[go: up one dir, main page]

EP1264905A3 - Copper based alloy featuring precipitation hardening and solid-solution hardening - Google Patents

Copper based alloy featuring precipitation hardening and solid-solution hardening Download PDF

Info

Publication number
EP1264905A3
EP1264905A3 EP02018195A EP02018195A EP1264905A3 EP 1264905 A3 EP1264905 A3 EP 1264905A3 EP 02018195 A EP02018195 A EP 02018195A EP 02018195 A EP02018195 A EP 02018195A EP 1264905 A3 EP1264905 A3 EP 1264905A3
Authority
EP
European Patent Office
Prior art keywords
hardening
solid
based alloy
copper based
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02018195A
Other languages
German (de)
French (fr)
Other versions
EP1264905A2 (en
Inventor
David H. C/O Miller Company Mandle
Daniel D C/O Miller Company Farquharson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miller Co
Original Assignee
Miller Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miller Co filed Critical Miller Co
Priority claimed from EP98943252A external-priority patent/EP1021575B1/en
Publication of EP1264905A2 publication Critical patent/EP1264905A2/en
Publication of EP1264905A3 publication Critical patent/EP1264905A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/02Alloys based on copper with tin as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

A phosphor bronze alloy consisting of:
  • 0.4 to 3.0wt% Ni, 1.0 to 11.0wt% Sn, 0.1 to 1.0wt% Si, 0.01 to 0.06wt% P, the remainder being substantially Cu. The alloy is suitable for electrical lead conductors and for electrical or electronic interconnections.
  • Figure 00000001
    EP02018195A 1997-09-05 1998-08-21 Copper based alloy featuring precipitation hardening and solid-solution hardening Withdrawn EP1264905A3 (en)

    Applications Claiming Priority (3)

    Application Number Priority Date Filing Date Title
    US5777997P 1997-09-05 1997-09-05
    US57779 1997-09-05
    EP98943252A EP1021575B1 (en) 1997-09-05 1998-08-21 Copper based alloy featuring precipitation hardening and solid-solution hardening

    Related Parent Applications (1)

    Application Number Title Priority Date Filing Date
    EP98943252A Division EP1021575B1 (en) 1997-09-05 1998-08-21 Copper based alloy featuring precipitation hardening and solid-solution hardening

    Publications (2)

    Publication Number Publication Date
    EP1264905A2 EP1264905A2 (en) 2002-12-11
    EP1264905A3 true EP1264905A3 (en) 2002-12-18

    Family

    ID=26152670

    Family Applications (1)

    Application Number Title Priority Date Filing Date
    EP02018195A Withdrawn EP1264905A3 (en) 1997-09-05 1998-08-21 Copper based alloy featuring precipitation hardening and solid-solution hardening

    Country Status (1)

    Country Link
    EP (1) EP1264905A3 (en)

    Families Citing this family (5)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    JP3731600B2 (en) * 2003-09-19 2006-01-05 住友金属工業株式会社 Copper alloy and manufacturing method thereof
    WO2005068098A1 (en) 2004-01-16 2005-07-28 Sumitomo Metal Industries, Ltd. Method for producing seamless pipe
    EP1731624A4 (en) * 2004-03-12 2007-06-13 Sumitomo Metal Ind COPPER ALLOY AND MANUFACTURING METHOD THEREFOR
    EP1652946A1 (en) * 2004-10-04 2006-05-03 Gebr. Kemper GmbH + Co. KG Metallwerke Copper alloy
    JP5773929B2 (en) 2012-03-28 2015-09-02 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent bending workability and stress relaxation resistance

    Citations (5)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    US4337089A (en) * 1980-07-25 1982-06-29 Nippon Telegraph And Telephone Public Corporation Copper-nickel-tin alloys for lead conductor materials for integrated circuits and a method for producing the same
    JPS61143564A (en) * 1984-12-13 1986-07-01 Nippon Mining Co Ltd Manufacturing method of high strength and high conductivity copper-based alloy
    JPH02122039A (en) * 1988-10-31 1990-05-09 Nippon Mining Co Ltd High-strength, high-conductivity copper alloy with excellent oxide film adhesion
    JPH02197543A (en) * 1989-01-26 1990-08-06 Furukawa Electric Co Ltd:The Copper alloy for connecting apparatus
    US4971758A (en) * 1989-07-25 1990-11-20 Mitsubishi Shindoh Co., Ltd. Copper-based alloy connector for electrical devices

