc Husemann
Christian Ring
Dieter Zimmermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10317403A external-priority patent/DE10317403A1/de
Priority claimed from DE2003124737 external-priority patent/DE10324737A1/de
Application filed by Tesa SE filed Critical Tesa SE
Publication of EP1590415A1 publication Critical patent/EP1590415A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Definitions

  • the invention relates to a heat-activatable adhesive with low flow at high temperatures for bonding flexible printed circuit board laminates.
  • Adhesive tapes are widespread processing aids in many technical fields. Adhesive tapes are subject to very high requirements, particularly for use in the electronic industry.
  • FPCBs flexible printed circuit boards
  • FPCBs Flexible printed circuit boards are used in a variety of electronic devices such as Cell phones, car radios, computers, etc. represented.
  • FPCBs consist of layers of copper and polyimide, where appropriate polyimide is glued to the copper foil.
  • FPCBs For the use of the FPCBs, they are glued to substrates or to one another. In the latter case, polyimide films are bonded to one another.
  • heat-activated adhesives are generally used that do not release any volatile components and can also be used in a high temperature range.
  • the heat-activatable adhesive must be self-crosslinking after temperature activation, since the bonded FPCBs generally also have to be solder bath-resistant.
  • Pure thermoplastics which are used as heat-activated adhesives for a number of bonds, become soft again at high temperatures and therefore have no resistance to solder baths. Pure thermoplastics are therefore unsuitable as the basis for the adhesive compositions for the abovementioned application. Thermoplastic adhesives would, however, be preferred for the bonding process as such, since they can be activated in a few seconds and the adhesive connection could accordingly be set up quickly.
  • Phenolic resin-based heat-activated adhesive tapes are generally excluded because they release volatile components during curing and thus lead to the formation of bubbles.
  • the object of the invention was therefore to meet the need for a heat-activatable adhesive system which is self-crosslinking and solder bath-resistant, has a low flow behavior at temperatures above 120 ° C. and has good adhesion to polyimide.
  • This object is surprisingly achieved by an adhesive film, as is characterized in the main claim.
  • the subclaims relate to advantageous developments of the subject matter of the invention.
  • the invention relates to an adhesive film comprising (i) at least one thermoplastic polymer or a thermoplastic elastomer, (ii) at least one (tackifying) resin and (iii) at least one organically modified layered silicate and / or concreteite.
  • adheresive film encompasses all flat structures, such as extended films, film sections and cutouts, tapes (extended length, limited width), tape sections, labels, die-cuts and the like, with the structures can have regular or irregular shapes.
  • % By weight ii) one or more tackifying phenolic resins with a proportion of 0-30% by weight iii) epoxy resins, advantageously with hardeners, optionally also with accelerators, with a proportion of 5-60% by weight iv) organically modified Layered silicates or concrete with a share of 1 - 15% by weight
  • the reactive film is advantageously a mixture containing reactive resins which crosslink at room temperature and form a three-dimensional, high-strength polymer network, and containing thermoplastic compounds, in particular permanently elastic elastomers, which counteract embrittlement of the product.
  • the elastomer can preferably originate from the group of polyolefins, polyesters, polyurethanes or polyamides or can be a modified rubber, e.g. Nitrile rubber.
  • thermoplastic polyurethanes are reaction products of polyester or polyether polyols and organic diisocyanates such as Diphenylmethane diisocyanate, known. They are made up of predominantly linear marrow molecules. Such products are usually commercially available in the form of elastic granules, for example from Bayer AG under the trade name "Desmocoll”.
  • Synthetically produced nitrile rubbers can also be used as elastomers.
  • nitrile rubbers can also be used as elastomers.
  • Hycar TM types used by BF Goodrich.
  • Suitable nitrile rubbers are also available under the trade name Nipol TM from Nippon Zeon.
  • Amorphous types are particularly preferably used as polyester.
  • the adhesive film further comprises substances which, in particular under elevated pressure and / or elevated temperature, serve as hardeners for at least one of the resins present.
  • the softening temperature of the adhesive film can be sufficiently reduced by combining elastomers with selected compatible resins. At the same time, there is an increase in adhesion. Rosin, hydrocarbon and coumarone resins, for example, have proven to be suitable resins.
