EP0395051B1 - Surface mounted printed circuit board connector - Google Patents
Surface mounted printed circuit board connector Download PDFInfo
- Publication number
- EP0395051B1 EP0395051B1 EP90107935A EP90107935A EP0395051B1 EP 0395051 B1 EP0395051 B1 EP 0395051B1 EP 90107935 A EP90107935 A EP 90107935A EP 90107935 A EP90107935 A EP 90107935A EP 0395051 B1 EP0395051 B1 EP 0395051B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- printed
- contact
- contact elements
- board connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 3
- 239000011888 foil Substances 0.000 claims description 8
- 230000006978 adaptation Effects 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
Definitions
- the invention relates to a printed circuit board connector for surface mounting with a plurality of contact elements arranged in an essentially cuboidal insulating body and with connecting means for electrically connecting the contact elements to contacting surfaces located on a printed circuit board.
- PCB connectors for surface mounting are already available in different versions.
- a connector for SMD technology in which the contact elements have specially designed contact legs that protrude from a strip-shaped insulating body. These contact legs extend to the contacting surfaces on the printed circuit board.
- the contact elements of the known connector are arranged, for example, in three rows of contact elements one above the other, each of the contact element rows containing a large number of individual contact elements lying next to one another.
- the contact legs leave the insulating body in a direction running parallel to the circuit board and are then angled towards the circuit board. They end in contact stamps which are provided for a soldered connection to the contacting surfaces arranged on the printed circuit board.
- a row of contacting surfaces is assigned to each row of contact elements on the printed circuit board in such a way that the contact legs of each row of contact elements run without crossing to the contact legs of the respective other rows of contact elements.
- the arrangement of the contacting surfaces in several rows requires a relatively large amount of space for connecting the contact legs on the printed circuit board, particularly in the case of multi-row connectors.
- the object of the present invention is therefore to provide a printed circuit board connector according to the preamble of claim 1, with which the edge region of a printed circuit board can be optimally used for the connection of a large number of contact elements and also contact elements with a very low electrical contact resistance are available.
- a printed circuit board connector designed according to the invention allows an arrangement of contacting surfaces on both sides of a printed circuit board, the thickness of the printed circuit board being insignificant, since the flexibility of the printed circuit boards allows adaptation of the printed circuit board connector designed according to the invention to different printed circuit board thicknesses.
- FIG. 1 shows the front F of a printed circuit board connector SV designed according to the invention.
- the end faces of a large number of contact elements can be seen in the rectangular area of the front side F.
- the circuit board connector SV is mounted in front of an end face SF of a printed circuit board L, the course of which is indicated on both sides of the front side F shown.
- the plurality of contact elements K are arranged in rows running parallel to the circuit board level.
- the circuit board connector SV is attached to the end face SF of the circuit board L in such a way that several rows (in the example five rows) of contact elements K1 are arranged above the circuit board level and several rows of contact elements K2 are arranged below the circuit board level. Between these contact elements K1, K2, which are arranged above and below the circuit board level, there are two rows of contact elements K3 approximately at the level of the end face SF of the circuit board L.
- each of the four corners of the front side F there is a contact element SK designed for current transmission, which in the example shown is designed as a three-lamella contact spring for contacting a vertically standing contact knife (not shown) on both sides.
- FIG. 2 shows a cross section through the central region (section line II-II in FIG. 1) of the printed circuit board connector according to FIG. 1 together with the associated edge region of the printed circuit board L.
- the insulating housing I of the circuit board connector SV is arranged in front of the end face SF of the circuit board L at a right angle to the circuit board level.
- the contact elements K1, K2, K3 run parallel to the circuit board level and penetrate the insulating body I from its front side FS to the rear side RS, which runs parallel to the end face SF of the circuit board L at a short distance in front of it.
- the contact elements K1, K2 located above and below the circuit board level protrude on the rear side RS of the insulating housing I with their contacting needles KN from the insulating housing I.
- the contact elements K3 located at the end face SF have rigid solder lugs LO, which likewise protrude from the insulating housing I on the rear side RS and rest on the upper side OS of the printed circuit board L.
- the contact elements K3 arranged in front of the end face SF of the printed circuit board are designed as double contacts DK with two electrically connected individual contacts lying one above the other.
- a circuit foil LF nestles against the rear side RS of the insulating housing I, which forms a loop SL towards the circuit board L and ends parallel to the circuit board level at the top and bottom side OS, US of the circuit board L.
