EP1573090A2 - Method for the deposition of an alloy on a substrate - Google Patents
Method for the deposition of an alloy on a substrateInfo
- Publication number
- EP1573090A2 EP1573090A2 EP03813080A EP03813080A EP1573090A2 EP 1573090 A2 EP1573090 A2 EP 1573090A2 EP 03813080 A EP03813080 A EP 03813080A EP 03813080 A EP03813080 A EP 03813080A EP 1573090 A2 EP1573090 A2 EP 1573090A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- current
- alloy
- pulse
- substrate
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 35
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 21
- 239000000956 alloy Substances 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 title claims abstract description 19
- 230000008021 deposition Effects 0.000 title claims description 15
- 238000004070 electrodeposition Methods 0.000 claims abstract description 5
- 238000000151 deposition Methods 0.000 claims description 17
- 239000003792 electrolyte Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000002123 temporal effect Effects 0.000 claims 1
- 238000000576 coating method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002506 iron compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910000601 superalloy Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
Definitions
- the invention relates to a method for depositing an alloy on a substrate.
- DE 39 43 669 C2 discloses a method and a device for electrolytic surface treatment, in which the mass parts used for coating are mixed by oscillating movement and / or rotating movement, so that a uniform electrolytic layer is deposited.
- DE 196 53 681 C2 discloses a method for electrolytic deposition from a pure copper layer, in which a pulse current or pulse voltage method is used.
- the object is achieved by a method for depositing an alloy on a substrate according to claim 1.
- pulsed currents or the generation of graded layers improves the adhesion of layers to the substrate or the deposition rate.
- Figure 1 shows an apparatus for performing the method according to the invention
- Figure 2 shows a sequence of a current / voltage pulse, which is used for a method according to the invention.
- FIG. 1 shows a device 1 for carrying out the method according to the invention.
- An electrolyte 7, an electrode 10 and a substrate 13 to be coated are arranged in a container 4.
- the substrate 13 to be coated is, for example, a combustion chamber lining, a housing part or a
- Turbine blade made of a nickel, cobalt or iron based super alloy of a gas or steam turbine, the but can also have a layer on the substrate (MCrAlY).
- the substrate 13 and the electrode 10 are electrically conductively connected to a current / voltage source 16 via electrical leads 19.
- the current / voltage source 16 generates pulsed electrical currents / voltages (FIG. 2).
- the electrolyte 7 contains a first one
- Component 28 and a second component 31 one
- the components 28, 31 are deposited on the substrate 13 by a suitable choice of the process parameters (FIG. 2).
- gradients in the chemical composition can be generated in the layer to be produced by suitable selection of the process parameters.
- an alloy MCrAlY is deposited on the substrate 13, where M stands for at least one element from the group iron, cobalt or nickel.
- the alloy elements Cr, Al, Y and optionally further elements are introduced either by adding suitable soluble salts to the electrolyte or by suspending fine-grained, insoluble powders in the electroplating bath, which are solid
- Separate particles For example. At least two components are dissolved in the electrolyte 7, for example in the form of salts.
- the layer can be homogenized or compressed by a subsequent thermal process or certain phases can be set in the layer.
- the oscillation frequency is, for example, above 1 kHz.
- the current / voltage level, the pulse duration and the pulse pause are defined for at least one, in particular for each component 28, 31 of the alloy.
- FIG. 2 shows an exemplary sequence of
- a sequence 34 consists of at least two blocks 37. In FIG. 2 there are four blocks 37. However, three, five or more blocks 37 can also be used.
- Each block 37 consists of at least one current pulse 40.
- a current pulse 40 is characterized by its duration t on , the height I mx and its shape (rectangle, triangle, ).
- the pauses between the individual current pulses 40 (t off ) and the pauses between the blocks 37 are equally important as process parameters.
- the sequences can also change over time.
