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EP1296913A2 - Pate photostructurable - Google Patents

Pate photostructurable

Info

Publication number
EP1296913A2
EP1296913A2 EP01921161A EP01921161A EP1296913A2 EP 1296913 A2 EP1296913 A2 EP 1296913A2 EP 01921161 A EP01921161 A EP 01921161A EP 01921161 A EP01921161 A EP 01921161A EP 1296913 A2 EP1296913 A2 EP 1296913A2
Authority
EP
European Patent Office
Prior art keywords
powder
photostructurable
polymer
paste according
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01921161A
Other languages
German (de)
English (en)
Inventor
Claudio De La Prieta
Thomas Schulte
Uwe Glanz
Petra Kuschel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1296913A2 publication Critical patent/EP1296913A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5122—Pd or Pt
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • H01C17/0654—Oxides of the platinum group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of a combination of metals and oxides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Definitions

  • the invention relates to a photostructurable paste, in particular for the production of structured resistance layers or conductor tracks on ceramic green cores, according to the preamble of the main claim.
  • Paste printed which is then structured by exposure to UV rays and using a photomask. After this structuring, the paste then develops in the exposed areas.
  • a disadvantage of this technique is that a yellow space is always required, since the pastes are sensitive to daylight.
  • known pastes based on the "fodel technique” are only suitable for temperatures of a maximum of 900 ° C, ie the ceramic green sheets provided with the applied and structured pastes may then be fired at a maximum of 900 ° C or sintered. In many cases, however, these temperatures are not sufficient.
  • the "fodel technique” it is not possible to simultaneously produce coarse and very fine structures on the green foils.
  • Fine structuring down to lateral dimensions of approx. 10 ⁇ m is possible, while only structures with lateral dimensions above 100 ⁇ m can be produced using conventional screen printing technology.
  • Multi-layer hybrids are built up and then sintered into a temperature sensor using co-firing technology.
  • the object of the present invention was, based on the application LT-97 161, to modify the photostructurable paste proposed therein in such a way that it is also suitable for direct application to ceramic green sheets. At the same time, it was an object of the present invention to provide a photostructurable paste which significantly increases the
  • the photostructurable paste according to the invention has the advantage over the prior art that it can be used to provide ceramic green films directly with functional layers, which are then photostructured, for example in the form of conductor tracks or
  • Resistance tracks can be structured. Lateral resolutions of less than 50 ⁇ m, in particular between 5 ⁇ m and 25 ⁇ m, are achieved.
  • the paste according to the invention has the further advantage that after the photostructuring on the ceramic green bodies remaining structures have only a small standard deviation of the lateral extent of the structures produced in at least one dimension from a predetermined desired value.
  • structures wider than 50 ⁇ m can also be produced, but then have a very precisely defined width, for example.
  • the standard deviation from the target value is usually less than 10 ⁇ m, in particular less than 5 ⁇ m.
  • the paste according to the invention is thus advantageously suitable for producing multilayer structures on a ceramic basis, ceramic green bodies first being provided with a structured functional layer, which are then processed further to form hybrid components.
  • the paste according to the invention can thus also be used to produce the temperature sensor known from application DE 199 34 109.5 with considerably improved properties with regard to the resistance tracks produced.
  • the platinum-containing paste according to the invention has the further advantage that, despite the addition of the catalytically very active platinum, it is stable over time and does not disintegrate even in daylight.
  • a mixture of platinum powder with aluminum oxide powder and / or zirconium dioxide powder can also be used with the filler used in the photopatternable paste instead of pure platinum powder.
  • This mixture leads to an improvement in the adhesion of the Pt conductor track produced on the green body (“green tape”) and / or serves, for example by mixing Pt and Al 2 O 3 powder particles, to increase the electrical resistance of the conductor tracks produced in this way.
  • the photosensitive paste can be developed by an aqueous solution and that it has a low sensitivity to visible light and the influence of oxygen.
  • the significantly improved resolution that can be achieved with the paste according to the invention can now be used to produce, for example, resistance tracks in a maander structure on ceramic green bodies and thus also on the fired ceramic substrates obtained after the sintering of these green bodies, compared to comparable resistance tracks that have been produced using conventional thick-film technology , Have resistance increases of more than 400%.
