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EP1586099B1 - Procede de fabrication d'un composant electronique - Google Patents

Procede de fabrication d'un composant electronique Download PDF

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Publication number
EP1586099B1
EP1586099B1 EP03815532.1A EP03815532A EP1586099B1 EP 1586099 B1 EP1586099 B1 EP 1586099B1 EP 03815532 A EP03815532 A EP 03815532A EP 1586099 B1 EP1586099 B1 EP 1586099B1
Authority
EP
European Patent Office
Prior art keywords
main body
resistance
etching
outer electrodes
measured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP03815532.1A
Other languages
German (de)
English (en)
Other versions
EP1586099A1 (fr
Inventor
Christian Hesse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP1586099A1 publication Critical patent/EP1586099A1/fr
Application granted granted Critical
Publication of EP1586099B1 publication Critical patent/EP1586099B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/2416—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by chemical etching

Definitions

  • the invention relates to a method for producing an electrical component, which has a main body and two opposing outer electrodes.
  • Electroceramic devices such as NTC thermistors are needed in large quantities with a very tight tolerance of the ohmic resistance.
  • Methods are known for producing such components, in which a large number of such components having different resistance values are produced. The lying within a given resistance tolerance components are determined by electrical measurement and then separated from the integrity of the components.
  • This method has the disadvantage that a relatively large scrap of components must be accepted.
  • NTC thermistors In order to reduce this committee, it is also known to produce NTC thermistors by the components are adjusted to a desired resistance by mechanical removal of parts of the ceramic body and possibly also the outer electrodes.
  • this method has the disadvantage that it is not possible or only with great effort in very small designs, for example in the design 0402 with dimensions of 1 mm x 0.5 mm x 0.5 mm.
  • the method described has the advantage that, dispensing with mechanical processing methods, for example, waiving loops, rasps or planing a simple and easy to implement equipment with little effort to produce the device is provided with a predetermined target value for the electrical resistance.
  • the said method also has the advantage that it is particularly suitable for the production of components with a very small volume, where a mechanical processing of the body would require a very high time and equipment expense.
  • the main body produced in process step a) have an actual resistance which is below the nominal resistance. Only in this case it is possible to achieve an adaptation of the actual resistance to the nominal resistance by etching away parts of the basic body.
  • a base body containing a ceramic material is used. This has the advantage that the required in a variety of applications electroceramic devices, surface mount NTC thermistors or similar devices can be easily and inexpensively manufactured.
  • nickel-manganese spinels of the formula Ni III 1-z [Mn III 2 Mn II z ] O 4 may be used as material for NTC thermistors, where 0 ⁇ z ⁇ 0.4.
  • This embodiment of the method has the advantage that it allows the processing or adjustment of the resistance value for very small components, where mechanical processing would be possible only with great effort.
  • the method can be carried out particularly advantageously by immersing the base body in a liquid which corroses the material of the base body.
  • This approach has the advantage that the removal of the material of the body is substantially uniform, so that massive damage to one or a few specific locations can be avoided.
  • the procedure described has the further advantage that several bodies can be treated simultaneously in a single process step.
  • sulfuric acid can be used as corrosive liquid.
  • the etching can also be carried out by dry etching.
  • the actual value of the resistance can be measured before step b).
  • This approach has the advantage that a control mechanism for the Weglegien can be provided. It is possible to draw conclusions about the etching process from the deviation between the desired value and the actual value of the resistance.
  • a duration for the etching process for example in a corrosive liquid, by determining the difference between the desired value of the resistor and the actual value of the resistor.
  • relationships between the etching time and the resistance increase thereby achieved for a type of component are measured by experiments.
  • a predetermined etching time can be determined on the basis of the measurement of the actual resistance and the resulting difference from the nominal resistance.
  • the resistance of the component will then be with sufficient accuracy in the vicinity of the desired value.
  • Measuring the resistance before initiating step b) of the method may be advantageous for determining whether an approximation of the resistance can occur at all with the aid of the etching. This would not be the case, for example, if such large tolerances occur in the manufacture of the base body that the resistance of the component is greater than the desired value already during production. By etching the body could be done in this case, no further adjustment to the target value, since by etching the body of the resistance can only be increased, but not lowered.
  • FIG. 1 shows an NTC thermistor with a base body 1, which consists of the ceramic material NiMn spinel or other similarly suitable material. On opposite side surfaces of the main body 1 external contacts 21, 22 are mounted. By etching away parts of the main body 1, the current path between the external contacts 21, 22 can be narrowed, as shown by the dashed lines. As a result, the resistance of the component increases. It is thus possible to increase the resistance of the device by etching of the base body 1 so that a desired resistance is achieved with sufficient accuracy.
  • the device off FIG. 1 corresponds to the design 0603, which means that the component has the following dimensions: 1.6 mm x 0.8 mm x 0.8 mm.
  • the height of the main body 1 is 0.8 mm.
  • the length, the depth, the width or the diameter of a component come into consideration. It's special advantageous for the method described here to use components whose smallest dimension is smaller than 3 mm.
  • the external contacts (21, 22) consist of a material which is not attacked by the etching solution or significantly less than the ceramic material is attacked, so that the solderability remains.
  • a 3-layer metallization with an Ag / Ni / Sn layer sequence or with a silver / palladium metallization.
  • FIG. 2 shows such a calibration curve for a device of the type 0603 with a resistance R25, measured at 25 ° C, of 6000 ⁇ . It is in FIG. 2 the resistance R25, measured in ⁇ , plotted over the etching time t, measured in minutes. As the etching solution, a 10% sulfuric acid was used. FIG. 2 shows measuring points at the measuring times 0, 1, 5 and 10 minutes. It can be clearly seen that the resistance R25 increases with increasing etching time.
  • the present invention is not limited to NTC thermistors, but can be applied to any electrical device whose resistance depends on the geometric dimensions of its body.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermistors And Varistors (AREA)

