EP0515383A1 - Unite hybride en couche epaisse avec prise enfichable - Google Patents
Unite hybride en couche epaisse avec prise enfichableInfo
- Publication number
- EP0515383A1 EP0515383A1 EP19910901694 EP91901694A EP0515383A1 EP 0515383 A1 EP0515383 A1 EP 0515383A1 EP 19910901694 EP19910901694 EP 19910901694 EP 91901694 A EP91901694 A EP 91901694A EP 0515383 A1 EP0515383 A1 EP 0515383A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- thick
- film
- plastic
- hybrid assembly
- film hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000004033 plastic Substances 0.000 claims abstract description 33
- 239000000919 ceramic Substances 0.000 claims abstract description 28
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 238000001465 metallisation Methods 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 12
- 230000013011 mating Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000002991 molded plastic Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract 1
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
Definitions
- the invention relates to a thick-film hybrid assembly with a plug connection according to the preamble of claim 1.
- Thick-film hybrid assemblies are known with one or more ceramic carrier plates lying parallel to one another, to which thick-film conductor tracks are applied by means of a thick-film metallization. Furthermore, it is known to provide such assemblies with a plug-in connection which is connected via a further conductor material, e.g. a lead frame, and the necessary connection, e.g. Bonding or soldering. Such a connection is evidently expensive to manufacture.
- a further conductor material e.g. a lead frame
- the thick-film conductor tracks are guided to the outer edge of the ceramic carrier plate and form connection contacts there for a mating connector part, the ceramic carrier plate with the outer edge being inserted through a slot in a plastic body in such a way that the connection contacts are exposed on one side of the plastic body and are available for a mating connector.
- the slot is poured out between them for holding and sealing between the ceramic carrier plate and the plastic body.
- the ceramic carrier plate (Al2O3) with thick-film metallization is inert and well suited for contact with resilient mating contacts with the same surface.
- the noble metals gold or silver or alloys thereof or dipped in tin are suitable as the thick-film surface. Sealing the ceramic against plastic is already being practiced. Additional conductor material and then necessary connections are avoided by the direct plugging of the thick-film hybrid assembly according to the invention.
- connection technology according to the invention can in particular also be used with a plurality of ceramic carrier plates lying parallel to one another.
- the plastic body is advantageously designed as a plastic plate or as a molded plastic part which is perpendicular to the ceramic carrier plate (s), these being inserted through the longitudinal slots with the connection contacts and the longitudinal slots being poured linearly together with adhesive material for a good hold and a good seal.
- the thick-film hybrid assembly can also be cast in a known manner in the connection technology according to the invention on the side of the plastic body opposite the connection contacts and / or housed in a housing. Seals towards the mating connector connection can
- Fig. 3 is a front view with a view of the plug connection.
- a Dick Mrs ⁇ is hybrid assembly 1 is shown with two * arallel lying ceramic panels 2, 3, an intermediate Metall ⁇ core 4, an end plastic plate 5 and a ver ⁇ cast housing 6.
- the two ceramic carrier plates 2, 3 or thick-film hybrid arrangements are connected in the area of the plastic plate 5 by a wire connection 8 and in the area remote from it by a double comb 9.
- the plastic plate 5 contains two parallel slots 10, 11 (see also FIG. 3) in the width of the ceramic supports, through which they are inserted and protrude with an outer edge region 12 over the plastic plate 5.
- This outer edge region 12 on a ceramic carrier plate 2 or 3 is shown separately in FIG. 2. From this it can be seen that thick-film conductor tracks 13 are guided on the outer edge region 12 of a ceramic carrier plate 2 and are self-supporting widen there to 14 terminal contacts. A number of such connection contacts lie next to one another in a grid dimension corresponding to the mating connector provided. The dimensions could be chosen like mini or microtimer contacts.
- the surfaces are thick-film gold or Ag or AgPd with Sn (dipped) or made of eutectic solder.
- the plastic plate 5 and the ceramic carrier plates 2, 3 are linearly sealed from the outside in the area of the slots 10, 11 and continuously sealed and cast with adhesive material to form an adhesive seal 15.
- Spring contacts 16 with the corresponding contacts of the corresponding surface of a mating connector are plugged onto the connection contacts 14.
- An annular circumferential sealing lip 17 which projects far from the plastic plate 5 is provided for sealing the connection area.
- a sealing ring 18 embedded in a groove can be used in the outer region.
