EP1083599A3 - Dispositif semiconducteur de puissance - Google Patents

Dispositif semiconducteur de puissance Download PDF

Info

Publication number: EP1083599A3
Authority: EP; European Patent Office
Prior art keywords: power semiconductor; semiconductor module; substrate; contact surfaces; pressing device
Prior art date: 1999-09-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP00119604A

Other languages

German (de)

English (en)

Other versions

EP1083599B1 (fr

EP1083599A2 (fr

Inventor

Georg Dr.-Ing. Fromme

Joseph Dipl.-Ing. Suchanek

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

STILL GmbH

Original Assignee

STILL GmbH

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-09-08

Filing date

2000-09-07

Publication date

2005-12-14

2000-09-07 Application filed by STILL GmbH filed Critical STILL GmbH

2001-03-14 Publication of EP1083599A2 publication Critical patent/EP1083599A2/fr

2005-12-14 Publication of EP1083599A3 publication Critical patent/EP1083599A3/fr

2007-07-25 Application granted granted Critical

2007-07-25 Publication of EP1083599B1 publication Critical patent/EP1083599B1/fr

2020-09-07 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Power Conversion In General (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Bipolar Transistors (AREA)
Inverter Devices (AREA)

EP00119604A 1999-09-08 2000-09-07 Dispositif semiconducteur de puissance Expired - Lifetime EP1083599B1 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE19942915A DE19942915A1 (de)	1999-09-08	1999-09-08	Leistungshalbleitermodul
DE19942915		1999-09-08

Publications (3)

Publication Number	Publication Date
EP1083599A2 EP1083599A2 (fr)	2001-03-14
EP1083599A3 true EP1083599A3 (fr)	2005-12-14
EP1083599B1 EP1083599B1 (fr)	2007-07-25

Family

ID=7921236

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP00119604A Expired - Lifetime EP1083599B1 (fr)	1999-09-08	2000-09-07	Dispositif semiconducteur de puissance

Country Status (3)

Country	Link
EP (1)	EP1083599B1 (fr)
AT (1)	ATE368301T1 (fr)
DE (2)	DE19942915A1 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE10102359A1 (de)	2001-01-19	2002-08-01	Siemens Ag	Schaltungsanordnung mit in Chips angeordneten Halbleiterbauelementen
DE10141114C1 (de) *	2001-06-08	2002-11-21	Semikron Elektronik Gmbh	Schaltungsanordnung
DE10137666A1 (de) *	2001-08-01	2003-02-27	Infineon Technologies Ag	Schutzvorrichtung für Baugruppen und Verfahren zu ihrer Herstellung
DE10137618A1 (de) *	2001-08-01	2003-02-27	Infineon Technologies Ag	Schutzvorrichtung für Baugruppen
DE10142971A1 (de) *	2001-09-01	2003-03-27	Eupec Gmbh & Co Kg	Leistungshalbleitermodul
DE10149886A1 (de) *	2001-10-10	2003-04-30	Eupec Gmbh & Co Kg	Leistunghalbleitermodul
DE10213648B4 (de) *	2002-03-27	2011-12-15	Semikron Elektronik Gmbh & Co. Kg	Leistungshalbleitermodul
DE10237871B4 (de) *	2002-08-19	2011-05-12	Infineon Technologies Ag	Baugruppensystem
JP4133170B2 (ja) *	2002-09-27	2008-08-13	Ｄｏｗａホールディングス株式会社	アルミニウム−セラミックス接合体
DE10339692A1 (de) *	2003-08-28	2005-03-31	eupec Europäische Gesellschaft für Leistungshalbleiter mbH	Entwärmende Isolationsschicht
DE10343502B4 (de) *	2003-09-19	2008-06-12	Infineon Technologies Ag	Verfahren zum Herstellen einer wärmeleitenden Verbindung
DE10353849B4 (de) *	2003-11-18	2009-05-07	Infineon Technologies Ag	Anpresselement zum Anpressen eines zu kühlenden elektrischen Beuteils an ein Kühlelement, System zum Kühlen eines elektrischen Bauteils, und Bauteilanordnung mit einem zu kühlenden elektrischen Bauteil
DE102004018476B4 (de) *	2004-04-16	2009-06-18	Infineon Technologies Ag	Leistungshalbleiteranordnung mit kontaktierender Folie und Anpressvorrichtung
DE102004042367B4 (de)	2004-09-01	2008-07-10	Infineon Technologies Ag	Leistungshalbleitermodul
DE102004043019A1 (de)	2004-09-06	2006-03-23	eupec Europäische Gesellschaft für Leistungshalbleiter mbH	Baugruppe
DE102009002191B4 (de)	2009-04-03	2012-07-12	Infineon Technologies Ag	Leistungshalbleitermodul, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung
DE102009053999A1 (de) *	2009-11-19	2011-05-26	Still Gmbh	Umrichter mit einem Kühlkörper
DE102009053997A1 (de)	2009-11-19	2011-05-26	Still Gmbh	Umrichter
DE102009053998A1 (de)	2009-11-19	2011-05-26	Still Gmbh	Umrichter, insbesondere mehrphasiger Drehstromumrichter
DE102010002627B4 (de)	2010-03-05	2023-10-05	Infineon Technologies Ag	Niederinduktive Leistungshalbleiterbaugruppen
DE102011078811B3 (de) *	2011-07-07	2012-05-24	Semikron Elektronik Gmbh & Co. Kg	Leistungselektronisches System mit einer Kühleinrichtung
DE102020131009A1 (de)	2020-11-24	2022-05-25	Still Gesellschaft Mit Beschränkter Haftung	Umrichter und Verfahren zu seiner Herstellung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3508456A1 (de) *	1985-03-09	1986-09-11	Brown, Boveri & Cie Ag, 6800 Mannheim	Leistungshalbleitermodul
US4853762A (en) *	1986-03-27	1989-08-01	International Rectifier Corporation	Semi-conductor modules
DE19707514A1 (de) *	1997-02-25	1998-08-27	Eupec Gmbh & Co Kg	Halbleitermodul
DE19715540A1 (de) *	1997-04-15	1998-10-22	Curamik Electronics Gmbh	Verfahren zum Herstellen eines gewölbten Metall-Keramik-Substrates

