EP1266730B1 - Procédé de fabrication des panneaux de fibres résistant à l'humidité - Google Patents
Procédé de fabrication des panneaux de fibres résistant à l'humidité Download PDFInfo
- Publication number
- EP1266730B1 EP1266730B1 EP01850102A EP01850102A EP1266730B1 EP 1266730 B1 EP1266730 B1 EP 1266730B1 EP 01850102 A EP01850102 A EP 01850102A EP 01850102 A EP01850102 A EP 01850102A EP 1266730 B1 EP1266730 B1 EP 1266730B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- formaldehyde
- chips
- tannin
- condensed tannins
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Substances O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 115
- 229920005989 resin Polymers 0.000 claims abstract description 57
- 239000011347 resin Substances 0.000 claims abstract description 57
- 239000011230 binding agent Substances 0.000 claims abstract description 26
- 238000001035 drying Methods 0.000 claims abstract description 25
- 229920002770 condensed tannin Polymers 0.000 claims abstract description 18
- HANVTCGOAROXMV-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine;urea Chemical compound O=C.NC(N)=O.NC1=NC(N)=NC(N)=N1 HANVTCGOAROXMV-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 6
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 claims abstract 2
- 229920001864 tannin Polymers 0.000 claims description 26
- 239000001648 tannin Substances 0.000 claims description 26
- 235000018553 tannin Nutrition 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 24
- 239000002023 wood Substances 0.000 claims description 14
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- 238000004026 adhesive bonding Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims 7
- 235000017343 Quebracho blanco Nutrition 0.000 claims 1
- 241000065615 Schinopsis balansae Species 0.000 claims 1
- 230000002378 acidificating effect Effects 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 239000000835 fiber Substances 0.000 abstract description 24
- 239000011094 fiberboard Substances 0.000 abstract description 17
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 abstract description 4
- HMJMQKOTEHYCRN-UHFFFAOYSA-N formaldehyde;phenol;1,3,5-triazine-2,4,6-triamine;urea Chemical compound O=C.NC(N)=O.OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 HMJMQKOTEHYCRN-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011093 chipboard Substances 0.000 description 26
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 13
- 239000004202 carbamide Substances 0.000 description 13
- 229920000877 Melamine resin Polymers 0.000 description 11
- 238000003825 pressing Methods 0.000 description 7
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229920003180 amino resin Polymers 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002516 radical scavenger Substances 0.000 description 3
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 241000294754 Macroptilium atropurpureum Species 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- 229920002522 Wood fibre Polymers 0.000 description 2
- 239000013543 active substance Substances 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002025 wood fiber Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- -1 methylol compound Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N1/00—Pretreatment of moulding material
Definitions
- the invention relates to a process for the production of moisture-resistant chipboards and fibreboards in the dry process, such as medium-density fiberboard (MDF).
- MDF medium-density fiberboard
- Wood chipboards and fibreboards are produced by gluing chips or fibers with a binder, scattering the glued chips or fibers into mats and then pressing them to chipboard or fiberboard at temperatures of 140 ° C to 220 ° C.
- chipboard gluing is usually done after drying the chips
- MDF medium-density fiberboard
- the gluing of the fibers before or even after the drying of the fibers take place.
- the wood fibers are first glued in a so-called blow-line process and then dried in one or two stages.
- Aminoplast resins in particular urea-formaldehyde (UF resins) and urea-melamine-formaldehyde resins (MUF resins) are mainly used as binders for the production of particleboard and fiberboard.
- Other binders such as phenol-formaldehyde (PF) alkaline curing resins, tannin-formaldehyde (TF) resins and polymeric diisocyanate (PMDI) based adhesives may also be used. These binders have so far been of relatively little importance. In multilayer chipboard and fiberboard, different binders can be used in the different layers. Thus, e.g.
- OSB Oriented Strandboards
- MUF resins in the outer layers.
- chipboard fiberboard in which the outer layers of fibers and the middle layers consist of chips.
- binders can be used in the chip and fiber layers.
- UF resins urea-formaldehyde resins
- UF resins adhere to two disadvantages as a binder. These are the subsequent release of formaldehyde and the low moisture resistance of wood-based materials produced with UF resins.