    Patent Citations (5)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    US4337089A (en) * 1980-07-25 1982-06-29 Nippon Telegraph And Telephone Public Corporation Copper-nickel-tin alloys for lead conductor materials for integrated circuits and a method for producing the same
    JPS61143564A (en) * 1984-12-13 1986-07-01 Nippon Mining Co Ltd Manufacturing method of high strength and high conductivity copper-based alloy
    JPH02122039A (en) * 1988-10-31 1990-05-09 Nippon Mining Co Ltd High-strength, high-conductivity copper alloy with excellent oxide film adhesion
    JPH02197543A (en) * 1989-01-26 1990-08-06 Furukawa Electric Co Ltd:The Copper alloy for connecting apparatus
    US4971758A (en) * 1989-07-25 1990-11-20 Mitsubishi Shindoh Co., Ltd. Copper-based alloy connector for electrical devices

    Non-Patent Citations (4)

    * Cited by examiner, † Cited by third party
    Title
    PATENT ABSTRACTS OF JAPAN vol. 010, no. 339 (C - 385) 15 November 1986 (1986-11-15) *
    PATENT ABSTRACTS OF JAPAN vol. 014, no. 334 (C - 0742) 18 July 1990 (1990-07-18) *
    PATENT ABSTRACTS OF JAPAN vol. 014, no. 480 (C - 0771) 19 October 1990 (1990-10-19) *
    SCHOEDER K-H ET AL: "Werkstoffe für elektrische Kontakte und ihre Anwendungen", 1997, EXPERT-VERLAG, RENNINGEN-MALMSHEIM, GERMANY, XP002217199 *

    Also Published As

    Publication number Publication date
    EP1264905A2 (en) 2002-12-11

    Similar Documents

    Publication Publication Date Title
    EP0798778A3 (en) Method of manufacturing a semiconductor device of multilayer wire structure
    EP1343179A3 (en) Coaxial cable jumper assembly including, plated outer conductor and associated methods
    MY126479A (en) Copper interconnection structure incorporating a metal seed layer
    EP1096523A3 (en) Article comprising improved noble metal-based alloys and method for making the same
    MY114565A (en) Lead-free solder alloys
    EP1203654A3 (en) Tin coated electrical connector
    EP0884935A3 (en) Universal surface finish for DCA SMT, and pad on pad interconnections
    EP0722660A3 (en) An antimicrobial polymer composition
    ES2074554T3 (en) PAIR OF ELECTRIC PLUG CONNECTORS.
    EP0860880A3 (en) Semiconductor device having improved interconnection pattern and method of manufacturing same
    EP1080823A3 (en) High-strength solder joint
    EP0828410A3 (en) Dual-solder process for enhancing reliability of thick-film hybrid circuits
    EP0788153A3 (en) Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same
    AUPP543798A0 (en) Hydrometallurgical extraction of copper and other valuable metals
    KR100786592B1 (en) Electrically Conductive Metal Strips And Connectors
    US20010055697A1 (en) Electrically conductive metal tape and plug connector made of it
    EP1264905A3 (en) Copper based alloy featuring precipitation hardening and solid-solution hardening
    SE0000290L (en) An antenna device and a method of manufacturing an antenna device
    EP1311025A3 (en) Electronic-part mounting structure and mounting method therefor
    AU9108398A (en) Copper based alloy featuring precipitation hardening and solid-solution hardening
    JPS572849A (en) Copper alloy for electronic parts
    EP0856917A3 (en) Mold-type electronic part-containing connector
    EP0957492A3 (en) Flexible automotive electrical conductor
    JP2005116486A (en) Copper alloy wire for electronic parts
    TW339302B (en) Solder active braze composition, method of forming an electrically conductive trace comprizing it and electronic assembly comprizing it

    Legal Events

    Date Code Title Description
    PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

    Free format text: ORIGINAL CODE: 0009012

    PUAL Search report despatched

    Free format text: ORIGINAL CODE: 0009013

    AC Divisional application: reference to earlier application

    Ref document number: 1021575

    Country of ref document: EP

    AK Designated contracting states

    Kind code of ref document: A2

    Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

    AK Designated contracting states

    Kind code of ref document: A3

    Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

    17P Request for examination filed

    Effective date: 20030311

    17Q First examination report despatched

    Effective date: 20030506

    AKX Designation fees paid

    Designated state(s): DE FR GB IT

    STAA Information on the status of an ep patent application or granted ep patent

    Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

    18D Application deemed to be withdrawn

    Effective date: 20030917