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EP0886887B1 - Emetteur planaire - Google Patents

Emetteur planaire Download PDF

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Publication number
EP0886887B1
EP0886887B1 EP97914238A EP97914238A EP0886887B1 EP 0886887 B1 EP0886887 B1 EP 0886887B1 EP 97914238 A EP97914238 A EP 97914238A EP 97914238 A EP97914238 A EP 97914238A EP 0886887 B1 EP0886887 B1 EP 0886887B1
Authority
EP
European Patent Office
Prior art keywords
layer
ply
electrically conductive
dielectric
radiator according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP97914238A
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German (de)
English (en)
Other versions
EP0886887A1 (fr
Inventor
Lutz Rothe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pates Technology Patentverwertungsgesellschaft Fue
Original Assignee
PATES TECHNOLOGY PANTENTVERWERTUNGSGESELLSCHAFT fur SATELLITEN- und MODERNE INFORMATIONSTECHNOLOGIEN MBH
PATES TECHNOLOGY PANTENTVERWER
Pates Technology Pantentverwertungsgesellschaft fur Satelliten- und Moderne Informationstechnologien Mbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PATES TECHNOLOGY PANTENTVERWERTUNGSGESELLSCHAFT fur SATELLITEN- und MODERNE INFORMATIONSTECHNOLOGIEN MBH, PATES TECHNOLOGY PANTENTVERWER, Pates Technology Pantentverwertungsgesellschaft fur Satelliten- und Moderne Informationstechnologien Mbh filed Critical PATES TECHNOLOGY PANTENTVERWERTUNGSGESELLSCHAFT fur SATELLITEN- und MODERNE INFORMATIONSTECHNOLOGIEN MBH
Publication of EP0886887A1 publication Critical patent/EP0886887A1/fr
Application granted granted Critical
Publication of EP0886887B1 publication Critical patent/EP0886887B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0075—Stripline fed arrays