- the sequence 34 consists, for example, of a first block 37 with three current pulses 40, between which there is again a pause. This is followed by a second block 37, which has a greater or lesser current level since it is matched to another component 28, 31, and consists of six current pulses 40. After a further pause, four current pulses 40 follow in the opposite direction, i.e. with changed polarity to achieve a correction of the alloy composition, the hydrogen desorption or an activation.
- Each block 37 can thus have a different number of current pulses 40, pulse durations t on or pulse pauses t Qff . At the end of sequence 34 there follows another block 37 with four current pulses.
- the sequence can be repeated several times.
- the individual pulse times t on are preferably on the order of approximately 1 to 100 milliseconds.
- the time duration of block 37 is of the order of up to 10 seconds, so that up to 5000 pulses are transmitted in a block 37.
- a block 37 is matched with its parameters to a component 28, 31 of the alloy in order to achieve the best deposition of this component 28, 31. These can be determined in individual experiments.
- An optimized block 37 leads to an optimized deposition of the component optimized to this block 37, i.e. the duration and the type of deposition is improved.
- the other components are also still separated. This optimization can be carried out for at least one further, for example all, constituent parts 31 of the alloy. The optimized composition of the components 28, 31 is thus achieved.
- a sequence 34 can also be changed if e.g. the deposition rate of a component 28, 31 changes over time due to the layer already deposited.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Verfahren zum Abscheiden einer Legierung auf ein Substrat Process for depositing an alloy on a substrate
Die Erfindung betrifft ein Verfahren zum Abscheiden einer Legierung auf ein Substrat.The invention relates to a method for depositing an alloy on a substrate.
Es sind verschiedene Verfahren bekannt, um Schichten auf einem Substrat aufzubringen. Dies sind z.B. Plasmaspritzen, galvanische Abscheidung oder Aufdampf erfahren, u.a..Various methods are known for applying layers on a substrate. These are e.g. Experience plasma spraying, galvanic deposition or vapor deposition, etc.
Ein Artikel von G. Devaray im Bulletin of Electrochemistry 8 (8), 1992, pp. 390-392 mit dem Titel „Electro deposited composites- a review on new technologies for aerospace and other field" gibt eine Übersicht über Verfahren zur elektrochemischen Abscheidung von Schichten.An article by G. Devaray in Bulletin of Electrochemistry 8 (8), 1992, pp. 390-392 with the title "Electro deposited composites - a review on new technologies for aerospace and other field" gives an overview of processes for the electrochemical deposition of layers.
Die DE 101 13 767 AI offenbart ein elektrolytisches Plattierungsverfahren.DE 101 13 767 AI discloses an electrolytic plating process.
Die DE 39 43 669 C2 offenbart ein Verfahren und eine Vorrichtung zur elektrolytischen Oberflächenbehandlung, bei dem eine Durchmischung der verwendeten Massenteile zur Beschichtung durch Schwingungsbewegung und/oder Drehbewegung erfolgt, damit eine gleichmäßige elektrolytische Schicht abgeschieden wird.DE 39 43 669 C2 discloses a method and a device for electrolytic surface treatment, in which the mass parts used for coating are mixed by oscillating movement and / or rotating movement, so that a uniform electrolytic layer is deposited.
Weitere elektrolytische Verfahren zur Beschichtung sind bekannt aus der GB 2 167 446 A, der EP 443 877 AI sowie aus dem Artikel von J. Zahavi et al in Plating and Surface Finishing, Jan. 1982, S. 76 ff. „Properties of electrodeposited composite coatings" bei denen ungelöste Teilchen im Elektrolyten verwendet werden, um diese in der Schicht mitabzuscheiden.Further electrolytic processes for coating are known from GB 2 167 446 A, EP 443 877 AI and from the article by J. Zahavi et al in Plating and Surface Finishing, Jan. 1982, p. 76 ff. “Properties of electrodeposited composite coatings "in which undissolved particles are used in the electrolyte in order to separate them in the layer.