Claims (9)

  1. Procédé de fabrication d'un composant électrique, comportant les étapes suivantes:
    a) formation d'un corps de base (1) avec deux électrodes extérieures opposées,
    b) égalisation de la résistance du corps de base (1) à mesurer entre les électrodes extérieures à une valeur de consigne prédéterminée par attaque chimique de parties du corps de base (1),
    caractérisé en ce que les électrodes extérieures se composent d'une matière, qui est nettement moins atteinte par l'attaque chimique que le matériau céramique du corps de base (1), de sorte que son aptitude au brasage soit préservée.
  2. Procédé selon la revendication 1, dans lequel on utilise un corps de base (1), qui contient un matériau céramique.
  3. Procédé selon une des revendications 1 ou 2, dans lequel on utilise un corps de base (1), dont la résistance ohmique présente un coefficient de température négatif.
  4. Procédé selon l'une quelconque des revendications 1 à 3, dans lequel on utilise un corps de base (1), dont la plus petite dimension (d) est inférieure à 3 mm.
  5. Procédé selon l'une quelconque des revendications 1 à 4, dans lequel on effectue l'attaque en immergeant le corps de base (1) dans un liquide attaquant le matériau du corps de base (1).
  6. Procédé selon la revendication 5, dans lequel on utilise l'acide sulfurique comme liquide d'attaque.
  7. Procédé selon l'une quelconque des revendications 1 à 6, dans lequel on mesure avant l'étape b) la valeur réelle de la résistance du corps de base (1).
  8. Procédé selon la revendication 7, dans lequel on mesure la résistance (R25) du corps de base (1) pendant l'attaque.
  9. Procédé selon l'une quelconque des revendications 1 à 8,
    - dans lequel on détermine avant l'étape b) la différence entre la valeur de consigne et la valeur réelle de la résistance (R25) et on détermine à partir de celle-ci une durée (t) pour l'opération d'attaque, et
    - dans lequel on réalise l'attaque à l'étape b) avec la durée (t) ainsi déterminée.
EP03815532.1A 2003-01-24 2003-12-23 Procede de fabrication d'un composant electronique Expired - Lifetime EP1586099B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10302800 2003-01-24
DE10302800A DE10302800A1 (de) 2003-01-24 2003-01-24 Verfahren zur Herstellung eines Bauelements
PCT/DE2003/004289 WO2004068508A1 (fr) 2003-01-24 2003-12-23 Procede de fabrication d'un composant electronique

Publications (2)

Publication Number Publication Date
EP1586099A1 EP1586099A1 (fr) 2005-10-19
EP1586099B1 true EP1586099B1 (fr) 2016-02-24

Family

ID=32694955

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03815532.1A Expired - Lifetime EP1586099B1 (fr) 2003-01-24 2003-12-23 Procede de fabrication d'un composant electronique

