EP1264905A3 - Copper based alloy featuring precipitation hardening and solid-solution hardening - Google Patents
Copper based alloy featuring precipitation hardening and solid-solution hardening Download PDFInfo
- Publication number
- EP1264905A3 EP1264905A3 EP02018195A EP02018195A EP1264905A3 EP 1264905 A3 EP1264905 A3 EP 1264905A3 EP 02018195 A EP02018195 A EP 02018195A EP 02018195 A EP02018195 A EP 02018195A EP 1264905 A3 EP1264905 A3 EP 1264905A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- hardening
- solid
- based alloy
- copper based
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910045601 alloy Inorganic materials 0.000 title abstract 2
- 239000000956 alloy Substances 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000004881 precipitation hardening Methods 0.000 title 1
- 239000006104 solid solution Substances 0.000 title 1
- 229910000906 Bronze Inorganic materials 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5777997P | 1997-09-05 | 1997-09-05 | |
| US57779 | 1997-09-05 | ||
| EP98943252A EP1021575B1 (en) | 1997-09-05 | 1998-08-21 | Copper based alloy featuring precipitation hardening and solid-solution hardening |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP98943252A Division EP1021575B1 (en) | 1997-09-05 | 1998-08-21 | Copper based alloy featuring precipitation hardening and solid-solution hardening |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1264905A2 EP1264905A2 (en) | 2002-12-11 |
| EP1264905A3 true EP1264905A3 (en) | 2002-12-18 |
Family
ID=26152670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP02018195A Withdrawn EP1264905A3 (en) | 1997-09-05 | 1998-08-21 | Copper based alloy featuring precipitation hardening and solid-solution hardening |
Country Status (1)
| Country | Link |
|---|---|
| EP (1) | EP1264905A3 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3731600B2 (en) * | 2003-09-19 | 2006-01-05 | 住友金属工業株式会社 | Copper alloy and manufacturing method thereof |
| WO2005068098A1 (en) | 2004-01-16 | 2005-07-28 | Sumitomo Metal Industries, Ltd. | Method for producing seamless pipe |
| EP1731624A4 (en) * | 2004-03-12 | 2007-06-13 | Sumitomo Metal Ind | COPPER ALLOY AND MANUFACTURING METHOD THEREFOR |
| EP1652946A1 (en) * | 2004-10-04 | 2006-05-03 | Gebr. Kemper GmbH + Co. KG Metallwerke | Copper alloy |
| JP5773929B2 (en) | 2012-03-28 | 2015-09-02 | 株式会社神戸製鋼所 | Copper alloy sheet for electrical and electronic parts with excellent bending workability and stress relaxation resistance |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4337089A (en) * | 1980-07-25 | 1982-06-29 | Nippon Telegraph And Telephone Public Corporation | Copper-nickel-tin alloys for lead conductor materials for integrated circuits and a method for producing the same |
| JPS61143564A (en) * | 1984-12-13 | 1986-07-01 | Nippon Mining Co Ltd | Manufacturing method of high strength and high conductivity copper-based alloy |
| JPH02122039A (en) * | 1988-10-31 | 1990-05-09 | Nippon Mining Co Ltd | High-strength, high-conductivity copper alloy with excellent oxide film adhesion |
| JPH02197543A (en) * | 1989-01-26 | 1990-08-06 | Furukawa Electric Co Ltd:The | Copper alloy for connecting apparatus |
| US4971758A (en) * | 1989-07-25 | 1990-11-20 | Mitsubishi Shindoh Co., Ltd. | Copper-based alloy connector for electrical devices |
-
1998
- 1998-08-21 EP EP02018195A patent/EP1264905A3/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4337089A (en) * | 1980-07-25 | 1982-06-29 | Nippon Telegraph And Telephone Public Corporation | Copper-nickel-tin alloys for lead conductor materials for integrated circuits and a method for producing the same |
| JPS61143564A (en) * | 1984-12-13 | 1986-07-01 | Nippon Mining Co Ltd | Manufacturing method of high strength and high conductivity copper-based alloy |
