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EP1425115A4 - Supercritical fluid delivery and recovery system for semiconductor wafer processing - Google Patents

Supercritical fluid delivery and recovery system for semiconductor wafer processing

Info

Publication number
EP1425115A4
EP1425115A4 EP01927173A EP01927173A EP1425115A4 EP 1425115 A4 EP1425115 A4 EP 1425115A4 EP 01927173 A EP01927173 A EP 01927173A EP 01927173 A EP01927173 A EP 01927173A EP 1425115 A4 EP1425115 A4 EP 1425115A4
Authority
EP
European Patent Office
Prior art keywords
semiconductor wafer
fluid delivery
recovery system
supercritical fluid
wafer processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01927173A
Other languages
German (de)
French (fr)
Other versions
EP1425115A1 (en
Inventor
Michael Costantini
Heiko D Moritz
David Mount
Ijaz Jafri
Rick Heathwaite
Mohan Chandra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SC Fluids Inc
Original Assignee
SC Fluids Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SC Fluids Inc filed Critical SC Fluids Inc
Publication of EP1425115A1 publication Critical patent/EP1425115A1/en
Publication of EP1425115A4 publication Critical patent/EP1425115A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/008—Processes carried out under supercritical conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/54—Improvements relating to the production of bulk chemicals using solvents, e.g. supercritical solvents or ionic liquids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
EP01927173A 2000-04-18 2001-04-18 Supercritical fluid delivery and recovery system for semiconductor wafer processing Withdrawn EP1425115A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US19751900P 2000-04-18 2000-04-18
US197519P 2000-04-18
US26791601P 2001-02-09 2001-02-09
US267916P 2001-02-09
PCT/US2001/012617 WO2001078911A1 (en) 2000-04-18 2001-04-18 Supercritical fluid delivery and recovery system for semiconductor wafer processing

Publications (2)

Publication Number Publication Date
EP1425115A1 EP1425115A1 (en) 2004-06-09
EP1425115A4 true EP1425115A4 (en) 2006-03-01

Family

ID=26892922

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01927173A Withdrawn EP1425115A4 (en) 2000-04-18 2001-04-18 Supercritical fluid delivery and recovery system for semiconductor wafer processing

Country Status (4)