- UF resins can not be used to produce chipboard or fiberboard that is suitable for use with UF resins Resistivity test according to DIN 68763 exist. With UF resins also chipboard and fiberboard are extremely or hardly producible with extremely low Thickenqellung. This is especially true when the molar ratio of formaldehyde: urea in the UF resins is low. From a certain molar ratio of (formaldehyde: urea) increases the thickness swelling significantly with reducing the formaldehyde content in the resin.
- This method has the disadvantage of reducing the moisture resistance of the binder based on formaldehyde.
- Their use is in the use of resins with a molar ratio of formaldehyde: urea of 1: 1 and below very critical (DE 3222195).
- Urea-formaldehyde resins containing melamine-formaldehyde resins are used in the chipboard industry for the production of chipboard and fiberboard with low thickness swelling and increased moisture resistance.
- the bonds produced with such resins lack the high weather resistance (DE-PS 2020481).
- DE-PS 2020481 it is therefore proposed to produce weathering-providing wood glues based on melamine and optionally urea by adding small amounts to an aqueous melamine resin which may be blended with up to 600 mole percent with urea under specific conditions added to phenol.
- melamine-urea phenol-formaldehyde resins which are regarded as mixed condensates of melamine, urea and phenol with the formaldehyde, are also used in the wood-based material industry for the production of particleboards.
- MUPF and MUF resins are expensive.
- the incorporation of melamine in urea-formaldehyde resins also reduces the curing rate of the resin and thus leads, albeit slightly, partially to an extension of the required pressing times.
- melamine as a formaldehyde scavenger in UF resins with a high molar ratio of formaldehyde: urea (1.5: 1) is known (DE-OS 1653167). Also known is the addition of melamine to urea-formaldehyde resins having a low molar ratio of formaldehyde: urea (1: 1 to about 1.2: 1) from EP 0062389.
- the moisture resistance which is determined according to DIN 68763 as V100 value, decreases considerably if the amount of formaldehyde in the binder is reduced.
- the V100 value decreases considerably when the ratio F / NH 2 (formaldehyde / NH 2 groups) in the resin drops below 0.65. This appears to be due to the fact that as the proportion of formaldehyde in the resin decreases, the crosslink density of the cured resin decreases.
- an increase in the formaldehyde content has the disadvantage that the formaldehyde release of the produced chipboard or fiberboard is increased.
- EP-A-0013447 proposes to use aminoplast resins in combination with 2 to 20% of soluble or dispersible protein as a binder.
- the use of PMDI as an additive for UF resins or MUF resins leads to an increase in binder costs and requires special precautions during operation.
- the object of this invention therefore, was to find a new way to produce moisture-resistant wood chip board and wood fiber boards without reducing the curing rate of the binders used, in particular those based on MUF resins, or reduce the moisture resistance of the plates produced or to increase the formaldehyde release. It is also an object of the invention to produce sheets with high moisture resistance when using MUF resins with extremely low formaldehyde content.
- the condensed tannin is added to the fibers prior to gluing in the blow-line.
- the tannin is also added prior to drying the fibers. This procedure has the advantage that the condensed tannins are also applied in dilute form to the chips or to the fibers.
- the condensed tannins can react with and trap the formaldehyde which may be released during the drying of wood shavings or fibers.
- the emission of formaldehyde during the drying of the chips and fibers is also significantly reduced.
- the formaldehyde release of the plates made of the chips and fibers is surprisingly significantly reduced in this way.
- the tannins can be added to both the fibers and the chips in varying amounts.
- the teaching of the present invention also differs from the teaching of DE-OS 4402341, which provides a treatment of chips with alkaline tannin formaldehyde resins, preferably at a pH above 12 and subsequent drying of the glued chips before the pressing process.
- the aim of DE-OS 4402341 is to induce self-condensation of the tannins without the addition of a crosslinking agent such as formaldehyde. Up to what moisture content the chips must be dried, can not be found in DE-OS 4402341.