In Electrochemical Society Proceedings Vol. 95-18, S. 543 ff. von Sarhadi et al. mit dem Titel „Development of a low current density electroplating bath ..." ist die Verwendung von Bädern beschrieben, die Kobalt-, Nickel- oder Eisenverbindungen enthalten.In Electrochemical Society Proceedings Vol. 95-18, pp. 543 ff. By Sarhadi et al. with the title “Development of a low current density electroplating bath ... "describes the use of baths containing cobalt, nickel or iron compounds.
Die US-PS 6,375,823 Bl beschreibt eine elektrolytischeThe US-PS 6,375,823 Bl describes an electrolytic
Beschichtungsmethode, bei der eine Ultraschallsonde verwendet wird.Coating method using an ultrasonic probe.
Die DE 195 45 231 AI beschreibt ein Verfahren zur elektrolytischen Abscheidung von Metallschichten, bei dem ein Pulsstrom- oder Pulsspannungsverfahren verwendet wird. Dies wird jedoch nur angewendet, um Alterungserscheinungen von Abscheidebädern zu verringern.DE 195 45 231 AI describes a method for the electrolytic deposition of metal layers, in which a pulse current or pulse voltage method is used. However, this is only used to reduce the signs of aging in the deposition baths.
Die US 2001/00 54 559 AI offenbart ein elektrolytischesThe US 2001/00 54 559 AI discloses an electrolytic
Beschichtungsverfahren, bei dem gepulste Ströme verwendet werden, um die unerwünschte Entwicklung von Wasserstoff während elektrolytischer Beschichtungen von Metallen zu verhindern.Coating process using pulsed currents to prevent the undesirable evolution of hydrogen during electrolytic coating of metals.
Die DE 196 53 681 C2 offenbart ein Verfahren zur elektrolytischen Abscheidung von einer reinen Kupferschicht, bei der ein Pulsstrom- oder Pulsspannungsverfahren verwendet wird.DE 196 53 681 C2 discloses a method for electrolytic deposition from a pure copper layer, in which a pulse current or pulse voltage method is used.
Die DE 100 61 186 Cl beschreibt ein Verfahren zur galvanischen Abscheidung, bei dem periodische Strompulse verwendet werden.DE 100 61 186 Cl describes a method for galvanic deposition in which periodic current pulses are used.
V. Sova beschreibt in dem Artikel „Electrodeposited composite coatings for protection from high te perature corrosion" in Trans IMF 1987, 65, 21ff ein elektrolytisches Abscheidungsverfahren, bei dem im Elektrolyten ungelöste Partikel für die aufzubringende Schicht verwendet werden. Ebenso ist die Anwendung von Pulsströmen beschrieben. Mit den bekannten Verfahren aufgebrachte Schichten weisen unter den Bedingungen mancher Einsatzzwecke eine schlechte Haftung gegenüber dem Substrat auf. Ausserdem können nur Materialien einer konstanten Zusammensetzung abgeschieden werden.In the article "Electrodeposited composite coatings for protection from high te perature corrosion" in Trans IMF 1987, 65, 21ff, V. Sova describes an electrolytic deposition process in which undissolved particles in the electrolyte are used for the layer to be applied. The use of pulse currents is also the case described. Layers applied with the known methods have poor adhesion to the substrate under the conditions of some applications. In addition, only materials with a constant composition can be deposited.
Es ist daher Aufgabe der Erfindung, die obengenannten Probleme zu überwinden.It is therefore an object of the invention to overcome the problems mentioned above.
Die Aufgabe wird gelöst durch ein Verfahren zum Abscheiden einer Legierung auf ein Substrat gemäß Anspruch 1.The object is achieved by a method for depositing an alloy on a substrate according to claim 1.
Durch die Verwendung von gepulsten Strömen bzw. die Erzeugung von gradierten Schichten wird die Haftung von Schichten auf dem Substrat bzw. die Abscheidungsrate verbessert.The use of pulsed currents or the generation of graded layers improves the adhesion of layers to the substrate or the deposition rate.