- the contacting needles KN protruding from the insulating housing I in the horizontal direction are passed through plated-through holes (not visible) on the conductor foil LF and soldered to the conductor foil with associated conductor tracks (not visible).
- the conductor foil LF is reinforced with a stiffening plate V.
- the contacting surfaces WK for the rigid soldering lugs LF of the contact elements K3 located in the intermediate region are arranged directly on the edge of the top side of the printed circuit board OS.
- the contacting surfaces KO for the connection of the printed circuit films LF are arranged on the upper side OS and on the lower side US of the printed circuit board L.
- These contacting surfaces KO lie on the top and bottom of the circuit board L in a single row (not visible) parallel to the edge of the circuit board L.
- the conductor tracks (not visible) on the conductor foils LF are soldered to the contacting surfaces KO.
- FIG. 3 shows a cross section through a side part ST of the circuit board connector SV according to FIG. 1 (section line III-III).
- the two side parts ST of the circuit board connector SV are designed as a flange for mechanically attaching the insulating body I to the circuit board L.
- Two superimposed contact elements SK designed for current transmission are integrated in each flange.
- contact elements SK are each provided with a contacting extension KF, which is provided for resting on associated contacting surfaces of the printed circuit board L.
- a contact element SK is provided for the current transmission and one for the underside of the circuit board.
- the contact element SK provided for the underside of the circuit board is accommodated in the insulating body I in a contact chamber KK, which allows the contact element SK and its contact extension KF to be displaced in a direction perpendicular to the circuit board plane. This enables a connection on both sides of the contact elements SK provided for current transmission for printed circuit boards of different thicknesses to be ensured.
- the flange is fastened to the printed circuit board L with two screws S, which are electrically insulated from the contacting extensions KF.
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Abstract
Description
Die Erfindung betrifft einen Leiterplattensteckverbinder zur Oberflächenmontage mit einer Vielzahl von in einem, im wesentlichen quaderförmigen Isolierkörper angeordneten Kontaktelementen und mit Anschlußmitteln zur elektrischen Verbindung der Kontaktelemente mit auf einer Leiterplatte befindlichen Kontaktierungsoberflächen.The invention relates to a printed circuit board connector for surface mounting with a plurality of contact elements arranged in an essentially cuboidal insulating body and with connecting means for electrically connecting the contact elements to contacting surfaces located on a printed circuit board.
Solche Leiterplattensteckverbinder für die Oberflächenmontage gibt es bereits in verschiedenen Ausführungen. So ist z.B. aus "Elektronik-Entwicklung 6/85, Seite 8" ein Steckverbinder für die SMD-Technik bekannt, bei dem die Kontaktelemente speziell ausgebildete Kontaktbeine aufweisen, die aus einem leistenförmigen Isolierkörper herausragen. Diese Kontaktbeine reichen bis zu den Kontaktierungsoberflächen auf der Leiterplatte.Such PCB connectors for surface mounting are already available in different versions. For example, from "Electronics Development 6/85, page 8" a connector for SMD technology is known, in which the contact elements have specially designed contact legs that protrude from a strip-shaped insulating body. These contact legs extend to the contacting surfaces on the printed circuit board.
Die Kontaktelemente des bekannten Steckverbinders sind z.B. in drei Kontaktelementereihen übereinander angeordnet, wobei jede der Kontaktelementereihen eine Vielzahl von einzelnen nebeneinanderliegenden Kontaktelementen enthält. Die Kontaktbeine verlassen den Isolierkörper in einer parallel zur Leiterplatte verlaufenden Richtung und sind danach zur Leiterplatte hin abgewinkelt. Sie enden in Kontaktstempeln, die für eine Lötverbindung mit den auf der Leiterplatte angeordneten Kontaktierungsoberflächen vorgesehen sind. Jeder Kontaktelementenreihe ist auf der Leiterplatte eine Reihe von Kontaktierungsoberflächen so zugeordnet, daß die Kontaktbeine jeder Kontaktelementenreihe kreuzungsfrei zu den Kontaktbeinen der jeweiligen anderen Kontaktelementereihen verlaufen.The contact elements of the known connector are arranged, for example, in three rows of contact elements one above the other, each of the contact element rows containing a large number of individual contact elements lying next to one another. The contact legs leave the insulating body in a direction running parallel to the circuit board and are then angled towards the circuit board. They end in contact stamps which are provided for a soldered connection to the contacting surfaces arranged on the printed circuit board. A row of contacting surfaces is assigned to each row of contact elements on the printed circuit board in such a way that the contact legs of each row of contact elements run without crossing to the contact legs of the respective other rows of contact elements.
