EP1190011A2 - Formulations d'adhesifs - Google Patents
Formulations d'adhesifsInfo
- Publication number
- EP1190011A2 EP1190011A2 EP00938197A EP00938197A EP1190011A2 EP 1190011 A2 EP1190011 A2 EP 1190011A2 EP 00938197 A EP00938197 A EP 00938197A EP 00938197 A EP00938197 A EP 00938197A EP 1190011 A2 EP1190011 A2 EP 1190011A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- acrylate
- adhesive composition
- hydroxy
- reaction product
- anhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 64
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 64
- 239000000203 mixture Substances 0.000 title claims abstract description 43
- 238000009472 formulation Methods 0.000 title description 6
- 239000000178 monomer Substances 0.000 claims abstract description 41
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 20
- FEWFXBUNENSNBQ-UHFFFAOYSA-N 2-hydroxyacrylic acid Chemical compound OC(=C)C(O)=O FEWFXBUNENSNBQ-UHFFFAOYSA-N 0.000 claims abstract description 14
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 11
- 150000008064 anhydrides Chemical class 0.000 claims abstract 10
- 239000002253 acid Substances 0.000 claims description 20
- 239000007800 oxidant agent Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 14
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 claims description 10
- 239000003638 chemical reducing agent Substances 0.000 claims description 10
- 150000003254 radicals Chemical class 0.000 claims description 9
- FIQBJLHOPOSODG-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxycarbonyl]benzoic acid Chemical compound CC(=C)C(=O)OCCOC(=O)C1=CC=CC=C1C(O)=O FIQBJLHOPOSODG-UHFFFAOYSA-N 0.000 claims description 7
- 230000000977 initiatory effect Effects 0.000 claims description 4
- 230000001902 propagating effect Effects 0.000 claims description 4
- 238000010526 radical polymerization reaction Methods 0.000 claims description 3
- 230000002452 interceptive effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract 1
- -1 polyethylene Polymers 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 14
- 150000001875 compounds Chemical class 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 11
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000012745 toughening agent Substances 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000012190 activator Substances 0.000 description 6
- 239000002318 adhesion promoter Substances 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000000806 elastomer Substances 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 150000002596 lactones Chemical class 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 235000011007 phosphoric acid Nutrition 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- WDFFWUVELIFAOP-UHFFFAOYSA-N 2,6-difluoro-4-nitroaniline Chemical group NC1=C(F)C=C([N+]([O-])=O)C=C1F WDFFWUVELIFAOP-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 241001082241 Lythrum hyssopifolia Species 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229920001893 acrylonitrile styrene Polymers 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 125000000746 allylic group Chemical group 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- XZKRXPZXQLARHH-UHFFFAOYSA-N buta-1,3-dienylbenzene Chemical compound C=CC=CC1=CC=CC=C1 XZKRXPZXQLARHH-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007859 condensation product Substances 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 239000013536 elastomeric material Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- KETWBQOXTBGBBN-UHFFFAOYSA-N hex-1-enylbenzene Chemical compound CCCCC=CC1=CC=CC=C1 KETWBQOXTBGBBN-UHFFFAOYSA-N 0.000 description 2
- 239000003701 inert diluent Substances 0.000 description 2
- 239000012442 inert solvent Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- YENKRZXDJWBUIY-UHFFFAOYSA-N 1-phosphonooxypropan-2-yl 2-methylprop-2-enoate Chemical compound OP(=O)(O)OCC(C)OC(=O)C(C)=C YENKRZXDJWBUIY-UHFFFAOYSA-N 0.000 description 1
- OLQFXOWPTQTLDP-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCO OLQFXOWPTQTLDP-UHFFFAOYSA-N 0.000 description 1
- RWXMAAYKJDQVTF-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl prop-2-enoate Chemical compound OCCOCCOC(=O)C=C RWXMAAYKJDQVTF-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical compound OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 1