Weitere vorteilhafte Ausgestaltungen des Verfahrens sind in den Ansprüchen aufgelistet.Further advantageous refinements of the method are listed in the claims.
Ein Ausführungsbeispiel der Erfindung ist in den Figuren näher erläutert.An embodiment of the invention is explained in more detail in the figures.
Es zeigen:Show it:
Figur 1 eine Vorrichtung, um das erfindungsgemäße Verfahren durchzuführen, undFigure 1 shows an apparatus for performing the method according to the invention, and
Figur 2 eine Sequenz eines Strom/Spannungspulses, die für ein erfindungsgemässes Verfahren verwendet wird.Figure 2 shows a sequence of a current / voltage pulse, which is used for a method according to the invention.
Figur 1 zeigt eine Vorrichtung 1 um das erfindungsgemäße Verfahren durchzuführen.FIG. 1 shows a device 1 for carrying out the method according to the invention.
In einem Behälter 4 sind angeordnet ein Elektrolyt 7, eine Elektrode 10 und ein zu beschichtendes Substrat 13. Das zu beschichtende Substrat 13 ist beispielsweise eine Brennkammerauskleidung, ein Gehäuseteil oder eineAn electrolyte 7, an electrode 10 and a substrate 13 to be coated are arranged in a container 4. The substrate 13 to be coated is, for example, a combustion chamber lining, a housing part or a
Turbinenschaufel aus einer Nickel-, Kobalt- oder Eisenbasierten Superlegierung einer Gas- oder Dampfturbine, die aber auch schon eine Schicht auf dem Substrat (MCrAlY) aufweisen kann.Turbine blade made of a nickel, cobalt or iron based super alloy of a gas or steam turbine, the but can also have a layer on the substrate (MCrAlY).
Das Substrat 13 und die Elektrode 10 sind über elektrische Zuleitungen 19 mit einer Strom/Spannungsquelle 16 elektrisch leitend verbunden. Die Strom/Spannungsquelle 16 erzeugt gepulste elektrische Ströme/Spannungen (Fig. 2) .The substrate 13 and the electrode 10 are electrically conductively connected to a current / voltage source 16 via electrical leads 19. The current / voltage source 16 generates pulsed electrical currents / voltages (FIG. 2).
In dem Elektrolyten 7 sind die einzelnen Bestandteile einer Legierung enthalten, die auf das Substrat 13 abgeschieden werden sollen. So enthält der Elektrolyt 7 bspw. einen erstenThe individual constituents of an alloy which are to be deposited on the substrate 13 are contained in the electrolyte 7. For example, the electrolyte 7 contains a first one
Bestandteil 28 und einen zweiten Bestandteil 31 einerComponent 28 and a second component 31 one
Legierung.Alloy.
Durch geeignete Wahl der Prozessparameter (Fig. 2) werden die Bestandteile 28, 31 auf dem Substrat 13 abgeschieden.The components 28, 31 are deposited on the substrate 13 by a suitable choice of the process parameters (FIG. 2).
Ebenso können in der herzustellenden Schicht durch geeignete Wahl der Prozessparameter Gradienten in der chemischen Zusammensetzung erzeugt werden. Beispielsweise wird auf das Substrat 13 eine Legierung MCrAlY abgeschieden, wobei M für zumindest ein Element der Gruppe Eisen, Kobalt oder Nickel steht. Die Einbringung der Legierungselemente Cr, AI, Y und optional weitere Elemente erfolgt entweder durch Zugabe geeigneter löslicher Salze zum Elektrolyten oder durch Suspendierung von feinkörnigen, unlöslichen Pulvern im galvanischen Bad, die sich als festeLikewise, gradients in the chemical composition can be generated in the layer to be produced by suitable selection of the process parameters. For example, an alloy MCrAlY is deposited on the substrate 13, where M stands for at least one element from the group iron, cobalt or nickel. The alloy elements Cr, Al, Y and optionally further elements are introduced either by adding suitable soluble salts to the electrolyte or by suspending fine-grained, insoluble powders in the electroplating bath, which are solid
Partikel abscheiden. Bspw. mindestens zwei Bestandteile sind bspw. in Form von Salzen im Elektrolyt 7 gelöst. Durch einen nachfolgenden thermischen Prozess kann die Schicht homogenisiert oder verdichtet werden oder bestimmte Phasen können in der Schicht eingestellt werden.Separate particles. For example. At least two components are dissolved in the electrolyte 7, for example in the form of salts. The layer can be homogenized or compressed by a subsequent thermal process or certain phases can be set in the layer.