Durch die Anordnung der Kontaktierungsoberflächen in mehreren Reihen wird insbesondere bei mehrreihigen Steckverbindern verhältnismäßig viel Platz zum Anschluß der Kontaktbeine auf der Leiterplatte benötigt.The arrangement of the contacting surfaces in several rows requires a relatively large amount of space for connecting the contact legs on the printed circuit board, particularly in the case of multi-row connectors.
Aus der deutschen Patentschrift DE-PS 35 44 125 ist ein Steckverbinder für die SMD-Technik bekannt, bei dem mehrere Kontaktelementereihen an eine einzige Reihe von Kontaktierungsoberflächen angeschlossen sind. Dies wird mit Hilfe eines kurzen Leiterstückes, z.B. in Form eines Flachbandkabels erreicht, das an einem Ende mit den Kontaktelementen verbunden ist und mit dem anderen Ende benachbart zu den Kontaktierungsoberflächen auf der Leiterplatte endet.From the German patent DE-PS 35 44 125 a connector for SMD technology is known, in which several rows of contact elements are connected to a single row of contact surfaces. This is done with the help of a short piece of ladder, e.g. achieved in the form of a ribbon cable, which is connected at one end to the contact elements and ends at the other end adjacent to the contacting surfaces on the circuit board.
Das zwischen den Kontaktelementen und den Kontaktieroberflächen eingefügte Leiterstück erhöht bei diesem Steckverbinder den elektrischen Übergangswiderstand der Kontaktelemente, weshalb sich dieser Steckverbinder nur für Verbindungen mit geringer Strombelastung der Kontaktelemente eignet.The conductor piece inserted between the contact elements and the contacting surfaces increases the electrical contact resistance of the contact elements in this connector, which is why this connector is only suitable for connections with a low current load on the contact elements.
Aufgabe der vorliegenden Erfindung ist es daher, einen Leiterplattensteckverbinder gemäß dem Oberbegriff des Schutzanspruchs 1 anzugeben, mit dem der Randbereich einer Leiterplatte für den Anschluß einer großen Anzahl von Kontaktelemente optimal ausgenutzt werden kann und auch Kontaktelemente mit einem sehr geringen elektrischen Übergangswiderstand zur Verfügung stehen.The object of the present invention is therefore to provide a printed circuit board connector according to the preamble of claim 1, with which the edge region of a printed circuit board can be optimally used for the connection of a large number of contact elements and also contact elements with a very low electrical contact resistance are available.
Gelöst wird diese Aufgabe erfindungsgemäß durch die im kennzeichnenden Teil des Schutzanspruchs 1 angegebenen Merkmale.This object is achieved according to the invention by the features specified in the characterizing part of protection claim 1.
Ein erfindungsgemäß ausgebildeter Leiterplattensteckverbinder erlaubt eine Anordnung von Kontaktierungsoberflächen an beiden Seiten einer Leiterplatte, wobei die Dicke der Leiterplatte unwesentlich ist, da die Flexibilität der Leiterstücke eine Anpassung des erfindungsgemäß ausgebildeten Leiterplattensteckverbinders an unterschiedliche Leiterplattendicken erlaubt.A printed circuit board connector designed according to the invention allows an arrangement of contacting surfaces on both sides of a printed circuit board, the thickness of the printed circuit board being insignificant, since the flexibility of the printed circuit boards allows adaptation of the printed circuit board connector designed according to the invention to different printed circuit board thicknesses.
Vorteilhafte Weiterbildungen der Erfindung sind in den Unteransprüchen angegeben.Advantageous developments of the invention are specified in the subclaims.
Ein Ausführungsbeispiel der Erfindung wird im folgenden anhand der Zeichnung näher erläutert.An embodiment of the invention is explained below with reference to the drawing.
Dabei zeigen
- FIG 1 einen erfindungsgemäß ausgebildeten Leiterplattensteckverbinder in Frontansicht,
- FIG 2 einen Querschnitt durch den Leiterplattensteckverbinder nach FIG 1 entlang der Schnittlinie II-II,
- FIG 3 einen Querschnitt durch den Leiterplattensteckverbinder nach FIG 1 entlang der Schnittlinie III-III.