  • Epoxy resins are usually understood to mean both oligomeric compounds with more than one epoxy group per mole and the thermosets produced from such compounds. In the sense of the invention, the entire group of epoxy compounds should be understood.
  • the corresponding monomers, oligomers or polymers can be used which have at least two epoxy groups.
  • Polymeric epoxy resins can be aliphatic, cycloaliphatic, aromatic or heterocyclic in nature.
  • the molecular weight M n of the added epoxy resins is preferably chosen between 100 and 25,000 g / mol.
  • Epoxy resins which can advantageously be used according to the invention include, for example, glycid esters and / or the reaction products epichlorohydrin and at least one of the following compounds: Bisphenol A, the reaction product of phenol and formaldehyde (novolak resins), p-amino phenol.
  • Preferred commercial examples are e.g. Araldite TM 6010, CY-281 TM, ECN TM 1273, ECN TM 1280, MY 720, RD-2 from Ciba Geigy, DER TM 331, DER TM 732, DER TM 736, DEN TM 432, DEN TM 438, DEN TM 485 from Dow Chemical, Epon TM 812, 825, 826, 828, 830, 834, 836, 871, 872, 1001, 1004, 1031 etc. from Shell Chemical and HPT TM 1071, HPT TM 1079 also from Shell Chemical.
  • Examples of commercial aliphatic epoxy resins are e.g. Vinyl cyclohexane dioxides such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.
  • Hardeners are substances that are added to crosslinkable resins (prepolymers) to cause them to harden (crosslink).
  • all of the hardeners known to the person skilled in the art can advantageously be used as hardening systems for epoxy resins and / or phenolic resins and / or other added resins in the adhesive film.
  • All formaldehyde donors such as hexamethylenetretraamine, fall into this category.
  • Acid anhydrides, cationic crosslinking agents, guanidines such as dicyandiamide or peroxides can also be used. Combinations of these crosslinkers can also be used.
  • accelerators can also be used, such as imidazoles.
  • Suitable accelerators are, for example, imidazoles, commercially available from 2M7, 2E4MN, 2PZ-CN, 2PZ-CNS, P0505, L07N from Shikoku Chem. Corp. or Curezol 2MZ from Air Products. Furthermore, amines, especially tertiary amines, can also be used for acceleration.
  • Another component of the inventive PSA are organically modified layered silicates or concrete.
  • Silicates which are available under the trade name Bentone TM (company Elementis Specialties) are particularly preferred for use. Bentone are preferably used TM types, low outgassing at 200 C C - preferably less than 200 micrograms volatiles at a temperature of 200 ° C over a period of 1 h - as well as a low chloride content - preferably less than 0, 2% by weight, particularly preferably less than 0.1% by weight
  • High levels of chloride can negatively affect the electrical conductivity of the copper conductor tracks.
  • High outgassing components lead to deformation of the FPCB laminates after curing and reduce the resistance to the solder bath.
  • phenolic resins such as e.g. Use YP 50 (Toto Kasei), PKHC (Union Carbide Corp.) and / or BKR 2620 (Showa Union Gosei Corp.).
  • Polyisocyanates such as e.g. Coronate TM L (from Nippon Polyurethane Ind.), Desmodur TM N3300 or Mondur TM 489 (from Bayer) can be used in addition or as an alternative to the phenolic resins.
  • the composition for the adhesive film can be varied within a wide range by changing the type and proportion of raw material. Likewise, further product properties such as color, thermal or electrical conductivity can be achieved through the targeted addition of dyes, fillers and / or carbon or metal powders.
  • the adhesive film preferably has a thickness of 5 to 100 ⁇ m, preferably 10 and 50 ⁇ m.
  • the mass forming the film is coated as a solution or from the melt onto a flexible substrate (release film, release paper) and countered. if necessary dried so that the mass can be easily removed from the substrate. After appropriate assembly, die cuts, sections of a roll or other shaped bodies can be glued from this adhesive film to the substrate (polyimide) to be bonded at room temperature or at a slightly elevated temperature.
  • the adhesive is coated on a polyimide carrier. Such adhesive films can then be used to cover copper interconnects for FPCBs.
  • the admixed reactive resins should preferably not yet undergo any chemical reaction at the slightly elevated temperature. It is not necessary for the adhesive to be carried out as a one-step process, but for the sake of simplicity, as in the case of bonding with commercially available pressure-sensitive adhesive tapes, the adhesive film can first be tacked onto one of the two substrates by laminating in the heat. During the actual hot glue process with the second substrate (second polyimide film of the second FPCB), the resin cures in whole or in part and the adhesive joint achieves the high bond strength, which is significantly higher than that of known pressure sensitive adhesive systems. Accordingly, the adhesive film is particularly suitable for a hot pressing process at temperatures above 80 ° C., preferably above 100 ° C., particularly preferably above 120 ° C.