1999
- 1999-09-08 DE DE19942915A patent/DE19942915A1/de not_active Withdrawn
2000
- 2000-09-07 EP EP00119604A patent/EP1083599B1/fr not_active Expired - Lifetime
- 2000-09-07 AT AT00119604T patent/ATE368301T1/de not_active IP Right Cessation
- 2000-09-07 DE DE50014506T patent/DE50014506D1/de not_active Expired - Lifetime

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3508456A1 (de) *	1985-03-09	1986-09-11	Brown, Boveri & Cie Ag, 6800 Mannheim	Leistungshalbleitermodul
US4853762A (en) *	1986-03-27	1989-08-01	International Rectifier Corporation	Semi-conductor modules
DE19707514A1 (de) *	1997-02-25	1998-08-27	Eupec Gmbh & Co Kg	Halbleitermodul
DE19715540A1 (de) *	1997-04-15	1998-10-22	Curamik Electronics Gmbh	Verfahren zum Herstellen eines gewölbten Metall-Keramik-Substrates

Also Published As

Publication number	Publication date
DE50014506D1 (de)	2007-09-06
DE19942915A1 (de)	2001-03-15
ATE368301T1 (de)	2007-08-15
EP1083599B1 (fr)	2007-07-25
EP1083599A2 (fr)	2001-03-14

Publication	Publication Date	Title
EP1083599A3 (fr)	2005-12-14	Dispositif semiconducteur de puissance
WO2003017326A3 (fr)	2003-05-15	Procedes de fiabilisation de niveau de tranche de dispositifs electroniques
TW355913B (en)	1999-04-11	Heat conductive substrate mounted in PC board hole for transferring heat from IC to heat sink
EP0870325A4 (fr)	1998-10-14
EP1261028A3 (fr)	2005-05-11	Arrangement de dissipation de chaleur pour dispositif électronique
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EP1267402A3 (fr)	2005-09-28	Dispositif semi-conducteur et méthode de fabrication associée
WO2005057674A3 (fr)	2005-11-10	Module thermoelectrique avec echangeur de chaleur directement soude
EP1635405A3 (fr)	2009-06-03	Module thermoélectrique à couche mince
EP1005086A3 (fr)	2001-01-03	Feuille métallique comprenant des plots de contact, substrat de circuit comprenant la feuille métallique, et dispositif sémiconducteur comprenant le substrat de circuit
CA2329816A1 (fr)	2001-07-20	Support de plaquettes pour appareil de fabrication de semiconducteurs, methode de fabrication du support de plaquettes et appareil de fabrication de semiconducteurs
EP1267401A3 (fr)	2005-09-28	Dispositif semi-conducteur et méthode de fabrication associée
SG102032A1 (en)	2004-02-27	Semiconductor device and method of its manufacture
HUP9901430A2 (hu)	1999-08-30	Multicsip modul
RU2008103648A (ru)	2009-08-10	Электронная плата с встроенным нагревательным сопротивлением
EP1701380A3 (fr)	2008-12-31	Module semi-conducteur de puissance
EP1115086A3 (fr)	2002-02-13	Carte à puce sans contact et son procédé de fabrication
CN105472879A (zh)	2016-04-06	一种alc pcb板的辅助焊接结构及其制备工艺
DE59506182D1 (de)	1999-07-15	Elektrisches heizelement
WO2005053361A3 (fr)	2005-07-28	Procede pour fixer un fil de connexion electrique sur un element de surface, et element chauffant, notamment pour un systeme de pulverisation de matiere plastique
EP1293283A3 (fr)	2004-03-24	Méthode pour l'application locale de brasure sur des aires préchoisies de circuits imprimés
WO2003025889A1 (fr)	2003-03-27	Dispositif electronique, son procede de production et appareil electronique
EP1080922A3 (fr)	2001-06-06	Tête d'impression thermique à couches épaisses et son procédé de fabrication
JP2008041953A5 (fr)	2009-08-13
CN101388369A (zh)	2009-03-18	压力接触的三相整流器模块

Legal Events

Date	Code	Title	Description
2001-01-26	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
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