- 1 shows a printed circuit board connector designed according to the invention in front view,
- 2 shows a cross section through the circuit board connector according to FIG. 1 along the section line II-II,
- 3 shows a cross section through the circuit board connector according to FIG 1 along the section line III-III.
In FIG 1 ist die Frontseite F eines erfindungsgemäß ausgebildeten Leiterplattensteckverbinders SV dargestellt. In der rechteckigen Fläche der Frontseite F sind die Stirnseiten einer Vielzahl von Kontaktelementen ersichtlich. Der Leiterplattensteckverbinder SV ist vor einer Stirnfläche SF einer Leiter platte L angebracht, deren Verlauf zu beiden Seiten der gezeigten Frontseite F angedeutet ist.1 shows the front F of a printed circuit board connector SV designed according to the invention. The end faces of a large number of contact elements can be seen in the rectangular area of the front side F. The circuit board connector SV is mounted in front of an end face SF of a printed circuit board L, the course of which is indicated on both sides of the front side F shown.
Die Vielzahl von Kontaktelementen K ist in zur Leiterplattenebene parallel verlaufenden Reihen angeordnet. Wie aus der Zeichnung zu ersehen ist, ist der Leiterplattensteckverbinder SV so an der Stirnseite SF der Leiterplatte L befestigt, daß mehrere Reihen (im Beispiel fünf Reihen) von Kontaktelementen K1 oberhalb der Leiterplattenebene und mehrere Reihen von Kontaktelementen K2 unterhalb der Leiterplattenebene angeordnet sind. Zwischen diesen ober- und unterhalb der Leiterplattenebene angeordneten Kontaktelementen K1, K2 liegen zwei Reihen von Kontaktelementen K3 etwa in Höhe der Stirnfläche SF der Leiterplatte L.The plurality of contact elements K are arranged in rows running parallel to the circuit board level. As can be seen from the drawing, the circuit board connector SV is attached to the end face SF of the circuit board L in such a way that several rows (in the example five rows) of contact elements K1 are arranged above the circuit board level and several rows of contact elements K2 are arranged below the circuit board level. Between these contact elements K1, K2, which are arranged above and below the circuit board level, there are two rows of contact elements K3 approximately at the level of the end face SF of the circuit board L.
In den vier Ecken der Frontseite F ist je ein zur Stromübertragung ausgebildetes Kontaktelement SK vorhanden, das in dem gezeigten Beispiel als dreilamellige Kontaktfeder zum beidseitigen Kontaktieren eines vertikal stehenden Kontaktmessers (nicht dargestellt) ausgebildet ist.In each of the four corners of the front side F there is a contact element SK designed for current transmission, which in the example shown is designed as a three-lamella contact spring for contacting a vertically standing contact knife (not shown) on both sides.
In FIG 2 ist ein Querschnitt durch den mittleren Bereich (Schnittlinie II-II in FIG 1) des Leiterplattensteckverbinders nach FIG 1 zusammen mit dem zugehörigen Randbereich der Leiterplatte L dargestellt.FIG. 2 shows a cross section through the central region (section line II-II in FIG. 1) of the printed circuit board connector according to FIG. 1 together with the associated edge region of the printed circuit board L.
Das Isoliergehäuse I des Leiterplattensteckverbinders SV ist vor der Stirnfläche SF der Leiterplatte L in rechtem Winkel zur Leiterplattenebene angeordnet. Die Kontaktelemente K1, K2, K3 verlaufen parallel zur Leiterplattenebene und durchdringen den Isolierkörper I von seiner Frontseite FS zur Rückseite RS, die parallel zur Stirnfläche SF der Leiterplatte L in geringem Abstand vor dieser verläuft. Die ober- und unterhalb der Leiterplattenebene befindlichen Kontaktelemente K1, K2 ragen an der Rückseite RS des Isoliergehäuses I mit ihren Kontaktiernadeln KN aus dem Isoliergehäuse I heraus.The insulating housing I of the circuit board connector SV is arranged in front of the end face SF of the circuit board L at a right angle to the circuit board level. The contact elements K1, K2, K3 run parallel to the circuit board level and penetrate the insulating body I from its front side FS to the rear side RS, which runs parallel to the end face SF of the circuit board L at a short distance in front of it. The contact elements K1, K2 located above and below the circuit board level protrude on the rear side RS of the insulating housing I with their contacting needles KN from the insulating housing I.