- the example listed in DE-OS 4402341 contains no information about the pressing temperature. With the procedure according to DE-OS 440234A1 can not achieve plates with moisture-resistant glue. However, this is the object of the present invention.
- the amount of tannin solution, based on the weight of the chips, is 3.33% (or 1% solid tannin based on dry chips).
- the chips were immediately dried to a humidity of 1-2%.
- the dried chips were glued with a MUF resin.
- the binder was 11% (based on the Atro weight of the chips). The glued chips were then spread to mats and pressed hot to 19 mm thick chipboard.
- the pine wood chips were dried to a moisture of 1-2% without the addition of condensed tannins and glued with a MUF resin in amounts of 12% based on the atro weight of the chips and then sprinkled into mats and hot pressed.
- a tannin-formaldehyde resin or a mixture of tannin-formaldehyde resin and melamine-urea-formaldehyde resin may also be used as a binder.
- the chips are treated with condensed tannins before drying and after drying - as usual - glued with a mixture of tannin formaldehyde resin and Melaminhamstofformaldehydharz, sprinkled into mats and then pressed into chipboard.
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
- Inorganic Fibers (AREA)
Claims (14)
- Procédé de fabrication de panneaux de particules ou de fibres résistant à l'humidité d'après le traitement par voie sèche avec des résines phénolformaldéhyde ou des résines mélamine-urée-formaldéhyde ou des résines mélamine-urée-phénol ou des résines tanin-formaldéhyde ou PMDI comme liant, caractérisé en ce que les particules ou fibres humides sont traitées avec des tanins condensés avant le collage avec le liant et en ce que les particules ou fibres sont ensuite séchées jusqu'à une humidité de 5% maximum dans le cas de la fabrication de panneaux de particules et jusqu'à une humidité de 15% maximum dans le cas de la fabrication de panneaux de fibres.
- Procédé selon la revendication 1, caractérisé en ce que des extraits de bois de quebracho sont utilisés comme tanin.
- Procédé selon les revendications 1 et 2, caractérisé en ce que la solution de tanin présente une teneur en matière brute de 30%.
- Procédé selon les revendications 1, 2 et 3, caractérisé en ce que la valeur pH de la solution de tanin est dans la plage acide.
- Procédé selon la revendication 1, caractérisé en ce que la valeur pH de la solution est dans la plage alcaline.
- Procédé selon la revendication 1, caractérisé en ce que les particules traitées avec des tanins condensés avant le séchage ne sont utilisées que dans les couches extérieures de panneaux de particules de bois à trois couches.
- Procédé selon la revendication 1, caractérisé en ce que les particules traitées avec des tanins condensés avant le séchage ne sont utilisées que dans la couche centrale de panneaux de particules à trois couches.
- Procédé selon la revendication 1, caractérisé en ce que les fibres traitées avec des tanins condensés avant le séchage ne sont utilisées que dans la couche centrale de panneaux de fibres à trois couches.
- Procédé selon la revendication 1, caractérisé en ce que les fibres traitées avec des tanins condensés avant le séchage ne sont utilisées que dans la couche extérieure de panneaux de particules-fibres.
- Procédé selon la revendication 1, caractérisé en ce que la résine MUF utilisée comme liant présente un rapport molaire F/NH2 inférieur à 0,7.
- Procédé selon la revendication 1, caractérisé en ce que la résine MUF utilisée comme liant présente un rapport molaire F/NH2 inférieur à 0,5.
- Procédé selon la revendication 1, caractérisé en ce que, dans les couches dont les particules n'ont pas été traitées avec du tanin avant le séchage, le liant utilisé pour la fabrication de panneaux de particules et de fibres est un mélange de résines tanin-formaldéhyde et mélamine-urée-formaldéhyde.
- Procédé selon la revendication 1, caractérisé en ce que les particules ou les fibres ont une humidité supérieure à 12% avant le traitement au tanin.