| JPH02122039A (en) * | 1988-10-31 | 1990-05-09 | Nippon Mining Co Ltd | High-strength, high-conductivity copper alloy with excellent oxide film adhesion |
| JPH02197543A (en) * | 1989-01-26 | 1990-08-06 | Furukawa Electric Co Ltd:The | Copper alloy for connecting apparatus |
| US4971758A (en) * | 1989-07-25 | 1990-11-20 | Mitsubishi Shindoh Co., Ltd. | Copper-based alloy connector for electrical devices |
Non-Patent Citations (4)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 010, no. 339 (C - 385) 15 November 1986 (1986-11-15) * |
| PATENT ABSTRACTS OF JAPAN vol. 014, no. 334 (C - 0742) 18 July 1990 (1990-07-18) * |
| PATENT ABSTRACTS OF JAPAN vol. 014, no. 480 (C - 0771) 19 October 1990 (1990-10-19) * |
| SCHOEDER K-H ET AL: "Werkstoffe für elektrische Kontakte und ihre Anwendungen", 1997, EXPERT-VERLAG, RENNINGEN-MALMSHEIM, GERMANY, XP002217199 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1264905A2 (en) | 2002-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0798778A3 (en) | Method of manufacturing a semiconductor device of multilayer wire structure | |
| EP1343179A3 (en) | Coaxial cable jumper assembly including, plated outer conductor and associated methods | |
| MY126479A (en) | Copper interconnection structure incorporating a metal seed layer | |
| EP1096523A3 (en) | Article comprising improved noble metal-based alloys and method for making the same | |
| MY114565A (en) | Lead-free solder alloys | |
| EP1203654A3 (en) | Tin coated electrical connector | |
| EP0884935A3 (en) | Universal surface finish for DCA SMT, and pad on pad interconnections | |
| EP0722660A3 (en) | An antimicrobial polymer composition | |
| ES2074554T3 (en) | PAIR OF ELECTRIC PLUG CONNECTORS. | |
| EP0860880A3 (en) | Semiconductor device having improved interconnection pattern and method of manufacturing same | |
| EP1080823A3 (en) | High-strength solder joint | |
| EP0828410A3 (en) | Dual-solder process for enhancing reliability of thick-film hybrid circuits | |
| EP0788153A3 (en) | Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same | |
| AUPP543798A0 (en) | Hydrometallurgical extraction of copper and other valuable metals | |
| KR100786592B1 (en) | Electrically Conductive Metal Strips And Connectors | |
| US20010055697A1 (en) | Electrically conductive metal tape and plug connector made of it | |
| EP1264905A3 (en) | Copper based alloy featuring precipitation hardening and solid-solution hardening | |
| SE0000290L (en) | An antenna device and a method of manufacturing an antenna device | |
| EP1311025A3 (en) | Electronic-part mounting structure and mounting method therefor | |
| AU9108398A (en) | Copper based alloy featuring precipitation hardening and solid-solution hardening | |
| JPS572849A (en) | Copper alloy for electronic parts | |
| EP0856917A3 (en) | Mold-type electronic part-containing connector | |
| EP0957492A3 (en) | Flexible automotive electrical conductor | |
| JP2005116486A (en) | Copper alloy wire for electronic parts | |
| TW339302B (en) | Solder active braze composition, method of forming an electrically conductive trace comprizing it and electronic assembly comprizing it |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
| AC | Divisional application: reference to earlier application |
Ref document number: 1021575 Country of ref document: EP |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
| AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
| 17P | Request for examination filed |
Effective date: 20030311 |
|
| 17Q | First examination report despatched |
Effective date: 20030506 |
|
| AKX | Designation fees paid |
Designated state(s): DE FR GB IT |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20030917 |