  • Resistance conductor tracks therefore mean a significantly smaller area requirement when used in temperature sensors or heating elements, with better accuracy of temperature measurement and higher measuring resistance, i.e. a better accuracy of the measurement voltage evaluation.
  • the invention is initially based on a photostructurable paste, as is already known in a similar form from the application LT-97 161.
  • the photostructurable paste described there is only suitable for application to ceramic substrates that have already been fired and must therefore be modified for application to ceramic green sheets. This modification is based essentially on the fact that in the paste composition known from LT-97 161, the glass components required there in the form of glass powder particles are removed or are not added when the paste is mixed together.
  • LT-97 161 known photosensitive paste for direct application on ceramic green cores is suitable if the paste composition described there is modified such that the glass powder components are not added. It was also found that a photosensitive paste modified in this way allows the production of structured functional layers on ceramic green sheets, the lateral extent of the structures produced in these functional layers by the photostructuring at least in one dimension, for example in width, below 50 ⁇ m, in particular between 5 ⁇ m and 25 ⁇ m. At the same time, it was found that even if one wanted to produce wider structures, these can be produced with significantly increased accuracy. A measure of this accuracy is the standard deviation of the lateral extent of the structures produced in at least one dimension from a predetermined target value. This standard deviation is typically less than 10 ⁇ m, in particular less than 5 ⁇ m.
  • a platinum powder with an average particle size of 10 nm to 20 ⁇ m, in particular of 50 nm to 2 ⁇ m, is particularly suitable as a filler for the photostructurable paste according to the invention.
  • the specific surface area of the inorganic filler or of the platinum powder is preferably 0.5 m 2 / g to 20 m 2 / g.
  • the weight fraction of the inorganic filler in the photostructurable paste is between 30% and 90% based on the total weight of the paste. A weight fraction of 50% -60% is preferred.
  • the ceramic powder also has an average particle size or specific surface area, comparable to that of the platinum powder, of 10 nm to 20 ⁇ m or 0.5 m 2 / g to 20 m 2 / g.
  • aluminum oxide powder, zirconium dioxide powder, yttrium-stabilized zirconium dioxide powder, yttrium oxide powder, titanium dioxide powder, silicon oxide powder or a mixture of these powders are used as the ceramic powder.
  • platinum-coated, non-conductive ceramic particles can also be used as the filler.
  • platinum compounds in particular platinum precursor compounds such as platinum (II) acetylacetonate, platinum (II) diamine-cyclobatane-1, 1- dicarboxylate, platinum (0) -1, 3-divinyl-l, 1,3,3-tetramethyldisiloxane or platinum (II) tetraammine nitrate in question.
  • platinum precursor compounds such as platinum (II) acetylacetonate, platinum (II) diamine-cyclobatane-1, 1- dicarboxylate, platinum (0) -1, 3-divinyl-l, 1,3,3-tetramethyldisiloxane or platinum (II) tetraammine nitrate in question.
  • these fillers are not preferred for cost reasons.
  • ceramic precursor materials in particular organic precursor materials based on Si, Al, Zr, Ti and Y, can also be used instead of the ceramic powder. Precursor materials of this type are known to the person skilled in the art.
  • the ceramic green bodies or ceramic foils to which the photostructurable paste is applied as a functional layer are, moreover, conventional ceramic green foils with ceramic particles embedded in a polymer matrix, for example yttrium-stabilized zirconium dioxide particles or aluminum oxide particles.
  • an intermediate layer is first applied to the ceramic green cores before the photostructurable paste can be applied to them.
  • This intermediate layer is, for example, an Al 2 O 3 layer or TiO 2 layer which is known per se.
  • the ceramic green sheets pretreated in this way are further processed, for example to form multilayer hybrid components.
  • the paste according to the invention can also be processed using the known thick-film technology.
  • the polymer used in the organic binder is particularly important for the paste.
  • This polymer must be a photochemically active polymer, i.e. it not only has the role of a layer-forming and dissolving component in the binder, but is also supposed to initiate the photopolymerization effectively by the initiator, which is insensitive to the visible spectrum of the light. For this purpose, it is designed as a large molecular, polyfunctional monomer.
  • the side chains of the polymer with their allyl groups and the organic disulfide additionally used in the organic binder neutralize the inhibitory effect of oxygen.