- OGWZVZSVQQBXJD-UHFFFAOYSA-N 2-[ethoxy(hydroxy)phosphoryl]oxyethyl 2-methylprop-2-enoate Chemical compound CCOP(O)(=O)OCCOC(=O)C(C)=C OGWZVZSVQQBXJD-UHFFFAOYSA-N 0.000 description 1
- PQCQUHTVHDSFDH-UHFFFAOYSA-N 2-[ethoxy(hydroxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound CCOP(O)(=O)OCCOC(=O)C=C PQCQUHTVHDSFDH-UHFFFAOYSA-N 0.000 description 1
- WAJJFPMYKWCDNI-UHFFFAOYSA-N 2-[hydroxy(2-prop-2-enoyloxyethoxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOP(=O)(O)OCCOC(=O)C=C WAJJFPMYKWCDNI-UHFFFAOYSA-N 0.000 description 1
- YWLLQUWZWIKQKV-UHFFFAOYSA-N 2-[hydroxy(methoxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound COP(O)(=O)OCCOC(=O)C=C YWLLQUWZWIKQKV-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 1
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 description 1
- 229940044192 2-hydroxyethyl methacrylate Drugs 0.000 description 1
- RWNJPRZBKSXYBL-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate;oxepan-2-one Chemical group OCCOC(=O)C=C.O=C1CCCCCO1 RWNJPRZBKSXYBL-UHFFFAOYSA-N 0.000 description 1
- ZWMJUBVSXUPLKD-UHFFFAOYSA-N 2-hydroxypentyl 2-methylprop-2-enoate Chemical compound CCCC(O)COC(=O)C(C)=C ZWMJUBVSXUPLKD-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- SEILKFZTLVMHRR-UHFFFAOYSA-N 2-phosphonooxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(O)=O SEILKFZTLVMHRR-UHFFFAOYSA-N 0.000 description 1
- UDXXYUDJOHIIDZ-UHFFFAOYSA-N 2-phosphonooxyethyl prop-2-enoate Chemical compound OP(O)(=O)OCCOC(=O)C=C UDXXYUDJOHIIDZ-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- FZYJCVMLEDZTJW-UHFFFAOYSA-N 3-hydroxypentyl prop-2-enoate Chemical compound CCC(O)CCOC(=O)C=C FZYJCVMLEDZTJW-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- IZOOKIPOZQWSGC-UHFFFAOYSA-N 5-hydroxydecyl 2-methylprop-2-enoate Chemical compound CCCCCC(O)CCCCOC(=O)C(C)=C IZOOKIPOZQWSGC-UHFFFAOYSA-N 0.000 description 1
- YGTVWCBFJAVSMS-UHFFFAOYSA-N 5-hydroxypentyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCO YGTVWCBFJAVSMS-UHFFFAOYSA-N 0.000 description 1
- OHNKSVVCUPOUDJ-UHFFFAOYSA-N 5-nitro-1h-indene Chemical compound [O-][N+](=O)C1=CC=C2CC=CC2=C1 OHNKSVVCUPOUDJ-UHFFFAOYSA-N 0.000 description 1
- YROVIFKSHZGNSF-UHFFFAOYSA-N 6-hydroxynonyl prop-2-enoate Chemical compound CCCC(O)CCCCCOC(=O)C=C YROVIFKSHZGNSF-UHFFFAOYSA-N 0.000 description 1
- CPDZIKHNXVPGST-UHFFFAOYSA-N 7-hydroxyheptyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCO CPDZIKHNXVPGST-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- DWSLZXIVLWVGRD-UHFFFAOYSA-N CC(=C)C(=O)OCCP(O)=O Chemical compound CC(=C)C(=O)OCCP(O)=O DWSLZXIVLWVGRD-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920013645 Europrene Polymers 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229920002121 Hydroxyl-terminated polybutadiene Polymers 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- SUHOOTKUPISOBE-UHFFFAOYSA-N O-phosphoethanolamine Chemical compound NCCOP(O)(O)=O SUHOOTKUPISOBE-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- AGIABBZIYOGTGE-UHFFFAOYSA-N bis(prop-2-enyl)phosphinic acid Chemical compound C=CCP(=O)(O)CC=C AGIABBZIYOGTGE-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- GGGWIAMJVIYCGA-UHFFFAOYSA-N butan-2-yl benzenecarboperoxoate Chemical compound CCC(C)OOC(=O)C1=CC=CC=C1 GGGWIAMJVIYCGA-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- FCPZWSAJRRKPLK-UHFFFAOYSA-N cyclohex-2-en-1-ylphosphonic acid Chemical compound OP(O)(=O)C1CCCC=C1 FCPZWSAJRRKPLK-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- GYVGXEWAOAAJEU-UHFFFAOYSA-N n,n,4-trimethylaniline Chemical compound CN(C)C1=CC=C(C)C=C1 GYVGXEWAOAAJEU-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002976 peresters Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 239000013615 primer Substances 0.000 description 1
- 239000002987 primer (paints) Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- RZKYDQNMAUSEDZ-UHFFFAOYSA-N prop-2-enylphosphonic acid Chemical compound OP(O)(=O)CC=C RZKYDQNMAUSEDZ-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003455 sulfinic acids Chemical class 0.000 description 1
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 1
- 239000006188 syrup Substances 0.000 description 1
- 235000020357 syrup Nutrition 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical compound OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
- C08F290/048—Polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
Definitions
- the present invention relates to improved odor of polyme ⁇ zable or curable acrylic adhesives.
