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EP0793898B1 - Perfectionnements apportes a des elements a couche epaisse - Google Patents

Perfectionnements apportes a des elements a couche epaisse Download PDF

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Publication number
EP0793898B1
EP0793898B1 EP95937110A EP95937110A EP0793898B1 EP 0793898 B1 EP0793898 B1 EP 0793898B1 EP 95937110 A EP95937110 A EP 95937110A EP 95937110 A EP95937110 A EP 95937110A EP 0793898 B1 EP0793898 B1 EP 0793898B1
Authority
EP
European Patent Office
Prior art keywords
tracks
thick film
resistive
compensating
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95937110A
Other languages
German (de)
English (en)
Other versions
EP0793898A1 (fr
Inventor
Peter James Little
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pifco Ltd
Original Assignee
Pifco Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pifco Ltd filed Critical Pifco Ltd
Publication of EP0793898A1 publication Critical patent/EP0793898A1/fr
Application granted granted Critical
Publication of EP0793898B1 publication Critical patent/EP0793898B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/021—Heaters specially adapted for heating liquids

Definitions

  • the present invention relates to thick film resistive heating elements such as can be used particularly but not exclusively in liquid heating appliances such as water boilers, kettles and the like.
  • thick film resistive heating elements are manufactured by printing a thick film resistive track on to the surface of an electrically insulative substrate.
  • the length, width and thickness of the printed track and the resistivity of the track material determines its resistance.
  • the length and width of the track are relatively simple to control, the thickness is more difficult to control, for example because of irregularities in the surface of the underlying substrate.
  • variations in the printing and resistivity of such thick film resistive tracks can cause the measured resistance of any given track layout to vary by up to ⁇ 15% from a desired level.
  • the object of the present invention is provide a thick film resistive heating element and a method of producing same which overcomes or substantially mitigates the aforementioned problem.
  • a method of manufacturing a thick film resistive heating element comprising the steps of
  • each compensating thick film resistive track is printed in parallel with said one or more resistive tracks whereby electrical connection of one or more of the compensating tracks to said one or more resistive tracks decreases the resistance of the electrically connected resistive tracks as a whole.
  • the width, length and thickness of said one or more thick film resistive tracks are predetermined so that the measured resistance will on average be higher than the predetermined required value, and the width, length and thickness of each compensating track is predetermined so that its resistance is on average such that when electrically connected in parallel to said one or more thick film resistive tracks the measured resistance of the electrically connected resistive tracks as a whole will only vary from the predetermined required value by an amount no more than the permitted tolerance.
  • the method comprises the additional step of applying an encapsulating insulating layer over all the resistive tracks and the substrate to protect and insulate same.
  • a thick film resistive heating element comprising at one or more thick film resistive tracks applied to the surface of an electrically insulative substrate and characterised in that at least one compensating thick film resistive track is applied to the surface of the substrate in parallel with said one or more resistive tracks but electrically disconnected therefrom at the time of application.
  • a thick film resistive heating element 1 is formed by applying a first dielectric adhesion layer to a rigid substrate 2, such as a stainless steel plate, the adhesion layer being selected to have a coefficient of thermal expansion approximately equal to that of the steel.
  • a rigid substrate 2 such as a stainless steel plate
  • One or more further separate coatings are then separately applied such that the final coating has a coefficient of thermal expansion approximately equal to a thick film ink.
  • a thick film circuit layout is then applied by silk-screen printing in which a conductive track 3 constituting the heating element is printed.
  • the track is preferably formed of palladium silver but may alternatively be made of other conducting materials such as nickel, platinum, silver, or carbon, for example.
  • the track 3 follows a tortuous path of predetermined length over the majority of the area of the substrate 2 to maximise the heated area of the element 1.
  • the track 3 terminates in respective contact portions 4 and 5 which are adapted to make electrical connection with an electrical control device for the element 1.
  • Thick film resistive tracks such as the track 3 are usually deposited on the insulated substrate 1 at a constant thickness of between approximately 10 to 14 microns.
  • the width of the track may be varied to vary its resistance. Its resistance is reduced by increasing the width of the track and correspondingly increased by reducing the width of the track.
  • the track 3 is formed by a pair of parallel tracks 3A and 3B.
  • a track 3 can be printed with a predetermined length and width and with a predetermined rate of application of the resistive ink from which it is formed.
  • inaccuracies in printing and irregularities in the surface of the dielectrically coated substrate can locally affect the width and thickness of the track 3.
  • the resistance of the track 3 will tend to vary from a predetermined value calculated from an ideal length, width and thickness of track.
  • Some methods of applying the dielectric layers to the substrate 2 are better than other in producing a smooth surface on which the track 3 is then printed.
  • a thick film resistive heating element 1 is additionally printed with at least one compensating thick film resistive track 6.
  • Each track 6 is applied to the surface of the substrate in parallel with the tracks 3A and 3B but electrically disconnected therefrom at the time of application by means of a gap 7. It will be appreciated that the track 6 and the tracks 3A and 3B are all printed at the same time but, as will be described, the gap 7 is thereafter either closed or left open.
  • the electrical resistance of the track 3 comprising the tracks 3A,3B is measured. It can then be determined for each element 1 whether the measured resistance varies from a predetermined ideal value based on the length, width and thickness of the tracks 3 presumed to have been printed by more than a permitted tolerance. As previously mentioned, typically the resistance of such thick film resistive tracks can vary by up to ⁇ 15% from a desired level but safety and other standards can require resistive tolerances no more than-5% and + 10% from a fixed value.
  • the gap 7 can be left open. However, if the measured resistance is found to be higher than the permitted tolerances, the gap 7 can be closed to decrease the overall resistance of the tracks 3.
  • the gap 7 is closed by screen printing a short section of the track 6 with the same thick film ink as used previously for the tracks 3 and 6.
  • one or more compensating tracks 6 could be printed to be connected in series with the tracks 3A,3B to increase the overall resistance of the track 3 when electrically connected thereto, this is unlikely to be practical in most circumstances because the contact portions 4 and 5 require special treatment during production of the element and must usually always be placed in a fixed position for connection to the control device.
  • the track or tracks 6 are normally printed in parallel with the tracks 3A, 3B to reduce their resistance.
  • the expected average resistance of the track 3 based on its ideal thickness, width and length can be arranged to be slightly higher than the required value.
  • the width, length and thickness of each compensating track 6 can be predetermined so that its resistance is on average such that when electrically connected in parallel with the tracks 3A, 3B the measured resistance of the resistive track 3 as a whole will only vary from the required value by an amount no more than the permitted tolerance.
  • At least part of the tracks 3A,3B can be split into a plurality of thinner parallel tracks 8. This spreads the temperature of the tracks 3A and 3B locally and is useful where the element 1 is to be used in conjunction with an electromechanical control device 9. The effect of such track splitting can, however, be taken into account when determining the required resistance of such an element.
  • an encapsulating insulating layer can then applied over the completed circuit and the substrate to protect the circuit.
  • this coating is interrupted in the regions of the contract portions 4 and 5 so that electrical connection can be made thereto.
  • the invention provides a simple means of improving the viability of thick film resistive heating elements by enabling them to meet required standards.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Surface Heating Bodies (AREA)
  • Inorganic Insulating Materials (AREA)
  • Materials For Medical Uses (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Magnetic Heads (AREA)
  • Resistance Heating (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Claims (5)