Country Status (5)

Country Link
US (1) US7887713B2 (fr)
EP (1) EP1586099B1 (fr)
CN (1) CN1742348A (fr)
DE (1) DE10302800A1 (fr)
WO (1) WO2004068508A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020081630A2 (fr) 2018-10-17 2020-04-23 Petoi, Llc Puzzle d'animal robotique
US12021038B2 (en) 2021-06-11 2024-06-25 Macom Technology Solutions Holdings, Inc. Solderable and wire bondable part marking

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6337552B1 (en) 1999-01-20 2002-01-08 Sony Corporation Robot apparatus
SE354143B (fr) 1972-02-15 1973-02-26 Ericsson Telefon Ab L M
US3839110A (en) * 1973-02-20 1974-10-01 Bell Telephone Labor Inc Chemical etchant for palladium
DE2908361C2 (de) 1979-03-03 1985-05-15 Dynamit Nobel Ag, 5210 Troisdorf Verfahren zum Erhöhen des Widerstandes elektrischen Zündelementen
DD241326A1 (de) * 1985-09-25 1986-12-03 Hermsdorf Keramik Veb Verfahren zum abgleich des ohmschen widerstandes von duennfilmfunktionsschichten
DD257895A1 (de) * 1987-02-27 1988-06-29 Elektronische Bauelemente Veb Verfahren zum definierten elektrolytischen abgleichaetzen von widerstandselementen auf der basis von cuni-legierungen (folien)
DE3708832A1 (de) * 1987-03-18 1988-09-29 Siemens Ag Nasschemische strukturierung von hafniumborid-schichten
DE3813627C2 (de) * 1988-04-22 1997-03-27 Bosch Gmbh Robert Verfahren zum Funktionsabgleich einer elektronischen Schaltung
JP3039224B2 (ja) 1993-09-29 2000-05-08 松下電器産業株式会社 バリスタの製造方法
JP3226014B2 (ja) 1996-02-27 2001-11-05 三菱マテリアル株式会社 チップ型サーミスタの製造方法
DE19640127A1 (de) * 1996-09-28 1998-04-02 Dynamit Nobel Ag Verfahren zum Abgleich von Schichtwiderständen mit einer Excimer-Laserstrahlung
GB9623945D0 (en) * 1996-11-15 1997-01-08 Geco Prakla Uk Ltd Detection of ground roll cone
JPH10199707A (ja) 1997-01-13 1998-07-31 Chichibu Onoda Cement Corp チップ型サーミスタの製造方法
JP3532926B2 (ja) 1997-06-16 2004-05-31 松下電器産業株式会社 抵抗配線基板およびその製造方法
US6172592B1 (en) * 1997-10-24 2001-01-09 Murata Manufacturing Co., Ltd. Thermistor with comb-shaped electrodes
DE19800196C2 (de) * 1998-01-07 1999-10-28 Guenter Nimtz Verfahren zur Herstellung von Flächenwiderstandsschichten
JP3624395B2 (ja) * 1999-02-15 2005-03-02 株式会社村田製作所 チップ型サーミスタの製造方法
TW487742B (en) * 1999-05-10 2002-05-21 Matsushita Electric Industrial Co Ltd Electrode for PTC thermistor, manufacture thereof, and PTC thermistor
CN1093159C (zh) 1999-05-24 2002-10-23 中国科学院新疆物理研究所 室温固相反应制备负温度系数热敏粉料的方法
KR100674692B1 (ko) * 1999-06-03 2007-01-26 마쯔시다덴기산교 가부시키가이샤 박막서미스터소자 및 박막서미스터소자의 제조방법
JP4557386B2 (ja) * 2000-07-10 2010-10-06 キヤノン株式会社 記録ヘッド用基板の製造方法
US6475400B2 (en) * 2001-02-26 2002-11-05 Trw Inc. Method for controlling the sheet resistance of thin film resistors
US7218506B2 (en) * 2004-03-31 2007-05-15 Tdk Corporation Electrolytic capacitor and method of manufacturing the same

Also Published As

Publication number Publication date
DE10302800A1 (de) 2004-08-12
CN1742348A (zh) 2006-03-01
EP1586099A1 (fr) 2005-10-19
WO2004068508A1 (fr) 2004-08-12
US20060131274A1 (en) 2006-06-22
US7887713B2 (en) 2011-02-15

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