Die in Höhe der Stirnfläche SF befindlichen Kontaktelemente K3 weisen starre Lötfahnen LO auf, die ebenfalls an der Rückseite RS aus dem Isoliergehäuse I herausragen und an der Oberseite OS der Leiterplatte L aufliegen.The contact elements K3 located at the end face SF have rigid solder lugs LO, which likewise protrude from the insulating housing I on the rear side RS and rest on the upper side OS of the printed circuit board L.
Die vor der Stirnfläche SF der Leiterplatte angeordneten Kontaktelemente K3 sind als Doppelkontakte DK mit zwei übereinander liegenden elektrisch verbundenen Einzelkontakten ausgeführt. Oberhalb und unterhalb der Leiterplattenebene schmiegt sich an die Rückseite RS des Isoliergehäuses I jeweils eine Leiterfolie LF an, die zur Leiterplatte L hin eine Schleife SL bildet und parallel zur Leiterplattenebene an der Ober- bzw. Unterseite OS, US der Leiterplatte L endet.The contact elements K3 arranged in front of the end face SF of the printed circuit board are designed as double contacts DK with two electrically connected individual contacts lying one above the other. Above and below the circuit board level, a circuit foil LF nestles against the rear side RS of the insulating housing I, which forms a loop SL towards the circuit board L and ends parallel to the circuit board level at the top and bottom side OS, US of the circuit board L.
Die in horizontaler Richtung aus dem Isoliergehäuse I herausragenden Kontaktierungsnadeln KN sind durch Durchkontaktierungen (nicht ersichtlich) auf der Leiterfolie LF hindurchgeführt und mit zugeordneten Leiterbahnen (nicht ersichtlich) auf der Leiterfolie verlötet. Zur Erhöhung der Stabilität im Bereich der Kontaktierungsnadeln KN ist die Leiterfolie LF mit einer Versteifungsplatte V verstärkt.The contacting needles KN protruding from the insulating housing I in the horizontal direction are passed through plated-through holes (not visible) on the conductor foil LF and soldered to the conductor foil with associated conductor tracks (not visible). To increase the stability in the area of the contacting needles KN, the conductor foil LF is reinforced with a stiffening plate V.
Unmittelbar am Rand der Leiterplattenoberseite OS sind die Kontaktierungsoberflächen WK für die starren Lötfahnen LF der im Zwischenbereich befindlichen Kontaktelemente K3 angeordnet. In geringem Abstand vom Leiterplattenrand entfernt sind auf der Oberseite OS und auf der Unterseite US der Leiterplatte L die Kontaktierungsoberflächen KO für den Anschluß der Leiterfolien LF angeordnet. Diese Kontaktierungsoberflächen KO liegen auf der Ober- und der Unterseite der Leiterplatte L jeweils in einer einzigen Reihe (nicht ersichtlich) parallel zum Rand der Leiterplatte L. Die Leiterbahnen (nicht ersichtlich) auf den Leiterfolien LF sind mit den Kontaktierungsoberflächen KO verlötet.The contacting surfaces WK for the rigid soldering lugs LF of the contact elements K3 located in the intermediate region are arranged directly on the edge of the top side of the printed circuit board OS. At a short distance from the edge of the printed circuit board, the contacting surfaces KO for the connection of the printed circuit films LF are arranged on the upper side OS and on the lower side US of the printed circuit board L. These contacting surfaces KO lie on the top and bottom of the circuit board L in a single row (not visible) parallel to the edge of the circuit board L. The conductor tracks (not visible) on the conductor foils LF are soldered to the contacting surfaces KO.
In FIG 3 ist ein Querschnitt durch ein Seitenteil ST des Leiterplattensteckverbinders SV nach FIG 1 (Schnittlinie III-III) dargestellt. Die beiden Seitenteile ST des Leiterplattensteckverbinders SV sind als Flansch zur mechanischen Befestigung des Isolierkörpers I an der Leiterplatte L ausgebildet. In jedem Flansch sind jeweils zwei übereinanderliegende zur Stromübertragung ausgebildete Kontaktelemente SK integriert.FIG. 3 shows a cross section through a side part ST of the circuit board connector SV according to FIG. 1 (section line III-III). The two side parts ST of the circuit board connector SV are designed as a flange for mechanically attaching the insulating body I to the circuit board L. Two superimposed contact elements SK designed for current transmission are integrated in each flange.