- Acrylic structural adhesives are well known articles of commerce which are extensively used commercially for bonding metal and plastic mate ⁇ als. Acrylic structural adhesives have found growing use in the automotive industry where the adhesive bonding of metal parts is replacing welding and mechanical fastening techniques. However, these applications give ⁇ se to unique requirements not easily met by previously available adhesives. These requirements include high bond strength, improved failure mode and low odor.
- Acrylic adhesives typically comprise a mixture of one or more olefmic reactive monomers such as methyl methacrylate or methacryhc acid and cu ⁇ ng agents, with cure or polymerization being effected through a free radical polymerization mechanism
- the adhesives preferably contain one or more polyme ⁇ c mate ⁇ als which may or may not be reactive, that is, capable of being polymerized per se or at least capable of interpolyme ⁇ zing with the reactive monomers, such as grafting onto or crosslmking the growing polymers from the reactive monomer polymerization.
- the adhesives can contain other additives for improving adhesion to substrate mate ⁇ als, environmental resistance, impact strength, flexibility, heat resistance, and the like.
- P.C.T. Publication WO 97/39074 discloses the use of at least one polyme ⁇ c mate ⁇ al which can act as a toughening agent in an acrylic adhesive such as polychloroprene, polymer- ln-monomer syrup, chlorosulphonated polyethylene rubber, copolymers of butadiene and at least one monomer copolyme ⁇ zable therewith, for example, styrene, acrylonit ⁇ le, methacrylonitrile (e.g.
- functional monomer such as acrylic acid, methacryhc acid, maleic anhydride, fumaric acid, styrene, and methyl methacrylate to give, for example, methacrylate-terminated polybutadiene homopolymers and/or copolymers.
- the '419 patent further describes acrylic adhesives with olefinic monomer, olefinic urethane reaction product of an isocyanate- functional prepolymer and a hydroxy-functional monomer, phosphorus-containing compounds, an oxidizing agent and a free radical source.
- These tougheners represented by the formulae for polymer A or polymer B in claim 1 are referred to herein as "olefinic-terminated liquid elastomer produced from a hydroxyl-terminated polyalkadiene” or, alternatively, as “isocyanate-capped methacrylate-terminated polyalkadiene produced from a hydroxyl-terminated polyalkadiene”.
- the composition also includes a free radical- polymerizable monomer such as an olefinic monomer and, optionally, a second polymeric mate ⁇ al.
- the composition is an adhesive that also includes a phosphorus-containing compound and an ambient temperature-active redox catalyst.
- the '834 patent desc ⁇ bes polymers A and B with a number average molecular weight of about 1,500 to 10,000, preferably about 1,500 to 6,000.
- an adhesive that has a lower or less objectionable odor.
- an adhesive that includes a free radical-polymenzable monomer component that includes at least a reaction product of a (hydroxy)acrylate with an anhyd ⁇ de but is substantially free of methyl methacrylate or methacryhc acid.
- the free radical-polymenzable monomer component typically is a mixture of free radical-polymenzable that at least includes a monomer that is a reaction product of a (hydroxy)acrylate with an anhydnde.
- This reaction product allows for the removal from the adhesive formulation of at least one of methyl methacrylate, methacryhc acid or other offensive odo ⁇ ferous monomers.
- the adhesive compositions are substantially free of at least methyl methacrylate or methacryhc acid because the use of these ingredients in amounts as little as 2 or 3 weight percent results in offensive odor emissions in certain applications.
- substantially free of methyl methacrylate or methacryhc acid is used herein, it is intended to mean trace amounts or amounts less than an offensive odor generating amount which can be as little as 2 or 3 weight percent of the total formulation.