Definitions

  • the invention relates to a planar radiator with a Radiator level having surface resonators and a Coupling network having network level, the Area resonators with each other via the coupling network are coupled galvanically and in phase.
  • the reception or the Radiation of directed electromagnetic radiation fields linear polarization in the microwave spectrum will be required today reflector antenna or planar antennas or radiators used.
  • the radiation properties of the reflector antennas is based on the generation of a corresponding amplitude and Phase assignment of the electromagnetic Radiation field components on the reflector surface by means of suitable pathogen.
  • the reflectors used are here either in the form of closed surfaces of defined curvature and border are designed or are latticed Arrangements of discrete conductive linear elements defined Length and spacing carried out.
  • Known planar solutions are based on the arrangement of galvanically and parallel fed Area resonators of defined group size and spacing to each other.
  • EP 0 200 819 describes a planar array antenna in Stripline technology known.
  • the mechanical structure is there from a first substrate plate as a carrier for Antenna elements under the second substrate plate as a carrier for the couplers and the signal processing. Both substrate plates are connected by a thick metal plate, where the thickness of the metal plate is half Operating wavelength corresponds.
  • a planar antenna is known from EP 0 383 292, in which Antenna elements on the ground surface of a two-sided coated circuit board are glued on which the Coupling network and additional electronics is located.
  • the Antenna element consists of a surface resonator plate, which is applied to a dielectric substrate layer is.
  • the substrate layer of the antenna element is made of "glass epoxy ".
  • a planar antenna is known from WO 95/09455, which is also sandwich-like, and where the die Layer carrying antenna elements for manufacturing reasons two layers of the same material because the Antenna elements are capacitively coupled.
  • a disadvantage of the known planar antennas is that mostly high system quality only in a small spectral range and therefore only with restrictions for use Suitable for multipoint multichannel communication services are, because of the small bandwidth, only relatively few Frequency bands can be transmitted with a single antenna.
  • the planar emitter according to the invention advantageously only needs a common ground area for the emitter and network level, which significantly reduces the overall height of the emitter compared to known planar emitters and reduces the manufacturing material costs.
  • the bandwidth of the radiation field to be transmitted and received by the radiator can also be varied without influencing the characteristic impedance of the coupling network by suitable choice of the thickness of the first dielectric layer, a high system quality being achieved in the entire spectral range at the same time. It is necessary for a planar radiator that the first layer is made of a material with the smallest possible dielectric constant ( ⁇ r ⁇ 1).
  • the thin layer supporting the resonator surfaces can be manufactured from a heat-resistant material such as polyethylene terephthalate, on which the resonator surfaces can be applied permanently.
  • the first layer can be made from an inexpensive foamed material. So that the planar radiator becomes flexible or pliable, the thickness of the first layer is greater than the thickness of the second layer.
  • the first layer forms the actual base material of the planar emitter and essentially determines the properties of the emitter plane with its ⁇ r and loss angle tan ⁇ ⁇ .
  • the material of the first layer is advantageously the cheap material polystyrene, which is flexible in its foamed form and in particular has a specific volume weight of 20kg / m 3 .
  • the second layer is advantageously formed by a polyethylene terephthalate film which is glued to the first layer.
  • the advantage of this polyethylene terephthalate film is that it forms a firm and permanent connection with copper, which means that the resonator surfaces have firm adhesion.
  • Each surface resonator is electrical by means of an conductive connecting pin with the coupling network in electrically conductive connection, the electrically conductive Connecting pin in a perpendicular to the radiator and Through hole located at the network level.
  • the connecting pins are relatively long, as a result of which the pins themselves have an electrically transforming effect.
  • the inductive reactive component represented by the pen can therefore no longer be neglected and must be compensated for.
  • This can be done on the one hand by means of a sleeve which at least in sections envelops the pin and is made of a material, in particular Teflon, which has a higher dielectric constant than the materials forming the dielectric layers, which serve as the base material for the radiator and network level.
  • Teflon Teflon
  • the electrically conductive thin Layer in the areas where the electrically conductive pins pass through the layer especially circular has window-like recesses, such that the pins with the electrically conductive layer not in electrical connection are.
  • Form these circular window-like recesses Apertures, by means of the diameter of the recesses Coupling factor is adjustable.
  • the coupling factor determines the portion of the signal intensity, which of the Radiator level is led to the network level.
  • the optimal one Diameter of the orifices can be obtained by simulation or experimental tests.
  • the surface resonators can be shaped and arranged as desired become. To generate the necessary impedance profile along the line of symmetry of the Area resonators, as well as to generate the necessary radiation-related individual characteristic of Area resonators it is recommended that Surface resonators to be rectangular, the Broadside is identical to the radiant edge.
  • the Surface resonators are advantageously matrix-shaped arranged to each other. It has been shown that it is for most areas of application is sufficient, only eight Area resonators in particular in two lines and four Arrange columns. Also for the sake of simple Predictability and minimizing the dimensions of the planar emitter, it is advantageous if line and Column spacing of the matrix Area resonators are equal to each other.