Diese Kontaktelemente SK sind mit je einem Kontaktierungsfortsatz KF versehen, der zur Auflage auf zugehörigen Kontaktierungsoberflächen der Leiterplatte L vorgesehen ist. In jedem Seitenteil ST des Leiterplattensteckverbinders SV ist ein zur Stromübertragung ausgebildetes Kontaktelement SK für die Oberseite und eines für die Unterseite der Leiterplatte vorgesehen.These contact elements SK are each provided with a contacting extension KF, which is provided for resting on associated contacting surfaces of the printed circuit board L. In each side part ST of the circuit board connector SV, a contact element SK is provided for the current transmission and one for the underside of the circuit board.
Das für die Unterseite der Leiterplatte vorgesehene Kontaktelement SK ist im Isolierkörper I in einer Kontaktkammer KK untergebracht, die ein Verschieben des Kontaktelementes SK und seines Kontaktierungsfortsatzes KF in einer zur Leiterplattenebene senkrechten Richtung erlaubt. Dadurch kann ein beidseitiger Anschluß, der zur Stromübertragung vorgesehenen Kontaktelemente SK für Leiterplatten unterschiedlicher Dicke sichergestellt werden. Die Befestigung des Flansches an der Leiterplatte L erfolgt mit zwei Schrauben S, die gegenüber den Kontaktierungsfortsätzen KF elektrisch isoliert sind.The contact element SK provided for the underside of the circuit board is accommodated in the insulating body I in a contact chamber KK, which allows the contact element SK and its contact extension KF to be displaced in a direction perpendicular to the circuit board plane. This enables a connection on both sides of the contact elements SK provided for current transmission for printed circuit boards of different thicknesses to be ensured. The flange is fastened to the printed circuit board L with two screws S, which are electrically insulated from the contacting extensions KF.
Claims (10)
- Printed-circuit board connector for surface mounting (SMD) having a multiplicity of contact elements which are arranged in an insulating body (I) of essentially right parallelepiped form, and connecting means for electrically joining the contact elements (K1, K2) to contact-making surfaces (KO) situated on a printed-circuit board (L), characterized in that the insulating body (I) is fastened in front of an end face (SF) of the printed-circuit board (L) such that first and second contact elements (K1, K2) are arranged on one side each of the printed-circuit board plane, in that third contact elements (K3) are arranged in an intermediate region approximately at the level of the end face (SF), in that the connecting means for the first and second contact elements (K1 , K2) which are assigned contact-making surfaces (KO) on the respectively assigned side of the printed-circuit board (L) are constructed of flexible conductor pieces (LF) which are fastened with one end on the contact elemens (K1, K2) and with their other end on the contact-making surfaces (KO), and in that the third contact elements (K3) have rigid solder tabs (LO) as connecting means which are fastened to further contact-making surfaces (WK) on the upper side of the printed-circuit board (L).
- Printed-circuit board connector according to Claim 1, characterized in that the flexible conductor pieces are constructed as conducting foils.
- Printed-circuit board connector according to Claim 2, characterized in that the conducting foils (LF) in the connecting region of the first and second contact elements (K1, K2) run in each case perperdicular to the contact element axes, and in that the first and second contact elements (K1, K2) have contact-making pins (KN) which penetrate the conducting foil (LF).
- Printed-circuit board connector according to one of the preceding claims, characterized in that the contact-making surfaces for the first, second, and third contact elements are arranged in each case in one row.
- Printed-circuit board connector according to one of the preceding claims, characterized in that the contact-making surfaces for the third contact elements are arranged directly at the edge of the printed-circuit board.
- Printed-circuit board connector according to one of the preceding claims, characterized in that in each case one contact element (SK) constructed for transmitting current is arranged above and below the printed-circuit board plane in the two lateral sides of the insulating body (I).
- Printed-circuit board connector according to Claim 6, characterized in that the contact elements (SK) which are constructed for transmitting current and are arranged above the printed-circuit board plane are in each case integrated in a flange which is constructed for fastening the insulating body (I) on the printed-circuit board (L).
- Printed-circuit board connector according to Claim 6 or 7, characterized in that the contact elements (SK) which are constructed for transmitting current have in each case one contact-making projection (KF) of web-shaped construction as correcting means.
