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EP1198745A1 - Dispositif de refroidissement pour composants electroniques - Google Patents

Dispositif de refroidissement pour composants electroniques

Info

Publication number
EP1198745A1
EP1198745A1 EP01913851A EP01913851A EP1198745A1 EP 1198745 A1 EP1198745 A1 EP 1198745A1 EP 01913851 A EP01913851 A EP 01913851A EP 01913851 A EP01913851 A EP 01913851A EP 1198745 A1 EP1198745 A1 EP 1198745A1
Authority
EP
European Patent Office
Prior art keywords
heat transfer
transfer medium
heat
cooling device
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01913851A
Other languages
German (de)
English (en)
Inventor
Ulrich Fischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EKL AG
Original Assignee
EKL AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EKL AG filed Critical EKL AG
Publication of EP1198745A1 publication Critical patent/EP1198745A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a cooling device for electronic components, in particular for cooling microprocessors, with at least one passive heat-conducting cooling element.
  • passive heat-conducting cooling elements in particular made of aluminum, are arranged on the surfaces of the electronic components and thus brought into active contact with them.
  • the cooling elements are attached using adhesive or special brackets.
  • An additional active cooling element in the form of a fan is usually attached to the passive cooling elements or integrated into the passive cooling elements.
  • the known cooling systems are all based on the principle of heat transfer by evaporation, condensation, convection and radiation or are distinguished by different material combinations and surface structures with different conductivities or thermal resistances.
  • a disadvantage of the known cooling devices is that due to the ever more powerful electronic components, especially due to the ever higher clock frequencies of microprocessors, the heat development increases sharply. However, since such electronic components can only work in a certain temperature range and become inoperable if the temperature is too high or experience severe performance losses, ever increasing demands are made on the corresponding cooling devices. With the coolers mentioned according to the prior art, the desired and required cooling can no longer be achieved.
  • a generic cooling device with the features of claim 1 is used to achieve this object.
  • a cooling device for electronic components has at least one passive heat-conducting cooling element, at least part of the passive cooling element being in contact with at least one heat transfer medium which is in a solid state of aggregation.
  • the heat transfer medium is a phase transition material (PCM phase change material) with a heat capacity that is many times higher than that of water.
  • the heat transfer medium is designed as a latent heat store, the heat transfer medium storing and storing the amount of heat generated by the load on the electronic component, which can no longer be absorbed and dissipated by the passive cooling element, while maintaining the solid state of the aggregate releases a time of lower load on the electronic component.
  • the heat transfer medium is able to absorb temporarily occurring additional quantities of heat and to release them again under normal load, ie with normal heat development of the electronic component.
  • This avoids thermal peak loads which, in conventional cooling devices, significantly reduce the performance of the electronic component and especially of microprocessors.
  • the cooling device according to the invention thus also ensures an increase in performance of the cooled components. By avoiding harmful heat peaks, the service life and the functionality of the electronic components cooled with the cooling device according to the invention are also increased. Since the phase transition material used as the heat transfer medium also maintains its solid state of aggregation when it absorbs heat, there are advantageously no problems due to expansion of the phase transition material, as is always the case with known materials.
  • the heat transfer medium consists of salts or salt mixtures enriched with organic substances and fine powdered metallic substances to improve the conductivity.
  • the organic component of the heat transfer medium is usually paraffin.
  • Such a heat transfer medium maintains its solid state even when it absorbs heat and can thus be arranged in tablet form and / or as a solid body in and / or on the cooling element. This ensures that the cooling device is inexpensive to manufacture on the one hand and can be kept small on the other.
  • the heat transfer medium is adjusted to the required operating temperature. temperatures when cooling the electronic components is individually adjustable. The setting is made by varying the type and amount of the components of the heat transfer medium. In particular, it is also possible to set the amount of heat that the heat transfer medium is to buffer.
  • the heat transfer medium is advantageously non-toxic and recyclable.
  • At least one active cooling element in particular a fan, is arranged on the passive cooling element. This advantageously ensures that the cooling capacity of the cooling device is increased again.
  • the heat transfer medium is arranged in a container made of heat-conducting material, the container being in contact with the passive cooling element.
  • the arrangement of the heat transfer medium in a container enables the individual heat transfer elements to be easily exchanged within or on the passive cooling element.
  • a heat-conducting film is arranged between a contact surface of the passive cooling element and a corresponding contact surface of the electronic component. This measure ensures that the total cooling capacity with the cooling device is further increased by an optimized heat transfer from the electronic component to the passive cooling element.
  • the invention also relates to a processor with a processor socket and at least one cooling device arranged on the processor, the cooling device having at least one passive heat-conducting cooling element and at least part of the passive cooling element with at least one Heat transfer medium, which is in a solid state of aggregation, is in contact.
  • the heat transfer medium is a phase transition material (PCM phase change material) with a heat absorption capacity that is many times higher than that of water.
  • the heat transfer medium is designed as a latent heat storage device in such a way that the heat transfer medium stores the amount of heat generated by the load on the processor, which can no longer be absorbed and dissipated by the passive cooling element, while maintaining the solid state of the aggregate and at a time when the load on the processor is lower again emits.
  • the invention also relates to the use of a heat transfer medium, which is in a solid state of aggregation, for cooling microprocessors, the heat transfer medium being a phase transition material (PCM phase change material) with a heat absorption capacity that is many times higher than that of water, and is designed as a latent heat store ,
  • PCM phase change material phase transition material
  • the heat transfer medium stores the amount of heat generated by the load on the microprocessor while maintaining the solid aggregate state and releases it again at a time when the load on the microprocessor is lower.
  • Figure 1 is a schematic sectional view through a cooling device according to the invention.
  • Figure 2 is a schematically illustrated plan view of the invention
  • Figure 3 is a schematically illustrated side view of the 1 according to the invention.
  • FIG. 1 shows a sectional view of a cooling device 10 for cooling electronic components, in particular for cooling microprocessors.
  • the cooling device 10 consists of a passive heat-conducting cooling element 12, the cooling element 12 being constructed from a multiplicity of cooling fins 14.
  • the cooling fins 14 are arranged on a base element 16 of the cooling element 12.
  • the base element 16 forms a contact surface 18 which is in contact with the electronic component to be cooled.
  • the passive cooling element 12 consists of aluminum or an aluminum alloy and is usually formed in one piece. It can be seen that a plurality of heat transfer media 20 are arranged within the cooling element 12 between the cooling fins 14.
  • the heat transfer media 20 are in a solid state of aggregation and in heat-conducting contact with the cooling fins 14 and the bottom element 16 or the cooling element 12.
  • the heat transfer medium is a phase transition material with a heat absorption capacity that is many times higher than that of water. Since the heat transfer medium is in a solid state of aggregation and also remains when heat is absorbed, it is not necessary to form the heat transfer medium 20 or the cooling element 12 in a sealing manner. A mounting of the individual heat transfer media 20 within the passive cooling element 12 is sufficient.
  • the heat transfer medium is also designed as a latent heat storage device, such that the heat transfer medium 20 stores the thermal energy generated by the load on the electronic component, which can no longer be absorbed and dissipated by the passive cooling element 18, while maintaining the solid state of aggregation and at a point in time releases less load on the electronic component again.
  • FIG. 2 shows a schematic top view of the cooling device 10 according to FIG. 1. The arrangement of the individual heat transfer media 20 between the individual cooling fins 14 of the cooling element 12 can be seen.
  • FIG. 3 shows a side view of the cooling device according to FIG. 1. It can be seen that fastening devices 22 for fastening the cooling device 10 with the electronic component to be cooled are molded onto the cooling element 12 in the region of the base element 16 and laterally thereon. Furthermore, it can be seen that in the exemplary embodiment shown, the heat transfer media 20 are disc-shaped. However, the size and shape of the heat transfer media 20 can be selected as desired. About the size and number of heat transfer media 20, it is among other things. possible to set the required operating temperatures for the respective electronic components to be cooled.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif de refroidissement destiné à des composants électroniques, en particulier au refroidissement de microprocesseurs, comportant au moins un élément de refroidissement thermoconducteur passif (12), au moins une partie de l'élément de refroidissement passif (12) se trouvant en contact avec un milieu de transfert thermique (20) à l'état solide. Ce milieu de transfert thermique (20) est un matériau de transition de phase (PCM Phase Change Material) présentant une capacité d'absorption de chaleur nettement supérieure à celle de l'eau, et est conçu en tant qu'accumulateur de chaleur latente. Le milieu de transfert thermique (20) accumule la quantité de chaleur produite par la charge du composant électronique ne pouvant plus être absorbée ni évacuée par l'élément de refroidissement passif (18), avec conservation de l'état solide, puis évacue à nouveau cette quantité de chaleur lorsque la charge sur le composant électronique diminue.
EP01913851A 2000-03-16 2001-03-08 Dispositif de refroidissement pour composants electroniques Withdrawn EP1198745A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10012990 2000-03-16
DE10012990A DE10012990A1 (de) 2000-03-16 2000-03-16 Kühlvorrichtung für elektronische Bauelemente
PCT/EP2001/002631 WO2001069360A1 (fr) 2000-03-16 2001-03-08 Dispositif de refroidissement pour composants electroniques