  • the planar has to enable components and plug-in systems Spotlights an extension that carries a wave path that a coupling point of the coupling network with a Connector connects.
  • the connector is one commercially available N socket, which is modified in this way is that the inner conductor of the socket with the Microstrip line on the extension of the dielectric carrier of the coupling network is applied, is connected, and that the ground plane of the extension, the at the same time the extension of the electrically conductive layer is, with the outer surface of the socket by means of of a dielectric press block generated press pressure is.
  • the wave path is through a microstrip line, the second dielectric layer and the ground surface, connected to the coaxial connector accordingly is.
  • the first dielectric layer 5 one material.
  • On top of layer 5 are made of a thin layer of copper Resonator surfaces 4 applied.
  • Between the first dielectric layer 5 and the second dielectric Layer 7 is the conductive ground plane 6.
  • the ground plane 6 is an approx. 17-18 ⁇ m thick copper layer.
  • On the The flat side of layer 7 facing away from the ground surface is the Microstrip lines 8 or the coupling network 3 arranged.
  • the coupling points 12 and 13 are by means of a electrically conductive pin 9 in connection.
  • the pin 9 has a small diameter so that by the location of the Coupling point 12 determined input impedance of the Surface resonator 4 is not due to large-area contact of pin 9 with the resonator surface is undetermined.
  • the diameter of the pin 9 should therefore be chosen so small that the strip width of the coupling network 3 is not is exceeded.
  • the thickness of the pin 9 should therefore be 1 mm do not exceed.
  • the pen is used for fixing purposes and better permanent contact with the copper layers the network and the radiator level are soldered and is one Surround sleeve 11, which stiffens the radiator.
  • the thickness D2 of the layer 5 essentially determines that Total height of the planar emitter.
  • the ground surface 6 has in the areas in which the pin 9th a circular one passes through the ground surface 6 Recess 10, the diameter of which is larger than that Outside diameter of the pin 9. Is the length of the sleeve 11 equal to the lengths D2 plus D3, the diameter is the Recess 10 at least as large as the outer diameter of the To choose sleeve 11.
  • Layer 5 is made of polysterol, which is foamed in State is flexible, which makes the planar emitter in certain Is flexible. This bendability is only marginal through the thin copper layers 4, 6 and 8 and the layer 7 impaired.
  • the coupling point 12 not be arranged centrally to the resonator surfaces 4. With the help of known simulation methods, it can be used for frequency and bandwidth required Calculate the input impedance of the surface resonators, from which the Location of the coupling point 12 can be derived.
  • Figure 3 is the coupling network 3 with which the signals Coupling or decoupling wave path 16 shown.
  • the Network 3 consists of striplines 3a-3f and 16. Die Stripline sections have different lengths and Widths to the inductive portion, which is determined by the length of the Pen 9 was caused to compensate as well impedance-matched merging of the to Allow surface resonators to guide waveguide paths.
  • Figure 5 shows a cross-sectional view of the Wave path 16 and the connector 18 carrying projection 24.
  • the projection 24 lies between the connector 18 and the pressure block 22.
  • the connector 18 and the pressure block 22 are by means of the projection 24 and the provided holes 23 cross fastening screws screwed together so that the connector 18 with the Projection 24 is in firm connection.
  • planar emitter in Frequency spectrum from 2,500 GHz to 2,686 GHz a high System quality.
  • the resonator surfaces have a length of 47 mm, a width of 53 mm and a row and column spacing of 87 mm.
  • the feed or coupling point 12 is located approximately 2 mm from the center of the broad side within the surface.
  • the thicknesses D1, D3 and D5 of the copper layers are approximately 18 ⁇ m thick.
  • the layer 5 has two layers, the first layer 14 having a thickness L1 equal to 10.5 mm and consisting of foamed polystyrene, the spec. Volume weight is 20kg / m 3 .
  • the second layer 15 has a thickness L2 of 100 ⁇ m and consists of polyethylene terephthalate.
  • the second dielectric layer 7 consists of glass fiber reinforced polytetrafluoroethylene with a thickness of 381 ⁇ m.
  • the Layer 14 is glued to the layer 15 and the adhesive connection has a thickness of 7 ⁇ m.
  • the pin 9 has a diameter of 1.2 mm and lies with its one end in the bore of layer 7, whose Diameter is also 1.2 mm and passes through Coupling point 13.
  • the layers 5 and 6 have in the area of Pins 9 also on holes, the diameter of Recording of the pin 9 and the sleeve 11 is 4.2 mm.
  • the coupling network 3 is constructed symmetrically, such that all resonator surfaces are in phase from coupling point 17 be fed.
  • the coupling points 13 have one Inner diameter of 1.2 mm and an outer diameter of 2.1 mm.
  • each coupling point 13 goes in the direction of the line adjacent feed point 13 a conductor 3a of Width 0.49 mm for a length of 27 mm.
  • This head 3a then jumps into a conductor 3b with a width of 1.15 mm over which is 31 mm long.
  • the head 3b again in a width of 0.49 mm across to the neighboring one To reach feeding point 13 after a length of 27 mm.
  • the dining points are outside in every row lying resonator surfaces 4 with the feed points 13 of the in each case in the row adjacent and below Resonator surfaces 4 connected.
  • the conductor 3e opens a width of 1.15 mm for a length of 129.4 mm over (Head 3f).
  • the width of the conductor 3f changes to 1.88 mm for a length of 22.3 mm.
  • To the middle of the 3f includes a waveguide 1.88 mm wide as well the length of 22.3 mm to then jump in width to 1.15 mm and to the decoupling point 21 of the Network 3 to be managed.
  • the inductive dummy components of the pins 9 by the Dimensions of the elongated pins 9, which in turn from the Thickness D2 of the first dielectric layer 5 are conditional, compensated.