- Procédé selon la revendication 1, caractérisé en ce que les particules ou les fibres ont une humidité supérieure à 50% avant le traitement au tanin.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP01850102A EP1266730B1 (fr) | 2001-06-12 | 2001-06-12 | Procédé de fabrication des panneaux de fibres résistant à l'humidité |
| AT01850102T ATE321636T1 (de) | 2001-06-12 | 2001-06-12 | Verfahren zur herstellung von feuchtebeständigen span- und mitteldichten faserplatten (mdf) |
| DE50109378T DE50109378D1 (de) | 2001-06-12 | 2001-06-12 | Verfahren zur Herstellung von feuchtebeständigen Span- und mitteldichten Faserplatten (MDF) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP01850102A EP1266730B1 (fr) | 2001-06-12 | 2001-06-12 | Procédé de fabrication des panneaux de fibres résistant à l'humidité |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1266730A1 EP1266730A1 (fr) | 2002-12-18 |
| EP1266730B1 true EP1266730B1 (fr) | 2006-03-29 |
Family
ID=8184874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP01850102A Expired - Lifetime EP1266730B1 (fr) | 2001-06-12 | 2001-06-12 | Procédé de fabrication des panneaux de fibres résistant à l'humidité |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP1266730B1 (fr) |
| AT (1) | ATE321636T1 (fr) |
| DE (1) | DE50109378D1 (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2002953568A0 (en) * | 2002-12-24 | 2003-01-16 | Borden Chemical Australia Pty Ltd | Novel chemical composition, method of making same, and products made therefrom |
| FR2850414B1 (fr) * | 2003-01-24 | 2005-11-25 | Espace Production Internationa | Revetement de sol stratifie astatique |
| DE502005010889D1 (de) * | 2004-10-15 | 2011-03-03 | Fraunhofer Ges Forschung | Verfahren zur verminderung der abgabe von flüchtigzzerkleinerungsprodukten und aus daraus hergestellten holzwerkstoffen, insbesondere holzspanplatten |
| DE102005019627B3 (de) * | 2005-04-26 | 2006-10-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung von mitteldichten Faserplatten und Faserformteilen mit verringerter Emission und niedriger Dickenquellung |
| WO2009020438A1 (fr) | 2007-08-08 | 2009-02-12 | Kronospan Sk S.R.O. | Panneau de particules à une seule couche pour le batiment |
| LT3286236T (lt) | 2015-04-21 | 2023-02-10 | Kastamonu Entegre Agac Sanayi Anonim Sirketi | Dervų, kurių sudėtyje yra poliflavonoidai ir jų dariniai, gamybos būdas ir jų naudojimas medinių kompozicinių plokščių produktuose |
| CN105583934A (zh) * | 2015-11-30 | 2016-05-18 | 万华生态板业股份有限公司 | 作为防霉剂使用的硼酸锌在秸秆板生产中的应用 |
| WO2019117799A1 (fr) * | 2017-12-15 | 2019-06-20 | Nsr Ab | Panneau de particules avec résine hybride |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4402341C2 (de) * | 1994-01-27 | 2000-11-02 | Bakelite Ag | Bindemittellösungen für cellulosehaltige Produkte |
| DE4431316C1 (de) * | 1994-09-02 | 1996-05-02 | Schlingmann Gmbh & Co | Verfahren zur Verminderung der Formaldehydabgabe von Holzspan- oder Faserplatten |
| DE19528492A1 (de) * | 1995-08-03 | 1997-02-06 | Raffael Etmone Prof Dr Ing | Verfahren zur Herstellung von mit Tanninformeldehydharzen gebundenen mitteldichten Holzfaserplatten (MDF) |
| DE59700001D1 (de) * | 1996-02-09 | 1998-06-25 | Schlingmann Gmbh & Co | Verfahren zur Herstellung von formaldehydarmen tanningebundenen Holzspan- und Faserplatten |
-
2001
- 2001-06-12 DE DE50109378T patent/DE50109378D1/de not_active Expired - Lifetime
- 2001-06-12 AT AT01850102T patent/ATE321636T1/de not_active IP Right Cessation
- 2001-06-12 EP EP01850102A patent/EP1266730B1/fr not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| ATE321636T1 (de) | 2006-04-15 |
| EP1266730A1 (fr) | 2002-12-18 |
| DE50109378D1 (de) | 2006-05-18 |
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