  • no special precautions are required to avoid the contact of the photo-structurable paste with the oxygen present in the air.
  • the line-like macromolecules of the polymer used in the binder which have side chains with alkyl and allyl groups, form a dense spatial structure, so that the polymer is perfect in the area of the exposed areas becomes insoluble in water-based solvents.
  • the added photoinitiator from the class of the azylphosphines also results in a particularly short exposure time.
  • the photostructurable paste has the following composition in mass fractions based on the mass of the inorganic filler:
  • Thermal polymerization inhibitor 0.01 to 0.35 organic solvent: 5.50 to 21.50
  • the polymer contained in the organic binder should first be soluble in water-soluble base solutions, form a non-sticky skin or a membrane at room temperature, make the viscosity of the photostructurable paste adjustable and actively participate in photoinitiating, radical polymerization in an oxygen-containing environment. Finally, the thermal cleavage of the polymer should also take place at the lowest possible temperatures.
  • the polymers that can be used have side chains with acrylic and allyl groups, they reduce the sensitivity of the organic binder against the inhibitory oxygen effect, but do not completely eliminate them. It is therefore also necessary to add an organic disulfide, the general formula R ⁇ -CH 2 -SS-CH 2 -R 2 for the same or different alkyl,
  • Isodecyl disulfide is particularly suitable as an organic disulfide.
  • a photoinitiator from the acylphosphine class is added to the photostructurable paste as a photoinitiator.
  • the compound 2, 6-dimethoxybenzoyldiphenylphosphine is preferred.
  • the solvent added to adjust the viscosity of the photostructurable paste should initially dissolve all organic components very well, at the same time not be volatile at room temperature and volatilize relatively quickly at temperatures of 80 ° C - 100 ° C, since such temperatures are typically used when drying green ceramic films especially after the application of the photostructurable paste.
  • Preferred solvents are terpenes, carbitol acetate, butyl carbitol acetate or higher alcohol esters. Benzyl alcohol is particularly preferred.
  • the compound 2, 6-di-tert-butyl-1,4-cresol has proven to be a particularly suitable inhibitor.
  • the processing of the individual components of the photostructurable paste was carried out essentially as already known from LT-97 161.
  • the Components of the organic binder are mixed with the filler, for example in a three-roll chair, in order to ensure an even distribution of the filler particles in the organic binder.
  • the photostructurable paste prepared in this way is then applied in a manner known per se in the form of a functional layer with a typical thickness of 1 ⁇ m to 10 ⁇ m to a ceramic green sheet with aluminum oxide as the ceramic component.
  • the green films provided with the functional layer were then dried at a temperature of 80 ° C. to 100 ° C. for a period of typically 5 minutes to 20 minutes and finally exposed to UV light using a photomask.
  • the photomask is structured, for example, in the form of meandering resistance conductor tracks.
  • the UV light during the exposure preferably has a wavelength of 320 nm - 400 nm.
  • the photostructurable paste was then developed.
  • an aerosol of an aqueous, 0.5% monoethanolamine solution is dripped onto a substrate which rotates at a speed of typically 3000 rpm, on which the exposed ceramic green sheets are arranged. This method is generally referred to as “spin development” and is explained in more detail in LT-97 161.
  • the unexposed areas are finally washed off again using a water-soluble basic solution.
  • the further processing of the ceramic green sheets with the developed, photostructurable paste on them then takes place in the manner known from application DE 199 34 109.5.
  • the ceramic green foils provided with the structured functional layers are optionally stacked with further ceramic green foils, provided with vias and electrical connections and finally sintered at temperatures of typically 1050 ° C. to 1650 ° C.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention concerne une pâte photostructurable, qui convient notamment à la production de couches résistives ou de pistes conductrices structurées sur des feuilles vertes céramiques. Cette pâte présente un liant organique photosensible et une charge. Ledit liant comprend un polymère, un photo-initiateur, un inhibiteur pour polarisation thermique, un bisulfure organique et un solvant organique. Ladite charge est une poudre de platine, un composé à base de platine ou un mélange constitué d'une poudre de platine ou d'un composé à base de platine et d'une poudre céramique ou d'un composé précurseur céramique.
EP01921161A 2000-03-14 2001-03-08 Pate photostructurable Withdrawn EP1296913A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10015502 2000-03-14
DE10015502A DE10015502A1 (de) 2000-03-14 2000-03-14 Photostrukturierbare Paste
PCT/DE2001/000867 WO2001068567A2 (fr) 2000-03-14 2001-03-08 Pate photostructurable