Landscapes

  • Control Of Motors That Do Not Use Commutators (AREA)
  • Bipolar Transistors (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Polarising Elements (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)

Claims (15)

  1. Emetteur planar comportant un plan d'émetteur (1) possédant des résonateurs plans (4), et un plan de réseau (2) comportant réseau de couplage (3), les résonateurs plans (4) étant couplés galvaniquement entre eux et avec une même phase par l'intermédiaire du réseau de couplage (3), caractérisé en ce
    que l'émetteur planar est réalisé avec une structure sandwich constituée de couches (4, 5, 6, 7, 8) planes et parallèles entre elles, et
    qu'une première couche diélectrique (5) est séparée d'une seconde couche diélectrique (7) par une mince couche électriquement conductrice (6), qui forme la surface de masse commune pour le plan d'émetteur (1) et pour le plan de réseau (2), et
    que la première couche diélectrique (5) porte, sur sa face tournée à l'opposé de la couche électriquement conductrice (6), les résonateurs plans (4),
    la première couche diélectrique (5) étant constituée de deux matériaux diélectriques qui forment chacun en soi une couche (14, 15), et l'épaisseur (L1) de la première couche étant supérieure à l'épaisseur (L2) de la seconde couche, et la seconde couche (15) portant les résonateurs plans (4) sur sa face tournée à l'opposé de la première couche (14), et
    que la seconde couche diélectrique (7) porte, sur sa face tournée à l'opposée de la couche électriquement conductrice (6), le réseau de couplage (3), qui est formé par des conducteurs en forme de microbandes (8).
  2. Emetteur planar selon la revendication 1, caractérisé en ce que la première couche (14) est formée de polystyrène, qui est flexible dans sa forme à l'état de mousse et possède notamment un poids spécifique de 20 kg/m3, la première couche (14) possédant notamment une épaisseur (L1) égale à 10,5 mm.
  3. Emetteur planar selon l'une des revendications 1 ou 2, caractérisé en ce que la seconde couche (15) est formée par une feuille de téréphtalate de polyéthylène possédant notamment l'épaisseur (L2) égale à 100 µm, qui est collée sur la première couche (14).
  4. Emetteur planar selon l'une des revendications précédentes, caractérisé en ce que la couche mince électriquement conductrice (6) possède une épaisseur de 18 µm.
  5. Emetteur planar selon l'une des revendications précédentes, caractérisé en ce que chaque résonateur plan (4) est relié selon une liaison électriquement conductrice au réseau de couplage (3) par l'intermédiaire d'une tige de liaison électriquement conductrice (9), la tige de liaison électriquement conductrice (9) étant disposée dans un perçage traversant disposé perpendiculairement au plan d'émetteur (1) et au plan de réseau (2).
  6. Emetteur planar selon la revendication 5, caractérisé en ce que la couche mince électriquement conductrice (6) possède des ouvertures (10) en forme de fenêtres notamment circulaires dans les zones où les tiges électriquement conductrices traversent la couche (6), de telle sorte que les tiges (9) ne sont pas reliées selon une liaison électrique à la couche électriquement conductrice (6).
  7. Emetteur planar selon la revendication 8, caractérisé en ce que les ouvertures en forme de fenêtres de forme circulaire (10) forment des diaphragmes et que le facteur de réflexion et de transmission entre le réseau de couplage et les résonateurs plans respectifs est réglable à l'aide du diamètre des ouvertures (10).
  8. Emetteur planar selon l'une des revendications 5, 6 ou 7, caractérisé en ce que chaque tige électriquement conductrice (9) est entourée au moins par intervalles par une douille (11), dans la zone située entre la couche conductrice (6) des résonateurs plans (4) et la couche conductrice (6) des lignes à microbandes (8).
  9. Emetteur planar selon la revendication 8, caractérisé en ce que la douille (11) est réalisée en un matériau diélectrique, notamment du Téflon, dont la constante diélectrique εr est notamment supérieure à la constante diélectrique εr du matériau, qui entoure la douille (11), des couches diélectriques (5, 7).
  10. Emetteur planar selon l'une des revendications précédentes, caractérisé en ce que la composante réactive inductive, conditionnée par l'épaisseur (D2) de la première couche diélectrique (5), peut être compensée, au moyen de la douille (11), à l'aide d'un choix approprié de l'épaisseur de paroi (WS), de la hauteur (LS) et de la constante diélectrique εr de la douille (11).
  11. Emetteur planar selon la revendication 9 ou 10, caractérisé en ce que la longueur (LS) des douilles (11) maintient constante la distance entre le plan d'émetteur (1) et le plan de réseau (2) au moins dans les zones des perçages traversants (10) ou des tiges (9) même sous l'action de forces extérieures, et forme des points définis d'application notamment pour le montage.
  12. Emetteur planar selon l'une des revendications précédentes, caractérisé en ce que les composantes réactives inductives de la tige (9) et du revêtement capacitif de la douille (11), conditionnées par l'épaisseur (D2) de la première couche diélectrique (5), peuvent être compensées au moyen du réseau de couplage (3).
  13. Emetteur planar selon l'une des revendications précédentes, caractérisé en ce que les résonateurs plans (4) sont rectangulaires et sont disposés sous la forme d'une matrice comportant notamment deux lignes et quatre colonnes.
  14. Emetteur planar selon la revendication 13, caractérisé en ce que les distances entre les lignes et entre les colonnes des résonateurs plans (4) disposés sous la forme d'une matrice sont égales.
  15. Émetteur planar selon l'une des revendications précédentes, caractérisé en ce que le plan de réseau (3), constitué par les lignes à microbandes (8), la seconde couche diélectrique (7) et la surface de masse (6), se prolonge, sous la forme d'un trajet d'onde (1) entre le point commun de couplage (17) et un point de connexion (18) de telle sorte que le couplage du côté du guide d'ondes est réalisé sans séparation du plan du guide d'ondes, directement sur l'élément de connexion (18) selon une réalisation coaxiale.
EP97914238A 1996-03-16 1997-03-13 Emetteur planaire Expired - Lifetime EP0886887B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19615497A DE19615497A1 (de) 1996-03-16 1996-03-16 Planarer Strahler
DE19615497 1996-03-16
PCT/EP1997/001275 WO1997035355A1 (fr) 1996-03-16 1997-03-13 Emetteur planaire