Eine Ultraschallsonde 22, die im Elektrolyten 7 angeordnet sein kann und durch einen Ultraschallgeber 25 gesteuert wird, verbessert die Hydrodynamik und die Durchmischung der Bestandteile 28, 31 im Bereich des Substrats 13 und beschleunigt den Abscheidungsprozess . Die Schwingungsfrequenz liegt bspw. oberhalb 1 kHz. Für zumindest einen, insbesondere für jeden Bestandteil 28, 31 der Legierung wird die Strom/ Spannungshöhe, die Pulsdauer und die Pulspause festgelegt.An ultrasound probe 22, which can be arranged in the electrolyte 7 and is controlled by an ultrasound transmitter 25, improves the hydrodynamics and the mixing of the components 28, 31 in the region of the substrate 13 and accelerates the deposition process. The oscillation frequency is, for example, above 1 kHz. The current / voltage level, the pulse duration and the pulse pause are defined for at least one, in particular for each component 28, 31 of the alloy.
Figur 2 zeigt eine beispielhafte Aneinanderreihung vonFIG. 2 shows an exemplary sequence of
Strompulsen (40) , die sich wiederholen.Current pulses (40) that are repeated.
Eine Sequenz 34 besteht aus zumindest zwei Blöcken 37. In Figur 2 sind es vier Blöcke 37. Es können aber auch drei, fünf oder mehr Blöcke 37 sein.A sequence 34 consists of at least two blocks 37. In FIG. 2 there are four blocks 37. However, three, five or more blocks 37 can also be used.
Jeder Block 37 besteht aus zumindest einem Strompuls 40. In Figur 2 sind es drei, vier oder sechs Strompulse 40. Es können aber auch zwei, fünf oder mehr als sechs Strompulse 40 pro Block 37 verwendet werden.Each block 37 consists of at least one current pulse 40. In FIG. 2 there are three, four or six current pulses 40. However, two, five or more than six current pulses 40 can also be used per block 37.
Ein Strompuls 40 ist charakterisiert durch seine Dauer ton, die Höhe Imx und seine Form (Rechteck, Dreieck, ... ) . Ebenso wichtig als Prozessparameter sind die Pausen zwischen den einzelnen Strompulsen 40 (toff) und die Pausen zwischen den Blöcken 37.A current pulse 40 is characterized by its duration t on , the height I mx and its shape (rectangle, triangle, ...). The pauses between the individual current pulses 40 (t off ) and the pauses between the blocks 37 are equally important as process parameters.
Die Sequenzen können sich ebenfalls mit der Zeit ändern.The sequences can also change over time.
Die Sequenz 34 besteht bspw. aus einem ersten Block 37 mit drei Strompulsen 40, zwischen denen wiederum eine Pause stattfindet. Darauf folgt ein zweiter Block 37, der eine größere oder kleinere Stromhöhe aufweist, da er auf einen anderen Bestandteil 28, 31 abgestimmt ist, und besteht aus sechs Strompulsen 40. Nach einer weiteren Pause folgen vier Strompulse 40 in umgekehrter Richtung, d.h. mit geänderter Polarität, um eine Korrektur der Legierungszusammensetzung, der Wasserstoff-Desorption oder eine Aktivierung zu erreichen.The sequence 34 consists, for example, of a first block 37 with three current pulses 40, between which there is again a pause. This is followed by a second block 37, which has a greater or lesser current level since it is matched to another component 28, 31, and consists of six current pulses 40. After a further pause, four current pulses 40 follow in the opposite direction, i.e. with changed polarity to achieve a correction of the alloy composition, the hydrogen desorption or an activation.