  1. Procédé de fabrication d'un élément résistif chauffant à couche épaisse (1) comprenant les étapes suivantes :
    application d'une ou de plusieurs pistes résistives à couche épaisse (3, 3A, 3B) sur la surface d'un substrat électriquement isolant (2);
    application d'au moins une piste résistive à couche épaisse (6) de compensation sur la surface du substrat (2) qui est déconnectée de ladite ou desdites pistes résistives à couche épaisse (3, 3A, 3B) au moment de l'application;
    mesure de la résistance de ladite ou desdites pistes résistives (3,3A,3B) en excluant la ou les pistes de compensation (6);
    vérification de ce que la résistance mesurée ne s'écarte pas d'une valeur prédéterminée de plus d'une valeur de tolérance permise; et
    connexion d'au moins une des pistes résistives de compensation (6) à ladite ou auxdites pistes résistives (3,3A,3B) pour faire varier la résistance des pistes (3,3A,3B) dans le cas où la résistance mesurée tombe en dehors de la tolérance permise.
  2. Procédé selon la revendication 1, dans lequel chaque piste résistive à couche épaisse de compensation (6) est imprimée en parallèle avec ladite ou lesdites pistes résistives (3, 3A, 3B), et dans lequel la connexion électrique d'une ou de plusieurs des pistes de compensation (6) à ladite ou auxdites pistes résistives (3, 3A, 3B) fait diminuer la résistance globale des pistes résistives (3, 3A, 3B) électriquement connectées.
  3. Procédé selon la revendication 1 ou la revendication 2, dans lequel la largeur, la longueur et l'épaisseur de ladite ou desdites pistes résistives à couche épaisse (3, 3A, 3B) sont prédéterminées de telle manière que la résistance mesurée soit en moyenne supérieure à la valeur prédéterminée requise, et la largeur, longueur et épaisseur de chaque pistes (6) de compensation sont prédéterminées de telle manière que sa résistance est en moyenne telle que , lorsque électriquement connecté en parallèle à ladite ou auxdites pistes résistives à couche épaisse (3, 3A, 3B), la résistance mesurée des pistes électriquement connectées dans leur ensemble variera d'une valeur requise prédéterminée d'une quantité non supérieure à la tolérance permise.
  4. Procédé selon n'importe laquelle des revendications 1 à 3, qui comprend l'étape additionnelle d'application d'une couche isolante sur toutes les pistes résistives (3, 3A, 3B, 6) et le substrat (2) pour les protéger et les isoler.
  5. Elément résistif chauffant à couche épaisse comprenant une ou plusieurs pistes résistives à couche épaisse (3, 3A, 3B) appliqués sur la surface d'un substrat (2) électriquement isolé et caractérisé en ce que au moins une piste résistive à couche épaisse de compensation (6) est appliquée à la surface du substrat (2) en parallèle avec ladite ou lesdites pistes résistives (3, 3A, 3B) mais déconnecté d'eux au moment de l'application.
EP95937110A 1994-11-26 1995-11-27 Perfectionnements apportes a des elements a couche epaisse Expired - Lifetime EP0793898B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9423901 1994-11-26
GB9423901A GB9423901D0 (en) 1994-11-26 1994-11-26 Improvements to thick film elements
PCT/GB1995/002751 WO1996017496A1 (fr) 1994-11-26 1995-11-27 Perfectionnements apportes a des elements a couche epaisse

