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EP0960553A1 - Procede et machine pour produire des cartes a circuits imprimes souples et semi-rigides - Google Patents

Procede et machine pour produire des cartes a circuits imprimes souples et semi-rigides

Info

Publication number
EP0960553A1
EP0960553A1 EP98964452A EP98964452A EP0960553A1 EP 0960553 A1 EP0960553 A1 EP 0960553A1 EP 98964452 A EP98964452 A EP 98964452A EP 98964452 A EP98964452 A EP 98964452A EP 0960553 A1 EP0960553 A1 EP 0960553A1
Authority
EP
European Patent Office
Prior art keywords
circuit boards
printed circuit
machine
production
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98964452A
Other languages
German (de)
English (en)
Inventor
Thomas Matthaes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resco Srl
Original Assignee
Resco Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resco Srl filed Critical Resco Srl
Publication of EP0960553A1 publication Critical patent/EP0960553A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Definitions

  • the amount of printed circuit boards to be produced per day and the fixed duration of the chemical processes determine the length of these machines with horizontal conveying, which can sometimes reach the length of 30 or 50 meters.
  • a conventional conveyor system with horizontal rollers does not always ensure that the so-called flexible printed circuit boards are properly conveyed.
  • the present invention relates to Machines that subject the circuit boards to a vertical process instead of a horizontal one, inside pools containing chemical products, using a special system of rollers that automatically switch the circuit boards on and off in the various pools.
  • the same conveyor system and the same machine version can be used for the following processes: development, rinsing and drying of photosensitive, both dry and liquid, films; Development of liquid or dry etch resist; Development of the liquid or dry solder mask; chemical etching of the copper that makes up the printed circuit boards, or chemical etching of any other metal used in both Production of printed circuit boards as well as in the production of perforated or milled individual parts with chemical etching (chemical milling); Wiping (removal) of the light-sensitive film or the previously deposited etch resist, be it liquid or dry; Process of chemical micro-etching, process of desosyxadition of copper or other metals, process of passivation or organic protection, process of stripping (chemical removal) of tin or lead or tin
  • the flexible printed circuit board goes into a horizontal position, through two process chambers, in which it is sprayed by means of the development liquid, and then through three development chambers, in which it is sprayed with water and then through a drying zone, this always opens horizontally, which therefore has the disadvantage of a very long machine, with the flexible printed circuit boards tending to be pushed up or down by the nozzles that spray between the rollers.
  • Fig. La is a plan view of the machine according to Fig. 1. There are three in this known machine separate zones can be seen, namely a development zone (1), a rinsing zone (2) and a drying zone (3).
  • the printed circuit boards are introduced vertically into a basin which contains water, and into two basins where they are rinsed with water, and into a third area where they are dried.
  • the flexible printed circuit boards remain in contact with the liquid contained in the tanks instead of being sprayed through the nozzles outdoors, whereby a special transport system constantly moves and renews the chemical development product on the surfaces of the flexible printed circuit boards. The same is done in the zones of rinsing with water, while in the drying zones the warm air is forced to be blown around the flexible circuit boards.
  • the fixed development time of the etch resist that is, the time during which the printed circuit board must be in contact with the development fluid, determines the conventional horizontal machines, the length of the development chamber or chambers; in the exemplary embodiment according to FIG.
  • the length develops vertically, ie the printed circuit board first descends by 600 mm within the basin and rises again by another 600 mm, in total by a 1200 mm distance (ie for the specific development time), but with a horizontal distance of only 380 mm.
  • the conveying of the flexible printed circuit boards and the inner layers (inner layers) is carried out by using a special conveying system (FIG. 3), in which the conveying rollers (R) are particularly close, and in which, in order to avoid a transition of the flexible Printed circuit boards are inserted into the cavities between the rollers, suitable metal deflectors and suitable tongues (known per se) which force the flexible printed circuit boards and the inner layers to always and exactly pass between the pairs of rollers.
  • a special conveying system FIG. 3

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un procédé et une machine permettant de produire des cartes à circuits imprimés, les cartes étant travaillées verticalement au moyen d'un système de transport continu vertical.
EP98964452A 1997-11-28 1998-11-27 Procede et machine pour produire des cartes a circuits imprimes souples et semi-rigides Withdrawn EP0960553A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITMI972646 IT1296811B1 (it) 1997-11-28 1997-11-28 Procedimento e macchine per la produzione di circuiti stampati flessibili e semirigidi
ITMI972646 1997-11-28
PCT/EP1998/007659 WO1999029149A1 (fr) 1997-11-28 1998-11-27 Procede et machine pour produire des cartes a circuits imprimes souples et semi-rigides

Publications (1)

Publication Number Publication Date
EP0960553A1 true EP0960553A1 (fr) 1999-12-01

Family

ID=11378285

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98964452A Withdrawn EP0960553A1 (fr) 1997-11-28 1998-11-27 Procede et machine pour produire des cartes a circuits imprimes souples et semi-rigides

Country Status (4)

Country Link
EP (1) EP0960553A1 (fr)
JP (1) JP2001511952A (fr)
IT (1) IT1296811B1 (fr)
WO (1) WO1999029149A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10224817B4 (de) * 2002-06-05 2005-04-14 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum vertikalen Eintauchen von folienartigem Behandlungsgut in Bädern von Galvanisier- und Ätzanlagen

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB822826A (en) * 1956-10-22 1959-11-04 St Regis Paper Co Printed circuitry laminates and production thereof
FR1443941A (fr) * 1964-03-16 1966-07-01 Westinghouse Electric Corp Fabrication de câbles électriques plats, à conducteurs multiples
GB1233401A (fr) * 1967-06-29 1971-05-26

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9929149A1 *

Also Published As

Publication number Publication date
IT1296811B1 (it) 1999-08-02
ITMI972646A1 (it) 1999-05-28
WO1999029149A1 (fr) 1999-06-10
JP2001511952A (ja) 2001-08-14

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20020603