Publications (2)

Publication Number Publication Date
EP0886887A1 EP0886887A1 (fr) 1998-12-30
EP0886887B1 true EP0886887B1 (fr) 1999-09-22

Family

ID=7791749

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97914238A Expired - Lifetime EP0886887B1 (fr) 1996-03-16 1997-03-13 Emetteur planaire

Country Status (12)

Country Link
US (1) US6204814B1 (fr)
EP (1) EP0886887B1 (fr)
JP (1) JP2000507055A (fr)
KR (1) KR20000064587A (fr)
CN (1) CN1214152A (fr)
AT (1) ATE185023T1 (fr)
CA (1) CA2250928C (fr)
DE (2) DE19615497A1 (fr)
GR (1) GR3031727T3 (fr)
IL (1) IL126131A (fr)
TW (1) TW355854B (fr)
WO (1) WO1997035355A1 (fr)

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GB0105251D0 (en) 2001-03-02 2001-04-18 Nokia Mobile Phones Ltd Antenna
EP1239539A3 (fr) * 2001-03-02 2003-11-05 Nokia Corporation Antenne
US6759984B2 (en) * 2001-06-01 2004-07-06 Agere Systems Inc. Low-loss printed circuit board antenna structure and method of manufacture thereof
RU2228564C2 (ru) * 2002-04-01 2004-05-10 Марийский государственный технический университет Печатная рамочная антенна
JP2021530881A (ja) * 2018-05-01 2021-11-11 ウェハー エルエルシーWafer Llc 低コストの電送用誘電体とそれを用いたアンテナ
RU2738759C1 (ru) * 2020-06-04 2020-12-16 Акционерное общество "Научно-производственная фирма "Микран" Сверхширокополосный планарный излучатель

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EP0383292A2 (fr) * 1989-02-14 1990-08-22 Fujitsu Limited Dispositif de circuit électronique
WO1995009455A1 (fr) * 1993-09-29 1995-04-06 Hollandse Signaalapparaten B.V. Antenne multipastille

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Publication number Priority date Publication date Assignee Title
EP0383292A2 (fr) * 1989-02-14 1990-08-22 Fujitsu Limited Dispositif de circuit électronique
WO1995009455A1 (fr) * 1993-09-29 1995-04-06 Hollandse Signaalapparaten B.V. Antenne multipastille

Also Published As

Publication number Publication date
JP2000507055A (ja) 2000-06-06
WO1997035355A1 (fr) 1997-09-25
CN1214152A (zh) 1999-04-14
CA2250928C (fr) 2003-12-23
IL126131A0 (en) 1999-05-09
CA2250928A1 (fr) 1997-09-25
GR3031727T3 (en) 2000-02-29
TW355854B (en) 1999-04-11
ATE185023T1 (de) 1999-10-15
EP0886887A1 (fr) 1998-12-30
DE59700474D1 (de) 1999-10-28
DE19615497A1 (de) 1997-09-18
KR20000064587A (ko) 2000-11-06
IL126131A (en) 2002-02-10
US6204814B1 (en) 2001-03-20

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