Jeder Block 37 kann also eine verschiedene Anzahl von Strompulsen 40, Pulsdauern ton oder Pulspausen tQff aufweisen. Als Abschluss der Sequenz 34 folgt ein weiterer Block 37 mit vier Strompulsen.Each block 37 can thus have a different number of current pulses 40, pulse durations t on or pulse pauses t Qff . At the end of sequence 34 there follows another block 37 with four current pulses.
Die Sequenz kann mehrfach wiederholt werden.The sequence can be repeated several times.
Die Einzelpulszeiten ton betragen vorzugsweise größenordnungsmäßig etwa 1 bis 100 Millisekunden. Die zeitliche Dauer des Blocks 37 liegt in der Größenordnung bis zu 10 Sekunden, so dass bis zu 5000 Pulse in einem Block 37 ausgesendet werden.The individual pulse times t on are preferably on the order of approximately 1 to 100 milliseconds. The time duration of block 37 is of the order of up to 10 seconds, so that up to 5000 pulses are transmitted in a block 37.
Die Belegung sowohl während der Pulsabfolgen als auch in der Pausenzeit mit einem geringen Potential (Basisstrom) ist optional möglich. Somit wird eine Unterbrechung der Elektroabscheidung, die Inhomogenitäten verursachen kann, vermieden.It is optionally possible to assign a low potential (base current) both during the pulse sequences and during the pause time. An interruption of the electrodeposition, which can cause inhomogeneities, is thus avoided.
Ein Block 37 ist mit seinen Parametern auf ein Bestandteil 28, 31 der Legierung abgestimmt, um die beste Abscheidung dieses Bestandteils 28, 31 zu erreichen. Diese können in Einzelversuchen bestimmt werden. Ein optimierter Block 37 führt zu einer optimierten Abscheidung des auf diesen Block 37 optimierten Bestandteils, d.h. die Zeitdauer und die Art der Abscheidung wird verbessert. Die anderen Bestanteile werden ebenfalls noch abgeschieden. Diese Optimierung kann für zumindest einen weiteren, bspw. alle, Bestandteile 31 der Legierung durchgeführt werden. Somit wird die optimierte Zusammensetzung der Bestandteile 28, 31 erreicht.A block 37 is matched with its parameters to a component 28, 31 of the alloy in order to achieve the best deposition of this component 28, 31. These can be determined in individual experiments. An optimized block 37 leads to an optimized deposition of the component optimized to this block 37, i.e. the duration and the type of deposition is improved. The other components are also still separated. This optimization can be carried out for at least one further, for example all, constituent parts 31 of the alloy. The optimized composition of the components 28, 31 is thus achieved.
Beispielsweise durch die Dauer der einzelnen Blöcke 37 kann der Anteil der Bestandteile 28, 31 in der aufzubringendenFor example, by the duration of the individual blocks 37, the proportion of the components 28, 31 in the to be applied
Schicht festgelegt werden.Layer.
Gradienten können ebenso in der Schicht zu erzeugt werden.Gradients can also be created in the layer.
Dies geschieht dadurch, dass die Dauer des Blocks 37, die Strom/Spannungshöhe oder die Anzahl der Pulse 40 pro Block, der auf einen Bestandteil 28, 31 optimal abgestimmt ist, entsprechend verlängert oder verkürzt wird (d.h. die Sequenz 34 wird verändert) .This happens because the duration of the block 37, the current / voltage level or the number of pulses 40 per block, which is optimally matched to a component 28, 31, is extended or shortened accordingly (ie sequence 34 is changed).
