[go: up one dir, main page]

EP1039977A1 - Procede permettant d'eliminer les contaminants de surface de moules utilises sur des outils d'encapsulation de semiconducteurs - Google Patents

Procede permettant d'eliminer les contaminants de surface de moules utilises sur des outils d'encapsulation de semiconducteurs

Info

Publication number
EP1039977A1
EP1039977A1 EP98936795A EP98936795A EP1039977A1 EP 1039977 A1 EP1039977 A1 EP 1039977A1 EP 98936795 A EP98936795 A EP 98936795A EP 98936795 A EP98936795 A EP 98936795A EP 1039977 A1 EP1039977 A1 EP 1039977A1
Authority
EP
European Patent Office
Prior art keywords
laser
mould
contaminants
recited
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98936795A
Other languages
German (de)
English (en)
Other versions
EP1039977A4 (fr
Inventor
Wendong Song
Yongfeng Lu
Qiong Chen
Huck Wee Tay
Teik Hing Thomas Hwa
Lui Ching Dawn Lim
Jason Yan Koon Ngin
Jason Yak Hui Sim
Cheng Pak Gow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Data Storage Institute
Advanced Systems Automation Ltd Singapore
Original Assignee
Data Storage Institute
Advanced Systems Automation Ltd Singapore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Data Storage Institute, Advanced Systems Automation Ltd Singapore filed Critical Data Storage Institute
Publication of EP1039977A1 publication Critical patent/EP1039977A1/fr
Publication of EP1039977A4 publication Critical patent/EP1039977A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser

Definitions

  • FIG. 4 is an Auger Electron Spectroscopy (AES) spectrum graph illustrating the depth profile of a contaminant layer typically found on moulds used in semiconductor packaging machines before undergoing the laser cleaning process of the present invention.
  • FIG. 5 is an Auger Electron Spectroscopy (AES) spectrum graph illustrating the depth profile of a contaminant layer typically found on moulds used in semiconductor packaging machines after undergoing the laser cleaning process of the present invention.
  • AES Auger Electron Spectroscopy

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cleaning In General (AREA)
  • Laser Beam Processing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

L'invention concerne un laser utilisé pour éliminer des contaminants de surface, tels que graisse, cire et résidus de résine, d'un moule utilisé sur des outils d'encapsulation de semiconducteurs. Le procédé d'élimination des contaminants au moyen d'un laser consiste à diriger un faisceau laser sur la surface du moule portant les contaminants. Le laser est envoyé sous forme d'impulsion de courte durée. Des impulsions multiples peuvent être nécessaires afin d'éliminer complètement les contaminants. Etant donné que la superficie couverte par chaque impulsion est habituellement très inférieure à la superficie totale de la surface du moule, le laser doit balayer la surface du moule jusqu'à ce que celle-ci ait été entièrement exposée au laser. Etant donné que la désintégration des contaminants par le laser produit des émanations, il est préférable d'utiliser un aspirateur afin d'éliminer les gaz résiduels et autres déchets.
EP98936795A 1997-12-18 1998-07-06 Procede permettant d'eliminer les contaminants de surface de moules utilises sur des outils d'encapsulation de semiconducteurs Withdrawn EP1039977A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SG1997004544A SG78282A1 (en) 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools
SG9704544 1997-12-18
PCT/SG1998/000058 WO1999030845A1 (fr) 1997-12-18 1998-07-06 Procede permettant d'eliminer les contaminants de surface de moules utilises sur des outils d'encapsulation de semiconducteurs

Publications (2)

Publication Number Publication Date
EP1039977A1 true EP1039977A1 (fr) 2000-10-04
EP1039977A4 EP1039977A4 (fr) 2003-08-13

Family

ID=20429813

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98936795A Withdrawn EP1039977A4 (fr) 1997-12-18 1998-07-06 Procede permettant d'eliminer les contaminants de surface de moules utilises sur des outils d'encapsulation de semiconducteurs

Country Status (7)