Publications (1)

Publication Number Publication Date
EP1296913A2 true EP1296913A2 (fr) 2003-04-02

Family

ID=7636773

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01921161A Withdrawn EP1296913A2 (fr) 2000-03-14 2001-03-08 Pate photostructurable

Country Status (6)

Country Link
US (1) US20030152863A1 (fr)
EP (1) EP1296913A2 (fr)
JP (1) JP2003531456A (fr)
KR (1) KR20030051415A (fr)
DE (1) DE10015502A1 (fr)
WO (1) WO2001068567A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7864322B2 (en) 2006-03-23 2011-01-04 The Research Foundation Of State University Of New York Optical methods and systems for detecting a constituent in a gas containing oxygen in harsh environments
DE102009029490B4 (de) * 2009-09-16 2023-09-28 Endress+Hauser SE+Co. KG Füllstandsmessgerät
JP4834170B1 (ja) 2010-07-12 2011-12-14 田中貴金属工業株式会社 電極形成用の導電微粒子及び金属ペースト並びに電極
TWI499775B (zh) * 2013-01-28 2015-09-11 Tanaka Precious Metal Ind 氣體感測電極形成用之金屬膏
JP6908116B2 (ja) * 2018-07-05 2021-07-21 東レ株式会社 樹脂組成物、遮光膜および遮光膜の製造方法
MX2021013235A (es) 2019-06-10 2021-12-10 Ferro Corp Composicion resistiva de alta adhesion.
DE102022115912A1 (de) 2022-06-27 2023-12-28 Universität Stuttgart, Körperschaft Des Öffentlichen Rechts Verfahren zum Herstellen eines elektrischen Bauteils mittels sukzessivem Aufdrucken und Sintern von partikelhaltiger Tinte

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2944866A1 (de) * 1979-11-07 1981-05-21 Hoechst Ag, 6000 Frankfurt Photopolymerisierbares gemisch und damit hergestelltes photopolymerisierbares kopiermaterial
JP3405199B2 (ja) * 1992-01-24 2003-05-12 東レ株式会社 感光性導電ペースト
TW367504B (en) * 1996-05-21 1999-08-21 Du Pont Photosensitive aqueous developable thick film composition employing vinylpyrrolidone polymer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0168567A2 *

Also Published As

Publication number Publication date
JP2003531456A (ja) 2003-10-21
US20030152863A1 (en) 2003-08-14
WO2001068567A3 (fr) 2003-01-09
DE10015502A1 (de) 2001-09-27
WO2001068567A2 (fr) 2001-09-20
KR20030051415A (ko) 2003-06-25

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