- the odor of methacryhc acid can be particularly offensive.
- the monomer component can include methylmethacrylate but is substantially free of methacryhc acid
- the (hydroxy) acrylate compound utilized to prepare the reaction product included in the monomer component of the invention can be any acrylate compound charactenzed by the presence of a hydroxy group
- suitable hydroxy-functional acrylate compounds include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2- hydroxypropyl methacrylate, 2-hydroxybutyl acrylate, 2-hydroxybutyl methacrylate, 3- hydroxypropyl acrylate, 4-hydroxybutyl acrylate, 3-hydroxypentyl acrylate, 6-hydroxynonyl acrylate, 3-hydroxypropyl methacrylate, 2-hydroxypentyl methacrylate, 5-hydroxypentyl methacrylate, 7-hydroxyheptyl methacrylate, 5-hydroxydecyl methacrylate, N-hydroxymethyl acrylamide, N-hydroxymethyl methacrylamide, diethylene glycol monoacrylate, diethylene glycol monomethacrylate, glycenn dime
- lactone-acrylate adducts lactone-modified acrylate or methacrylate acid esters
- lactone-acrylate adducts lactone-modified acrylate or methacrylate acid esters
- Lactones employed in the preparation of the lactone- acrylate adducts may be the same as the lactones defined above with respect to the preparation of the lactone-based polyester polyols
- An example of a lactone-acrylate adduct is a 2-hydroxyethyl acrylate-caprolactone adduct such as TONE M-100 supplied by Union Carbide Corporation
- the anhyd ⁇ de that is reacted with the (hydroxy)acrylate compound can be maleic anhyd ⁇ de, succinic anhyd ⁇ de, phathahc anhydnde, alkylsuccmic anhydnde, alkenylsuccinic anhydnde and the like
- the preferred reaction product is monomethacryloyloxyethyl phthalate commercially available from International Specialty Chemicals under the trade designation BISOMER EMP
- Representative olefinic monomers include esters of (meth)acryl ⁇ c acid such as ethyl methacrylate, butyl methacrylate, butyl acrylate, cyclohexyl acrylate, hexyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, ethyl acrylate, diethylene glycol dimethacrylate, dicyclopentadienyloxyethyl methacrylate, cyclohexyl methacrylate, lauryl methacrylate, glycidyl methacrylate and tetrahydrofurfuryl methacrylate; acrylic acid; substituted (meth)acryhc acids such as itaconic acid, acrylonit ⁇ le, methacrylonitnle, acrylamide and methacrylamide; styrene; substituted styrenes such as vinyl styrene, chlorostyrene, methyl st
- a mixture of the (hydroxy)acrylate/anhydnde reaction product with at least one other of the above-descnbed free radical-polymenzable monomers is preferred.
- a combination of tetrahydrofurfuryl methacrylate (THFMA) and monomethacryloyloxyethyl phthalate is most preferred.
- the free radical-polymenzable monomer component is present in an amount of 10-90 % by weight of the pnncipal components.
- the "pnncipal components" are the free radical-polymenzable monomer component, an adhesion promoter, and at least one toughener or toughening agent.
- Any amount of the (hydroxy)acrylate/anhydnde reaction product can be present, but about 0.5 to 20 weight percent, more preferably 1.5 to 10 weight percent, is preferred, based on the total weight of the adhesive part that includes the free radical-polymenzable monomer component.
- the adhesive composition also can include 0-20% by weight of the pnncipal components of an adhesion promoter.
- An adhesion promoter is any adhesion promoter known to those of ordinary skill in the art as useful in promoting adhesion in acrylic adhesives.
- Preferred adhesion promoters are phosphorus-containing compounds that enhance metal adhesion and may be any derivative of phosphinic acid, phosphonic acid or phosphoric acid having at least one P — OH group and at least one organic moiety characterized by the presence of an olefinic group, which is preferably terminally located. A listing of such phosphorus compounds is found in U.S. Pat. No. 4,223,115.
- a preferred phosphorus- containing compound has a structure that may be represented by the formula:
- R 20 is selected from the group consisting of hydrogen, an alkyl group having from one to 8, preferably one to 4, carbon atoms, and CH 2 CH-;
- R 21 is selected from the group consisting of hydrogen, an alkyl group having from one to 8, preferably one to 4 carbon atoms;
- A is selected from the group consisting of — R 22 O — and R 23 O) n , wherein R 22 is an aliphatic or cycloaliphatic alkylene group containing from one to 9, preferably 2 to 6, carbon atoms;
- R 23 is an alkylene group having from one to 7, preferably 2 to 4, carbon atoms;
- n is an integer from 2 to 10, and m is one or 2, preferably one.