Publications (2)

Publication Number Publication Date
EP0793898A1 EP0793898A1 (fr) 1997-09-10
EP0793898B1 true EP0793898B1 (fr) 1998-05-20

Family

ID=10765022

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95937110A Expired - Lifetime EP0793898B1 (fr) 1994-11-26 1995-11-27 Perfectionnements apportes a des elements a couche epaisse

Country Status (9)

Country Link
EP (1) EP0793898B1 (fr)
AT (1) ATE166520T1 (fr)
AU (1) AU694815B2 (fr)
CA (1) CA2204601A1 (fr)
DE (1) DE69502630T2 (fr)
ES (1) ES2117452T3 (fr)
GB (1) GB9423901D0 (fr)
NZ (1) NZ295712A (fr)
WO (1) WO1996017496A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997014269A1 (fr) * 1995-10-11 1997-04-17 Strix Limited Dispositifs de chauffage electriques
GB9619579D0 (en) * 1996-09-19 1996-10-30 Deveney John Seaming iron
GB2322273B (en) 1997-02-17 2001-05-30 Strix Ltd Electric heaters
EP0994666B1 (fr) 1997-07-11 2005-09-21 Strix Limited Element chauffant à couche épaisse
GB2344744B (en) 1998-11-26 2001-07-25 Strix Ltd Electrical beverage making apparatus
GB2351894B (en) * 1999-05-04 2003-10-15 Otter Controls Ltd Improvements relating to heating elements
JP4094960B2 (ja) 2001-04-17 2008-06-04 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 加熱システム
US7223947B2 (en) * 2003-07-30 2007-05-29 Koninklijke Philips Electronics N.V. Domestic appliance and heating structure for a domestic appliance
EP2186380B1 (fr) * 2007-07-20 2016-06-22 LG Electronics Inc. Elément chauffant électrique
DE102007056917A1 (de) * 2007-11-27 2009-06-04 BSH Bosch und Siemens Hausgeräte GmbH Verfahren zum Fertigungstoleranzausgleich von elektrischen Verbrauchern
KR102093766B1 (ko) 2018-08-21 2020-03-26 엘지전자 주식회사 전기 히터

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2153190B (en) * 1984-01-14 1987-09-09 Emi Ltd Improvements in or relating to heaters for water vessels
GB8704469D0 (en) * 1987-02-25 1987-04-01 Thorn Emi Appliances Thick film electrically resistive tracks
GB8807139D0 (en) * 1988-03-25 1988-04-27 Emi Plc Thorn Current source limitation for thick film heating elements
DE8902013U1 (de) * 1989-02-21 1990-03-22 Holtkamp, Manfred, 4543 Lienen Heizboden mit flächigem Heizelement

Also Published As

Publication number Publication date
AU3931595A (en) 1996-06-19
AU694815B2 (en) 1998-07-30
WO1996017496A1 (fr) 1996-06-06
ATE166520T1 (de) 1998-06-15
EP0793898A1 (fr) 1997-09-10
GB9423901D0 (en) 1995-01-11
NZ295712A (en) 1998-08-26
DE69502630T2 (de) 1999-02-11
DE69502630D1 (de) 1998-06-25
CA2204601A1 (fr) 1996-06-06
ES2117452T3 (es) 1998-08-01

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