Eine Sequenz 34 kann auch verändert werden, wenn sich z.B. die Abscheidungsrate eines Bestandteils 28, 31 mit der Zeit aufgrund der schon abgeschiedenen Schicht verändert.A sequence 34 can also be changed if e.g. the deposition rate of a component 28, 31 changes over time due to the layer already deposited.
Ebenso können weitere Nichtlegierungsbestandteile, wie z.B. Sekundärphasen, in dem Elektrolyten 7 enthalten sein und abgeschieden werden. Other non-alloy components, e.g. Secondary phases in which electrolytes 7 are contained and deposited.
Claims
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10259362 | 2002-12-18 | ||
| DE10259362A DE10259362A1 (en) | 2002-12-18 | 2002-12-18 | Process for depositing an alloy on a substrate |
| PCT/DE2003/004155 WO2004055245A2 (en) | 2002-12-18 | 2003-12-16 | Method for the deposition of an alloy on a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1573090A2 true EP1573090A2 (en) | 2005-09-14 |
Family
ID=32477771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP03813080A Withdrawn EP1573090A2 (en) | 2002-12-18 | 2003-12-16 | Method for the deposition of an alloy on a substrate |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20060131175A1 (en) |
| EP (1) | EP1573090A2 (en) |
| CN (1) | CN1729314A (en) |
| DE (1) | DE10259362A1 (en) |
| WO (1) | WO2004055245A2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060207884A1 (en) * | 2005-03-17 | 2006-09-21 | Volodymyr Shpakovsky | Method of producing corundum layer on metal parts |
| US8143550B2 (en) * | 2005-06-21 | 2012-03-27 | International Advanced Research Centre For Powder Metallurgy And New Materials (Arci) | Device for controlling the on and off time of the metal oxide semiconductor field effect transistor (MOSFET), a device spark coating the surfaces of metal workpiece incorporating the said control device and a method of coating metal surfaces using the said device |
| US20080271995A1 (en) * | 2007-05-03 | 2008-11-06 | Sergey Savastiouk | Agitation of electrolytic solution in electrodeposition |
| US10030312B2 (en) * | 2009-10-14 | 2018-07-24 | Massachusetts Institute Of Technology | Electrodeposited alloys and methods of making same using power pulses |
| CN102776512B (en) * | 2012-08-10 | 2014-07-23 | 苏州市涵信塑业有限公司 | Method for preparing novel gradient thermal barrier coating |
| CN104862748B (en) * | 2015-05-29 | 2017-06-13 | 中国科学院金属研究所 | A kind of crystal particle scale graded metal nickel and its controllable method for preparing |
| CA3069652A1 (en) * | 2016-07-13 | 2018-01-18 | Alligant Scientific, LLC | Electrochemical methods, devices and compositions |
| US20180322972A1 (en) * | 2017-05-04 | 2018-11-08 | General Electric Company | System and method for making a solid target within a production chamber of a target assembly |
| CN107254697B (en) * | 2017-06-06 | 2020-02-14 | 秦皇岛瀚丰长白结晶器有限责任公司 | Gradient distribution process and electroplating device for nickel-cobalt alloy plating cobalt of crystallizer copper plate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4869971A (en) * | 1986-05-22 | 1989-09-26 | Nee Chin Cheng | Multilayer pulsed-current electrodeposition process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2261782C3 (en) * | 1972-12-16 | 1978-09-14 | Battelle-Institut E.V., 6000 Frankfurt | Electroplating of a chromium-nickel-iron alloy |
| US4461680A (en) * | 1983-12-30 | 1984-07-24 | The United States Of America As Represented By The Secretary Of Commerce | Process and bath for electroplating nickel-chromium alloys |
| GB2167446B (en) * | 1984-10-05 | 1988-05-05 | Baj Ltd | Electrode deposited composite coating |