  • the adhesive film according to the invention has a high elastic component due to the high elastomer component (rubber component). Due to this tough elastic behavior, the flexible movements of the FPCB's can be compensated particularly well, so that even high loads and peeling movements can be withstood well.
  • the adhesive film has an advantage over other heat-activated materials due to the high viscoelastic content. Holes are often drilled through the adhesive film for contacting.
  • One problem here is that existing heat-activated adhesives flow into the holes and thus interfere with the contact. With the inventive use of the adhesive films described above, this problem does not occur at all or only to a greatly reduced extent.
  • FPCBs based on polyimide FPCBs based on polyethylene naphthalate (PEN)) and polyethylene terephthalate (PET) can also be bonded. In these cases, too, the adhesive film achieves a high bond strength.
  • a mixture of 50 g nitrile rubber (Breon® 41, Zeon), 50 g epoxy resin (Rüapox TM 166, Bakelite AG), 5 g organic layered silicate (Bentone 38®, Elementis Specialties) and 3.4 g of dicyandiamide is dissolved in methyl ethyl ketone and coated from solution onto a release paper siliconized with 1.5 g / m 2 and dried at 90 ° C. for 10 minutes at this temperature.
  • the thickness of the adhesive layer was 25 ⁇ m.
  • a mixture of 60 g nitrile rubber (Breon® 41, Zeon), 40 g epoxy resin (Rüapox TM 166, Bakelite AG), 5 g organic layered silicate (Bentone 38®, Elementis Specialties) and 3 g of dicyandiamide is dissolved in methyl ethyl ketone and coated from solution onto a release paper siliconized with 1.5 g / m 2 and dried at 90 ° C. for 10 minutes at this temperature.
  • the thickness of the adhesive layer was 25 ⁇ m.
  • Two FPCB's were each bonded with the adhesive films produced according to Examples 1 to 4 and with the reference film (R) (Pyralux® LF001, DuPont).
  • the adhesive film was laminated onto the polyimide film of the FPCB laminate made of polyimide / copper film / polyimide at 100 ° C.
  • This process was then repeated with a second polyimide film from a further FPCB, and an adhesive joint was thus produced between two polyimide / copper film / polyimide laminates, the polyimide films in each case being bonded to one another.
  • the composite was pressed in a heated press from Bürkle at 170 ° C. for 30 minutes at a pressure of 50 N / cm z .
  • connections produced in this way had the structure shown in FIG. 1, (a) denoting a polyimide layer, (b) denoting a copper layer and (c) the adhesive film.
  • a composite (a-b-a) of a copper layer (b) with a polyimide layer (a) on each side represents an FPCB unit.
  • the FPCB composites (FIG.) Bonded by the process described above were completely immersed in a 288 ° C. hot solder bath for 10 seconds. The bond was rated as resistant to the solder bath if no air bubbles were formed which caused the FPCB's polyimide film to inflate. The test was assessed as failed if there was already a slight blistering.
  • the bond strength was measured in accordance with DIN EN 1465. The measured values were given in N / mm 2 .
  • Table 1 shows that with Examples 1 to 4 very high bond strengths were achieved after just 30 minutes of curing.
  • Reference example R shows lower adhesive strengths.
  • Test method B was therefore carried out with all the examples. The results are summarized in Table 2.
  • Table 2 shows that Examples 1 to 4 mixed with Bentone TM have only a very low flow behavior and can therefore withstand high loads at high temperatures.
  • test method C Another criterion for the use of adhesive films for the bonding of FPCB's is the resistance to the solder bath (test method C).
  • Table 3 lists the results of the solder bath resistance.
  • Table 4 shows that the adhesive films 1 to 4 according to the invention have a significantly higher bond strength than the reference example R.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un film adhésif contenant (i) au moins un polymère thermoplastique et/ou un élastomère thermoplastique, (ii) au moins une résine et (iii) au moins du silicate stratifié et/ou de la bétonite organiquement modifiés.
EP04705391A 2003-01-29 2004-01-27 Matiere collante thermoactivable destinee au collage de cartes de circuits imprimes flexibles Withdrawn EP1590415A1 (fr)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DE10303518 2003-01-29
DE10303518 2003-01-29
DE10317403A DE10317403A1 (de) 2003-01-29 2003-05-30 Verfahren zur Verklebung von FPCB's
DE2003124737 DE10324737A1 (de) 2003-05-30 2003-05-30 Hitze-aktivierbare Klebemass für FPCB-Verklebungen
DE10317403 2003-05-30
DE10324737 2003-05-30
PCT/EP2004/000679 WO2004067664A1 (fr) 2003-01-29 2004-01-27 Matiere collante thermoactivable destinee au collage de cartes de circuits imprimes flexibles