- Phosphorus-containing compounds having vinyl unsaturation are prefe ⁇ ed over such compounds having allylic unsaturation, with monoesters of phosphinic, phosphonic and phosphoric acids having one unit of vinyl or allylic, especially vinyl, unsaturation presently being preferred.
- Representative phosphorus-containing compounds include, without limitation, phosphoric acid; 2-methacryloyloxyethyl phosphate; bis-(2-
- SUBST ⁇ JTE SHEET RULE 26 methacryloxyloxyethyl) phosphate; 2-acryloyloxyethyl phosphate; bis-(2-acryloyloxyethyl) phosphate; methyl-(2-methacryloyloxyethyl) phosphate; ethyl methacryloyloxyethyl phosphate; methyl acryloyloxyethyl phosphate; ethyl acryloyloxyethyl phosphate; compounds of the above formula wherein R 8 is hydrogen or methyl and R 9 is propyl, isobutyl, ethylhexyl, halopropyl, haloisobutyl or haloethylhexyl; vinyl phosphonic acid; cyclohexene-3-phosphonic acid; alphahydroxybutene-2 phosphonic acid; 1 -hydroxy- l-phenylmethane-l,l-diphosphonic acid
- the adhesive composition also can include about 10-80% by weight of a toughener or toughening agent, based on the principal components.
- the toughening agent typically is a polymeric material that provides improved impact and shatter resistance to the resultant adhesive and decreases brittleness.
- the polymeric material may or may not include an olefinically unsaturated structure that is capable of being polymerized per se or copolymerized with at least one of the free radical polymerizable monomers described above.
- the polymeric material can be for example, various solid and liquid elastomeric polymeric materials, and in particular liquid olefinic-terminated elastomers as described in U.S. Patent Nos.
- Representative liquid olefinic-terminated elastomers disclosed in P.C.T. Publication WO 97/39074 include homopolymers of butadiene, copolymers of butadiene and at least one monomer copolymerizable therewith, for example, styrene, acrylonitrile, methacrylonitrile (e.g.
- functional monomer such as acrylic acid, methacryhc acid, maleic anhydride, fumaric acid, styrene, and methyl methacrylate to give, for example, methacrylate-terminated polybutadiene homopolymers and/or copolymers.
- the present invention may also include an ambient temperature reactive catalyst system.
- the ambient temperature-reactive catalyst systems that may be employed in the preferred adhesive systems are well-known redox couple systems and need not be discussed herein in detail. Basically, such systems comprise at least one oxidizing agent and at least one reducing agent which are co-reactive at room temperature to generate free radicals effective to initiate addition polymerization reactions and cure the adhesive. Substantially any of the known oxidizing and reducing agents which are so co-reactive can be employed.
- oxidizing agents include, without limitation, organic peroxides, such as benzoyl peroxide and other diacyl peroxides, hydroperoxides such as cumene hydroperoxide, peresters such as ⁇ -butylperoxybenzoate; ketone hydroperoxides such as methyl ethyl ketone hydroperoxide, organic salts of transition metals such as cobalt naphthenate, and compounds containing a labile chlorine such as sulfonyl chloride.
- organic peroxides such as benzoyl peroxide and other diacyl peroxides
- hydroperoxides such as cumene hydroperoxide, peresters such as ⁇ -butylperoxybenzoate
- ketone hydroperoxides such as methyl ethyl ketone hydroperoxide
- organic salts of transition metals such as cobalt naphthenate
- compounds containing a labile chlorine such as sulfonyl
- Representative reducing agents include, without limitation, sulfinic acids; azo compounds such as azoisobutyric acid dinitrile; alpha-aminosulfones such as bis(tolysulfonmethyl)-benzyl amine; tertiary amines such as diisopropanol-p-toluidine (DIIPT), dimethyl aniline, p-halogenated aniline derivatives and dimethyl-p-toluidine; and aminealdehyde condensation products, for example, the condensation products of aliphatic aldehydes such as butyraldehyde with primary amines such as aniline or butylamine.