Publications (1)

Publication Number Publication Date
EP1198745A1 true EP1198745A1 (fr) 2002-04-24

Family

ID=7635072

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01913851A Withdrawn EP1198745A1 (fr) 2000-03-16 2001-03-08 Dispositif de refroidissement pour composants electroniques

Country Status (7)

Country Link
EP (1) EP1198745A1 (fr)
JP (1) JP2003527753A (fr)
CN (1) CN1364251A (fr)
CA (1) CA2374008A1 (fr)
DE (1) DE10012990A1 (fr)
TW (1) TW499749B (fr)
WO (1) WO2001069360A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7184265B2 (en) 2003-05-29 2007-02-27 Lg Electronics Inc. Cooling system for a portable computer
US7188484B2 (en) 2003-06-09 2007-03-13 Lg Electronics Inc. Heat dissipating structure for mobile device
CN102548355B (zh) * 2010-12-31 2015-04-29 联想(北京)有限公司 一种电子设备
TWI484089B (zh) * 2012-03-22 2015-05-11 Univ Nat Cheng Kung 智慧型太陽能窗、帷幕之模組構造
KR102104919B1 (ko) 2013-02-05 2020-04-27 삼성전자주식회사 반도체 패키지 및 이의 제조방법
DE102013204473A1 (de) 2013-03-14 2014-09-18 Robert Bosch Gmbh Kühlanordnung für ein Steuergerät
US10597286B2 (en) * 2017-08-01 2020-03-24 Analog Devices Global Monolithic phase change heat sink

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9505069D0 (en) * 1995-03-14 1995-05-03 Barr & Stroud Ltd Heat sink
DE19805930A1 (de) * 1997-02-13 1998-08-20 Furukawa Electric Co Ltd Kühlvorrichtung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0169360A1 *

Also Published As

Publication number Publication date
WO2001069360A1 (fr) 2001-09-20
DE10012990A1 (de) 2001-10-11
JP2003527753A (ja) 2003-09-16
TW499749B (en) 2002-08-21
CN1364251A (zh) 2002-08-14
CA2374008A1 (fr) 2001-09-20

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