Country Link
EP (1) EP1425115A4 (en)
JP (1) JP2003531478A (en)
AU (1) AU2001253650A1 (en)
WO (1) WO2001078911A1 (en)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW539918B (en) 1997-05-27 2003-07-01 Tokyo Electron Ltd Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
US6748960B1 (en) 1999-11-02 2004-06-15 Tokyo Electron Limited Apparatus for supercritical processing of multiple workpieces
WO2001046999A2 (en) 1999-11-02 2001-06-28 Tokyo Electron Limited Method and apparatus for supercritical processing of a workpiece
WO2002009147A2 (en) 2000-07-26 2002-01-31 Tokyo Electron Limited High pressure processing chamber for semiconductor substrate
JP3883929B2 (en) 2001-09-25 2007-02-21 大日本スクリーン製造株式会社 Thin film forming apparatus and thin film forming method
TW569325B (en) * 2001-10-17 2004-01-01 Praxair Technology Inc Central carbon dioxide purifier
US7001468B1 (en) 2002-02-15 2006-02-21 Tokyo Electron Limited Pressure energized pressure vessel opening and closing device and method of providing therefor
US7387868B2 (en) 2002-03-04 2008-06-17 Tokyo Electron Limited Treatment of a dielectric layer using supercritical CO2
US6846380B2 (en) 2002-06-13 2005-01-25 The Boc Group, Inc. Substrate processing apparatus and related systems and methods
JP4142357B2 (en) 2002-07-04 2008-09-03 株式会社神戸製鋼所 Waste high pressure fluid treatment method and apparatus
US7282099B2 (en) 2002-09-24 2007-10-16 Air Products And Chemicals, Inc. Dense phase processing fluids for microelectronic component manufacture
US6960242B2 (en) * 2002-10-02 2005-11-01 The Boc Group, Inc. CO2 recovery process for supercritical extraction
US6880560B2 (en) 2002-11-18 2005-04-19 Techsonic Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
US7021635B2 (en) 2003-02-06 2006-04-04 Tokyo Electron Limited Vacuum chuck utilizing sintered material and method of providing thereof
US7225820B2 (en) 2003-02-10 2007-06-05 Tokyo Electron Limited High-pressure processing chamber for a semiconductor wafer
US7077917B2 (en) 2003-02-10 2006-07-18 Tokyo Electric Limited High-pressure processing chamber for a semiconductor wafer
US7270137B2 (en) 2003-04-28 2007-09-18 Tokyo Electron Limited Apparatus and method of securing a workpiece during high-pressure processing
US7018444B2 (en) * 2003-05-07 2006-03-28 Praxair Technology, Inc. Process for carbon dioxide recovery from a process tool
CN1816737B (en) * 2003-06-30 2012-02-01 格罗宁根大学医学中心 Method for histoprocessing
US20050006310A1 (en) * 2003-07-10 2005-01-13 Rajat Agrawal Purification and recovery of fluids in processing applications
US7163380B2 (en) 2003-07-29 2007-01-16 Tokyo Electron Limited Control of fluid flow in the processing of an object with a fluid
US20050022850A1 (en) * 2003-07-29 2005-02-03 Supercritical Systems, Inc. Regulation of flow of processing chemistry only into a processing chamber
US7186093B2 (en) 2004-10-05 2007-03-06 Tokyo Electron Limited Method and apparatus for cooling motor bearings of a high pressure pump
JP2005286105A (en) * 2004-03-30 2005-10-13 Hitachi Sci Syst Ltd Fine structure drying method and apparatus thereof
US7250374B2 (en) 2004-06-30 2007-07-31 Tokyo Electron Limited System and method for processing a substrate using supercritical carbon dioxide processing
US7307019B2 (en) 2004-09-29 2007-12-11 Tokyo Electron Limited Method for supercritical carbon dioxide processing of fluoro-carbon films
US20060065189A1 (en) * 2004-09-30 2006-03-30 Darko Babic Method and system for homogenization of supercritical fluid in a high pressure processing system
US7491036B2 (en) 2004-11-12 2009-02-17 Tokyo Electron Limited Method and system for cooling a pump
US7140393B2 (en) 2004-12-22 2006-11-28 Tokyo Electron Limited Non-contact shuttle valve for flow diversion in high pressure systems
US7434590B2 (en) 2004-12-22 2008-10-14 Tokyo Electron Limited Method and apparatus for clamping a substrate in a high pressure processing system
US7435447B2 (en) 2005-02-15 2008-10-14 Tokyo Electron Limited Method and system for determining flow conditions in a high pressure processing system
US7291565B2 (en) 2005-02-15 2007-11-06 Tokyo Electron Limited Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid
US7550075B2 (en) * 2005-03-23 2009-06-23 Tokyo Electron Ltd. Removal of contaminants from a fluid
US7380984B2 (en) 2005-03-28 2008-06-03 Tokyo Electron Limited Process flow thermocouple
US7767145B2 (en) 2005-03-28 2010-08-03 Toyko Electron Limited High pressure fourier transform infrared cell
US7494107B2 (en) 2005-03-30 2009-02-24 Supercritical Systems, Inc. Gate valve for plus-atmospheric pressure semiconductor process vessels
US7789971B2 (en) 2005-05-13 2010-09-07 Tokyo Electron Limited Treatment of substrate using functionalizing agent in supercritical carbon dioxide
US7524383B2 (en) 2005-05-25 2009-04-28 Tokyo Electron Limited Method and system for passivating a processing chamber
JP5491737B2 (en) * 2009-01-27 2014-05-14 株式会社神戸製鋼所 High pressure processing method and high pressure processing apparatus
ITPD20110153A1 (en) * 2011-05-13 2012-11-14 Univ Padova METHOD OF SYNTHESIS OF CARBON NANOTUBES FUNCTIONALIZED BY CYCLE ADDS IN CONTINUOUS FLOW AND APPARATUS FOR THE SAME
JP6804278B2 (en) * 2016-12-06 2020-12-23 東京エレクトロン株式会社 Supercritical fluid manufacturing equipment and substrate processing equipment
CN110998802B (en) * 2017-08-10 2023-08-29 株式会社富士金 Fluid supply device and fluid supply method
CN110639876B (en) * 2019-09-23 2024-08-27 东莞市志诚电器有限公司 Portable intelligent multifunctional cleaning machine

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5417768A (en) * 1993-12-14 1995-05-23 Autoclave Engineers, Inc. Method of cleaning workpiece with solvent and then with liquid carbon dioxide
AU4106696A (en) * 1994-11-09 1996-06-06 R.R. Street & Co. Inc. Method and system for rejuvenating pressurized fluid solvents used in cleaning substrates
US5908510A (en) * 1996-10-16 1999-06-01 International Business Machines Corporation Residue removal by supercritical fluids

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO0178911A1 *

Also Published As

Publication number Publication date
AU2001253650A1 (en) 2001-10-30
WO2001078911A1 (en) 2001-10-25
JP2003531478A (en) 2003-10-21
EP1425115A1 (en) 2004-06-09

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20030311

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

A4 Supplementary search report drawn up and despatched

Effective date: 20060113

RIC1 Information provided on ipc code assigned before grant

Ipc: B08B 3/00 20060101AFI20011101BHEP

Ipc: H01L 21/00 20060101ALI20060109BHEP

17Q First examination report despatched

Effective date: 20060807

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20070220