- aminealdehyde condensation products for example, the condensation products of aliphatic aldehydes such as butyraldehyde with primary amines such as aniline or butylamine.
- the oxidizing agent will be present in an amount in the range from about 0.5 to about 50 percent by weight of bonding accelerator, with the amount of reducing agent being in the range from about 0.05 to about 10 preferably about 0.1 to about 6, percent by weight of polymerizable adhesive composition.
- DIIPT is the most preferred reducing agent.
- the most preferred oxidizing agent is benzoyl peroxide.
- the adhesive of the present invention may take many forms, the most preferred adhesive systems are provided as multipack or two-part adhesive systems where one package or part contains the free radical-polymerizable monomer component and the reducing agent and a second part or package contains the oxidizing agent.
- the two parts are mixed together at the time of use in order to initiate the reactive cure. After mixing the individual parts, one or both surfaces to be joined are coated with the mixed adhesive system and the surfaces are placed in contact with each other.
- the second package or part can include a bonding activator that includes the oxidizing agent for the redox catalyst system.
- the bonding activator can include:
- the carrier vehicles which are suitable for use in the bonding activators can be a simple inert solvent or diluent such as methylene chloride, or butyl benzyl phthalate, including mixtures of such solvents or diluents.
- the carrier vehicle should contain no more than 5% by weight of any moiety which is reactive with the oxidizing agent at room temperature.
- the carrier vehicle can be a more complex mixture including at least one film- forming binder in addition to inert solvent or diluent.
- the carrier vehicle can contain, in addition to solvent or solvent and film-forming binder, additives such as external plasticizers, flexibilizers, suspenders and stabilizers, providing that any such additives do not unacceptably adversely affect the stability of the activator composition.
- An exemplary two part system includes:
- the adhesive systems of the invention may be used to bond metal surfaces, such as steel, aluminum and copper, to a vanety of substrates, including metal, plastics, and other polymers, reinforced plastics, fibers, glass, ceramics, wood and the like. It is a feature of the present invention that the herein-desc ⁇ bed adhesive compositions can be employed to bond metal substrates such as steel, aluminum and copper with little, if any, pretreatment of the metal surface pnor to application of the adhesive.
- the adhesive systems of this invention provide effective bonding at room temperature, thus heat is not required either for applying the adhesive systems to the substrates or for curing.
- the adhesives of the present invention are preferred for bonding metal surfaces
- the present adhesive compositions may be applied as an adhesive, primer or coating to any surface or substrate capable of receiving the adhesive.
- the metals which are preferred for bonding with the present adhesives include zinc, copper, cadmium, iron, tin, aluminum, silver, chromium, alloys of such metals, and metallic coatings or platings of such metals such as galvanized steel including hot dipped, electrogalvanized steel and galvanealed steel.
- the adhesive coatings may be brushed, rolled, sprayed, dotted, knifed or otherwise applied to one substrate, but preferably to both substrates to desired thickness preferably not to exceed 60 mils.
- the substrates may be clamped for firmness during cure in those installations where relative movement of the two substrates might be expected.
- an adherent quantity of the adhesive composition is applied to one surface, preferably to both surfaces, and the surfaces are confronted with the adhesive composition therebetween.
- the adhesive should have a thickness less than 60 mils for optimum results.
- the smoothness of the surfaces and their clearance (e.g., in the case of nuts and bolts) will determine the required film thickness for optimum bonding.
- the two metal surfaces and the interposed adhesive composition are maintained in engagement until the said adhesive composition has cured sufficiently to bond the said surfaces.
- EUROPRENETM was added to the masterbatch as set forth in the table below
- the EUROPRENETM polymer, EUROPRENETM SOL T 193A, used was a commercial product of EniChem Elastomers Ame ⁇ cas, Inc.
- EUROPRENETM SOL T 193A is a terblock polymer of styrene and isoprene with polystyrene blocks (25 parts by weight) at the ends and polyisoprene block at the center (75 parts by weight). It is a rubbery solid polymer and has a pellet form.
- EUROPRENETM SOL T 193 A has a reasonable solubility in THFMA A 20 part by weight solution of EUROPRENETM SOL T 193 A in THFMA has been used for formulation convenience.
- TABLE I EUROPRENETM Ladder vs. T-Peel Property
- the above four formulations were prepared in 4 oz. polyethylene jars and allowed to age overnight.
- the formulations were loaded into two-part dispensing equipment (4: 1 side A:side B mix ratio by volume).