- the thick-film hybrid assembly is, as usual, mounted on a heat sink and the connector part against e.g. a metal housing screwed and sealed.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Image Analysis (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Processing (AREA)
Abstract
L'invention concerne une unité hybride en couche épaisse (1) avec une prise enfichable et au moins une plaque-support en céramique (2, 3) sur laquelle sont disposées des pistes conductrices en couche épaisse (7) au-dessus de la métallisation en couche épaisse. Dans l'invention, des pistes conductrices en couche épaisse (7) sont disposées sur le bord extérieur (12) de la plaque-support en céramique (2, 3) et forment à cet endroit des contacts de raccordement (14) pour une contre-fiche (16). L'une au moins des plaques-supports en céramique (2, 3) est enfichée avec son bord extérieur (12) par une fente (10, 11) dans une pièce en matière plastique (5) de telle manière que les contacts de raccordement (14) soient libres sur l'un des côtés de la pièce en matière plastique (5) et soient disponibles pour un raccordement sur la contre-fiche. Pour assurer le maintien et l'étanchéité entre la plaque-support en céramique (2, 3) et la pièce en matière plastique (5), la fente (10, 11) placée entre ces éléments est scellée (joint adhésif 15). On réalise ainsi, dans de bonnes conditions, un enfichage direct d'une unité hybride en couche épaisse et on évite d'utiliser d'autres matériaux conducteurs, comme le grillage estampé, et d'établir des liaisons, par exemple par bonding ou par soudage.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19904005113 DE4005113A1 (de) | 1990-02-17 | 1990-02-17 | Dickschichthybridbaugruppe mit einem steckanschluss |
| DE4005113 | 1990-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP0515383A1 true EP0515383A1 (fr) | 1992-12-02 |
Family
ID=6400449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19910901694 Ceased EP0515383A1 (fr) | 1990-02-17 | 1991-01-18 | Unite hybride en couche epaisse avec prise enfichable |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0515383A1 (fr) |
| JP (1) | JPH05504234A (fr) |
| DE (1) | DE4005113A1 (fr) |
| WO (1) | WO1991012705A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4142138C2 (de) * | 1991-12-20 | 1998-04-23 | Bosch Gmbh Robert | Elektrisches Steuergerät |
| DE4142139A1 (de) * | 1991-12-20 | 1993-06-24 | Bosch Gmbh Robert | Elektronisches geraet |
| DE10300171A1 (de) * | 2003-01-08 | 2004-07-22 | Hella Kg Hueck & Co. | Elektronische Baugruppe mit metallischem Gehäuseteil |
| DE102010025086A1 (de) * | 2010-06-25 | 2011-12-29 | Continental Automotive Gmbh | Verfahren zur elektrischen Kontaktierung einer elektrischen Baugruppe für ein Kraftfahrzeug mit zumindest einem Stecker |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1054236A (fr) * | 1974-06-20 | 1979-05-08 | Kazuyasu Sugimoto | Boitier et dispositif de retenue pour connecteur de plaquette de circuit imprime |
| DE8428437U1 (de) * | 1984-09-27 | 1986-01-30 | Robert Bosch Gmbh, 7000 Stuttgart | Schaltungshybrid für elektronische Schaltungen |
| US4843520A (en) * | 1987-02-03 | 1989-06-27 | Matsushita Electric Industrial Co. Ltd. | Electronic circuit module |
| US4818240A (en) * | 1987-10-30 | 1989-04-04 | International Business Machines Corporation | Power rails for edge mounting modules |
-
1990
- 1990-02-17 DE DE19904005113 patent/DE4005113A1/de not_active Withdrawn
-
1991
- 1991-01-18 WO PCT/DE1991/000037 patent/WO1991012705A1/fr not_active Ceased
- 1991-01-18 JP JP3502192A patent/JPH05504234A/ja active Pending
- 1991-01-18 EP EP19910901694 patent/EP0515383A1/fr not_active Ceased
Non-Patent Citations (1)
| Title |
|---|
| See references of WO9112705A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05504234A (ja) | 1993-07-01 |
| WO1991012705A1 (fr) | 1991-08-22 |
| DE4005113A1 (de) | 1991-08-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69220601T2 (de) | Schichtwiderstand | |
| DE102009032973A1 (de) | Leistungshalbleitervorrichtung | |
| DE102009055691A1 (de) | Leistungshalbleitermodul | |
| DE2822888A1 (de) | Hermetisch abdichtbare baugruppe | |
| DE1912045A1 (de) | Halterungsanordnung fuer ein Halbleiterbauelement | |
| EP0515383A1 (fr) | Unite hybride en couche epaisse avec prise enfichable | |
| DE2004776C2 (de) | Halbleiterbauelement | |
| DE19739495C2 (de) | Piezoelektrisches Bauteil und Verfahren zur Herstellung desselben | |
| DE19523977A1 (de) | Microchip-Sicherung | |
| DE2306288A1 (de) | Traeger fuer integrierte schaltungen | |
| DE1514643A1 (de) | Halbleiteranordnung | |
| DE202010000052U1 (de) | Photovoltaikmodul mit einer Anschlussdose | |
| DE3018846C2 (fr) | ||
| DE2111098A1 (de) | Transistor-Konstruktion | |
| DE3934348C2 (fr) | ||
| DE2223582A1 (de) | Verdrahtungsanordnung | |
| DE8623251U1 (de) | Scheibenförmige dielektrische Trägerplatte | |
| DE19502829A1 (de) | Verbinder mit Anschlüssen mit Anti-Docht-Effekt | |
| DE1489616A1 (de) | Gasentladungslampe | |
| DE4116016C2 (de) | Handapparat für ein Fernmeldegerät | |
| EP0061648A2 (fr) | Dispositif électrique dont la partie active est placée sur un support métallique et procédé pour la fabrication du dispositif | |
| EP2033219A1 (fr) | Boîtier de puissance pour puces à semi-conducteur et configuration dudit boîtier pour la dissipation de chaleur | |
| DE2904806A1 (de) | Elektrisches bauteil | |
| DE3744617C2 (fr) | ||
| DE6607827U (de) | Halbleiterbauteil |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 19920725 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB |
|
| 17Q | First examination report despatched |
Effective date: 19940114 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED |
|
| 18R | Application refused |
Effective date: 19940722 |