| IL76592A (en) * | 1985-10-06 | 1989-03-31 | Technion Res & Dev Foundation | Method for electrodeposition of at least two metals from a single solution |
| JPH0230790A (en) * | 1988-07-15 | 1990-02-01 | Seiko Instr Inc | Method for electrodepositing alloy |
| DE3943669C2 (en) * | 1989-02-20 | 1993-08-19 | Hans 8500 Nuernberg De Henig | Vibration device on electrolytic treatment appts. |
| GB2241506A (en) * | 1990-02-23 | 1991-09-04 | Baj Ltd | Method of producing a gas turbine blade having an abrasive tip by electrodepo- sition. |
| EP0448888A1 (en) * | 1990-03-27 | 1991-10-02 | Ets Michel S.A. | Process for galvanic treatment with pulsed currents |
| DK172937B1 (en) * | 1995-06-21 | 1999-10-11 | Peter Torben Tang | Galvanic process for forming coatings of nickel, cobalt, nickel alloys or cobalt alloys |
| DE19545231A1 (en) * | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Process for the electrolytic deposition of metal layers |
| US5750017A (en) * | 1996-08-21 | 1998-05-12 | Lucent Technologies Inc. | Tin electroplating process |
| DE19653681C2 (en) * | 1996-12-13 | 2000-04-06 | Atotech Deutschland Gmbh | Process for the electrolytic deposition of copper layers with a uniform layer thickness and good optical and metal-physical properties and application of the process |
| US5935407A (en) * | 1997-11-06 | 1999-08-10 | Chromalloy Gas Turbine Corporation | Method for producing abrasive tips for gas turbine blades |
| US6319384B1 (en) * | 1998-10-14 | 2001-11-20 | Faraday Technology Marketing Group, Llc | Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates |
| DK173515B1 (en) * | 1998-12-18 | 2001-01-22 | Per Moeller | Process and apparatus for the controlled electrochemical deposition of metals and alloys involving the use of an acoustic flow |
| JP2000232078A (en) * | 1999-02-10 | 2000-08-22 | Toshiba Corp | Plating method and plating equipment |
| DE60100620T2 (en) * | 2000-01-14 | 2004-03-11 | Dow Agrosciences Llc, Indianapolis | TARGETED ELECTROCHEMICAL REDUCTION OF HALOGENATED 4-AMINO-PICOLIC ACIDS |
| EP1132500A3 (en) * | 2000-03-08 | 2002-01-23 | Applied Materials, Inc. | Method for electrochemical deposition of metal using modulated waveforms |
| JP2001267726A (en) * | 2000-03-22 | 2001-09-28 | Toyota Autom Loom Works Ltd | Electrolytic plating method and device for wiring board |
| DE10061186C1 (en) * | 2000-12-07 | 2002-01-17 | Astrium Gmbh | Electroplating of nickel, cobalt, and their alloys onto rocket engine components, uses differing current densities and pulsed charge ratios at anode and cathode |
| DE10259365A1 (en) * | 2002-04-08 | 2003-10-30 | Siemens Ag | Device and method for removing surface areas of a component |
-
2002
- 2002-12-18 DE DE10259362A patent/DE10259362A1/en not_active Withdrawn
-
2003
- 2003-12-16 EP EP03813080A patent/EP1573090A2/en not_active Withdrawn
- 2003-12-16 WO PCT/DE2003/004155 patent/WO2004055245A2/en not_active Ceased
- 2003-12-16 CN CNA2003801069201A patent/CN1729314A/en active Pending
- 2003-12-16 US US10/539,938 patent/US20060131175A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4869971A (en) * | 1986-05-22 | 1989-09-26 | Nee Chin Cheng | Multilayer pulsed-current electrodeposition process |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2004055245A3 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004055245A2 (en) | 2004-07-01 |
| US20060131175A1 (en) | 2006-06-22 |
| WO2004055245A3 (en) | 2004-09-02 |
| CN1729314A (en) | 2006-02-01 |
| DE10259362A1 (en) | 2004-07-08 |
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