Publications (1)

Publication Number Publication Date
EP1590415A1 true EP1590415A1 (fr) 2005-11-02

Family

ID=32830168

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04705391A Withdrawn EP1590415A1 (fr) 2003-01-29 2004-01-27 Matiere collante thermoactivable destinee au collage de cartes de circuits imprimes flexibles

Country Status (5)

Country Link
US (1) US20060121272A1 (fr)
EP (1) EP1590415A1 (fr)
JP (1) JP2006517604A (fr)
KR (1) KR20050094048A (fr)
WO (1) WO2004067664A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10361538A1 (de) * 2003-12-23 2005-07-28 Tesa Ag Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper
DE10361537A1 (de) * 2003-12-23 2005-07-28 Tesa Ag Thermoplastische Blends zur Implantierung von elektrischen Modulen in einen Kartenkörper
DE102006055093A1 (de) * 2006-11-21 2008-06-19 Tesa Ag Hitze-aktiviert verklebbares Flächenelement
JP2009029843A (ja) * 2007-07-24 2009-02-12 Sekisui Chem Co Ltd 半導体用接着剤及び半導体用接着テープ
DE102008046871A1 (de) * 2008-09-11 2010-03-18 Tesa Se Klebemasse mit hohem Repulsionswiderstand
ES2588362T3 (es) 2012-08-23 2016-11-02 3M Innovative Properties Company Película adhesiva estructural
DE102019207550A1 (de) * 2019-05-23 2020-11-26 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder
DE102019209754A1 (de) 2019-07-03 2021-01-07 Tesa Se Thermisch härtender Klebstoff und daraus hergestelltes Klebeband

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Publication number Priority date Publication date Assignee Title
JPS52152585A (en) * 1976-06-10 1977-12-19 Katsuhiko Kanbayashi Method of producing oily resist printing material
US4465542A (en) * 1982-02-19 1984-08-14 Mitsui Petrochemical Industries, Ltd. Adhesive composition
US5026752A (en) * 1987-04-03 1991-06-25 Minnesota Mining And Manufacturing Company Amorphous-polypropylene-based hot melt adhesive
JPH01221236A (ja) * 1988-03-01 1989-09-04 Nitto Denko Corp 薄板補強用の接着性シート
EP0561048B1 (fr) * 1992-03-16 1999-05-26 Raytheon Company Adhésif pour transfert thermique
US5478885A (en) * 1994-04-15 1995-12-26 Shell Oil Company Composition of epoxy resin, epoxidized block polydiene and curing agent
KR100529640B1 (ko) * 1999-11-30 2005-11-22 오츠카 가가쿠 홀딩스 가부시키가이샤 수지 조성물 및 플렉시블 프린트 배선판
KR20020089439A (ko) * 2000-04-10 2002-11-29 헨켈 코만디트게젤샤프트 아우프 악티엔 내충격성 에폭시 수지 조성물
DE10163859A1 (de) * 2001-12-22 2003-07-10 Henkel Kgaa Mehrphasige Strukturklebstoffe

Non-Patent Citations (1)

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Title
See references of WO2004067664A1 *

Also Published As

Publication number Publication date
JP2006517604A (ja) 2006-07-27
WO2004067664A8 (fr) 2005-07-28
KR20050094048A (ko) 2005-09-26
WO2004067664A1 (fr) 2004-08-12
US20060121272A1 (en) 2006-06-08

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