Country Link
EP (1) EP1039977A4 (fr)
JP (1) JP2002508249A (fr)
CN (1) CN1210113C (fr)
MY (1) MY136708A (fr)
SG (1) SG78282A1 (fr)
TW (1) TW480689B (fr)
WO (1) WO1999030845A1 (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4630442B2 (ja) * 2000-10-19 2011-02-09 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
TW552188B (en) * 2001-11-16 2003-09-11 Towa Corp Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin
JP3789349B2 (ja) * 2001-11-16 2006-06-21 Ｔｏｗａ株式会社 樹脂成形用金型のクリーニング方法及び装置
JP2004230750A (ja) * 2003-01-31 2004-08-19 Sumitomo Heavy Ind Ltd 金型クリーニング方法及び金型クリーニング装置
KR100626037B1 (ko) 2004-11-18 2006-09-20 삼성에스디아이 주식회사 마스크 세정방법
JP2006317726A (ja) * 2005-05-13 2006-11-24 Nec Lcd Technologies Ltd 断線修正方法及びアクティブマトリックス基板の製造方法並びに表示装置
JP5314876B2 (ja) * 2006-11-22 2013-10-16 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
CN104043617A (zh) * 2014-05-19 2014-09-17 南京南车浦镇城轨车辆有限责任公司 金属表面油污激光清洗设备
CA3037584A1 (fr) * 2016-09-26 2018-03-29 Saint-Gobain Glass France Dispositif et procede pour former un revetement fonctionnel structure sur une couche de verre incurvee
GB201701607D0 (en) * 2017-01-31 2017-03-15 Advanced Laser Tech Ltd Scanning and cleaning of moulds
CN107377532A (zh) * 2017-08-25 2017-11-24 济南高能清扬激光清洗有限公司 一种橡胶制品模具的复合清洗方法
CN108816960B (zh) * 2018-06-14 2020-06-26 爱阔特(上海)清洗设备制造有限公司 一种半导体光刻板清洗装置
CN108807129B (zh) * 2018-06-21 2020-09-01 北京蜃景光电科技有限公司 镀膜腔室清洗装置及镀膜腔室清洗方法
CN108787631A (zh) * 2018-07-09 2018-11-13 江苏峰钛激光科技有限公司 一种重锈蚀层的激光清洗方法
JP2020006600A (ja) * 2018-07-10 2020-01-16 Ｔｏｗａ株式会社 成形型クリーニング装置及び方法、樹脂成形装置、並びに樹脂成形品製造方法
JP6930946B2 (ja) * 2018-07-10 2021-09-01 Ｔｏｗａ株式会社 成形型クリーニング装置、成形型クリーニング方法、樹脂成形装置、及び樹脂成形品製造方法
CN111375603A (zh) * 2018-12-29 2020-07-07 膳魔师（江苏）家庭制品有限公司 一种保温杯的褪漆方法及装置
CN110303009B (zh) * 2019-06-26 2020-10-16 深圳市华星光电技术有限公司 紫外光清洁装置
KR102249069B1 (ko) * 2020-01-14 2021-05-07 주식회사 아이엠티 반도체 금형 레이저 세정 장치
JP7614987B2 (ja) * 2021-09-14 2025-01-16 株式会社東芝 表面浄化方法および表面浄化システム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD242760A1 (de) * 1985-11-19 1987-02-11 Akad Wissenschaften Ddr Verfahren zur pruefung der reinheit von substratoberflaechen und zur reinigung derselben
ATE60736T1 (de) * 1986-02-14 1991-02-15 Amoco Corp Behandlung von geformten oberflaechen mit ultraviolettlaser.
DE3721940A1 (de) * 1987-07-02 1989-01-12 Ibm Deutschland Entfernen von partikeln von oberflaechen fester koerper durch laserbeschuss
JPH01122417A (ja) * 1987-11-06 1989-05-15 Rohm Co Ltd 合成樹脂モールド用金型の清掃方法
US5023424A (en) * 1990-01-22 1991-06-11 Tencor Instruments Shock wave particle removal method and apparatus
US5373140A (en) * 1993-03-16 1994-12-13 Vernay Laboratories, Inc. System for cleaning molding equipment using a laser
IT1282722B1 (it) * 1996-03-01 1998-03-31 Pirelli Metodo ed apparato per la pulitura di stampi di vulcanizzazione di articoli in materiale elastomerico

Also Published As

Publication number Publication date
TW480689B (en) 2002-03-21
EP1039977A4 (fr) 2003-08-13
MY136708A (en) 2008-11-28
CN1282277A (zh) 2001-01-31
JP2002508249A (ja) 2002-03-19
SG78282A1 (en) 2001-02-20
WO1999030845A1 (fr) 1999-06-24
CN1210113C (zh) 2005-07-13

Similar Documents

Publication Publication Date Title
EP1039977A1 (fr) Procede permettant d'eliminer les contaminants de surface de moules utilises sur des outils d'encapsulation de semiconducteurs
KR102623538B1 (ko) 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
US4937421A (en) Laser peening system and method
EP1586405B1 (fr) Methode de formation d'une struture periodique sur une surface d'un materiau
US7170029B2 (en) Method and apparatus for deflashing of integrated circuit packages
US6291796B1 (en) Apparatus for CFC-free laser surface cleaning
JPH02182389A (ja) レーザによる切除方法
JPH06198475A (ja) 連続波紫外線照射による有機固形物の切断法
JP2003504836A (ja) 成形バリ除去方法および装置
JP2025157445A (ja) コンクリートの表面処理方法
JPS60216989A (ja) レ−ザビ−ム加工装置
WO2006027850A1 (fr) Procede d'amelioration de l'adherence d'une couche mince
KR100953185B1 (ko) 비축-회전 광학계를 이용한 레이저의 조사 방법 및 장치,이를 이용한 필름 레지스터의 트리밍 방법 및 장치, 그리고인쇄회로기판의 제조 방법
WO1999030844A1 (fr) Systeme d'enlevement de contaminants de surface sur des moules utilises pour le conditionnement de semi-conducteurs
WO1999065061A2 (fr) Dispositif laser portatif destine au nettoyage de machines d'encapsulation pour semi-conducteurs
KR102282264B1 (ko) 웨이퍼의 가공 방법
JP4829748B2 (ja) バリ取り装置及びバリ取り方法、並びに樹脂製品の製造方法
US20070095802A1 (en) Laser treatment apparatus
JP2682230B2 (ja) レーザ加工方法
US20070127029A1 (en) Laser treatment apparatus
KR19990062418A (ko) 반도체 패키징 도구에서 이용되는 주형에서, 표면 오염 물질을제거하기 위한 시스템.
KR19990062423A (ko) 반도체 포장기구에 사용되는 주형의 표면오염을 제거하기 위한방법
Lu et al. Laser cleaning of IC mould and its real-time monitoring
Toenshoff et al. Absorption behavior of ceramic materials irradiated with excimer lasers
JPS62118991A (ja) レ−ザバリ取り方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20000707

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE GB NL

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

A4 Supplementary search report drawn up and despatched

Effective date: 20030630

18W Application withdrawn

Effective date: 20030618