- the curative (side B) used here was a benzoyl peroxide containing curing agent.
- the substrate (1" x 4" x 0.032") tested was galvanealed steel.
- the coupons were bent one inch from the end to give a 90 degree angle.
- the coupons were treated with an aqueous lubricant (Chempet 4465 available from ADCHEM) with acid brush according to the following preparation for blank wash:
- T-peel samples were assembled and allowed to cure at room temperature overnight, then postbaked at 325°F for 20 min., cooled at room temperature for 60 min., postbaked again at 250°F for 30 min. After 4 hours of cooling at room temperature, T-peel test was performed on the Instron (Model 4204) at a 2.0 in/min at room temperature. The T-peel test results are shown below:
- Versilok® 262 is a structural adhesive commercially available from Lord Corporation that does not include two distinct tougheners of different M w or EUROPRENE. "COH” designates cohesive (substrate) failure, “TCOH” designates a thin layer of cohesive (substrate) failure and “ADH” designates adhesive failure.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Cette invention se rapporte à une composition d'adhésif, qui contient un constituant monomère polymérisable par radicaux libres, qui renferme un produit de réaction d'un (hydroxy)acrylate avec un anhydride et qui est sensiblement exempt au moins de méthylméthacrylate ou d'acide méthacrylique. Cette composition adhésive se caractérise par une odeur désagréable sensiblement réduite.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/330,106 US6559257B2 (en) | 1998-06-12 | 1999-06-10 | Adhesive formulations |
| US330106 | 1999-06-10 | ||
| PCT/US2000/015639 WO2000077109A2 (fr) | 1999-06-10 | 2000-06-07 | Formulations d'adhesifs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1190011A2 true EP1190011A2 (fr) | 2002-03-27 |
Family
ID=23288334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP00938197A Withdrawn EP1190011A2 (fr) | 1999-06-10 | 2000-06-07 | Formulations d'adhesifs |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1190011A2 (fr) |
| AU (1) | AU5327300A (fr) |
| BR (1) | BR0011465A (fr) |
| CA (1) | CA2376644A1 (fr) |
| MX (1) | MXPA01011623A (fr) |
| WO (1) | WO2000077109A2 (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1239015A1 (fr) * | 2001-03-08 | 2002-09-11 | Sika AG, vorm. Kaspar Winkler & Co. | Compositions d'adhésifs methacryliques aisées à préparer |
| EP1239016A1 (fr) * | 2001-03-08 | 2002-09-11 | Sika AG, vorm. Kaspar Winkler & Co. | Compositions methacryliques élastiques adhésives |
| US20070155899A1 (en) * | 2005-12-21 | 2007-07-05 | Ips Corporation | Elastic methacrylate compositions |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5744638A (en) * | 1980-09-01 | 1982-03-13 | Adeka Argus Chem Co Ltd | Production of adhesive resin composition |
| JP2642554B2 (ja) * | 1991-12-27 | 1997-08-20 | 電気化学工業株式会社 | 接着剤組成物 |
| JPH0673241A (ja) * | 1992-08-26 | 1994-03-15 | Mitsubishi Petrochem Co Ltd | 樹脂組成物 |
| JP2002517595A (ja) * | 1998-06-12 | 2002-06-18 | ロード コーポレーション | 接着剤組成物 |
-
2000
- 2000-06-07 WO PCT/US2000/015639 patent/WO2000077109A2/fr not_active Ceased
- 2000-06-07 CA CA002376644A patent/CA2376644A1/fr not_active Abandoned
- 2000-06-07 BR BR0011465-0A patent/BR0011465A/pt not_active Application Discontinuation
- 2000-06-07 MX MXPA01011623A patent/MXPA01011623A/es unknown
- 2000-06-07 AU AU53273/00A patent/AU5327300A/en not_active Abandoned
- 2000-06-07 EP EP00938197A patent/EP1190011A2/fr not_active Withdrawn
Non-Patent Citations (1)
| Title |
|---|
| See references of WO0077109A3 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2376644A1 (fr) | 2000-12-21 |
| BR0011465A (pt) | 2002-03-19 |
| WO2000077109A2 (fr) | 2000-12-21 |
| MXPA01011623A (es) | 2002-06-04 |
| WO2000077109A3 (fr) | 2001-02-08 |
| AU5327300A (en) | 2001-01-02 |
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