- Printed-circuit board connector according to one of Claims 6 to 8, characterized in that the web-shaped contact-making projections (KF) are pressed on assigned contact-making surfaces by means of clamping junctions which are provided for fastening the insulating body (I) on the printed-circuit board (L).
- Printed-circuit board connector according to one of Claims 6 to 9, characterized in that the contact elements which are constructed for transmitting current and are arranged below the printed-circuit board plane are arranged in contact chambers (KK) which allow the contact elements to be displaced in a direction perpendicular to the printed-circuit board plane for adaptation to printed-circuit boards of different thicknesses.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE8905434U DE8905434U1 (en) | 1989-04-28 | 1989-04-28 | PCB connectors for surface mounting |
| DE8905434U | 1989-04-28 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0395051A2 EP0395051A2 (en) | 1990-10-31 |
| EP0395051A3 EP0395051A3 (en) | 1991-09-25 |
| EP0395051B1 true EP0395051B1 (en) | 1994-10-12 |
Family
ID=6838816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP90107935A Expired - Lifetime EP0395051B1 (en) | 1989-04-28 | 1990-04-26 | Surface mounted printed circuit board connector |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0395051B1 (en) |
| AT (1) | ATE112896T1 (en) |
| DE (2) | DE8905434U1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137721A (en) * | 2018-02-09 | 2019-08-16 | 巧连科技股份有限公司 | Electric connector structure |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10029925C1 (en) * | 2000-06-17 | 2002-01-10 | Harting Kgaa | PCB connector |
| JP2003045519A (en) * | 2001-07-19 | 2003-02-14 | Molex Inc | Right-angle type electrical connector |
| DE202012002352U1 (en) | 2011-05-17 | 2012-04-18 | Erni Electronics Gmbh | Arrangement of plug connector and circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3315217A (en) * | 1965-03-19 | 1967-04-18 | Elco Corp | Connector for thin film circuits |
| DE2525864C3 (en) * | 1975-06-10 | 1980-01-31 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Arrangement to increase the number of contacts in connectors of pluggable flat modules |
| US4736275A (en) * | 1987-02-09 | 1988-04-05 | Augat Inc. | Circuit board contact guide pattern |
| EP0286440A3 (en) * | 1987-04-09 | 1990-09-12 | RAYCHEM CORPORATION (a Delaware corporation) | Connector assembly |
-
1989
- 1989-04-28 DE DE8905434U patent/DE8905434U1/en not_active Expired - Lifetime
-
1990
- 1990-04-26 DE DE59007421T patent/DE59007421D1/en not_active Expired - Fee Related
- 1990-04-26 EP EP90107935A patent/EP0395051B1/en not_active Expired - Lifetime
- 1990-04-26 AT AT90107935T patent/ATE112896T1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137721A (en) * | 2018-02-09 | 2019-08-16 | 巧连科技股份有限公司 | Electric connector structure |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0395051A3 (en) | 1991-09-25 |
| EP0395051A2 (en) | 1990-10-31 |
| ATE112896T1 (en) | 1994-10-15 |
| DE8905434U1 (en) | 1990-08-23 |
| DE59007421D1 (en) | 1994-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE60024212T2 (en) | RF Edge Connectors | |
| DE3909263C2 (en) | ||
| DE3639367C2 (en) | ||
| DE69824211T2 (en) | Surface mount connector with integrated circuit board assembly | |
| DE69022657T2 (en) | Circuit board mountable electrical connector. | |
| DE69400655T2 (en) | Holding system for PCB-mounted electrical connectors | |
| EP0144923B1 (en) | Front board fitting unit for a circuit board | |
| DE2455619A1 (en) | CONNECTOR ARRANGEMENT | |
| DE602004000243T2 (en) | Connector in which the crosstalk is suppressed by a ground contact | |
| DE3618470A1 (en) | PLUG COUPLING | |
| DE1269692B (en) | Module arrangement in frame construction for electronic circuits | |
| DE69903093T2 (en) | Connector for a flat coaxial cable | |
| EP0150342B1 (en) | Angled plug-connector | |
| DE3116410C2 (en) | ||
| DE2156138A1 (en) | Edge connectors for printed circuits | |
| EP0395051B1 (en) | Surface mounted printed circuit board connector | |
| DE68923361T2 (en) | Modular connector system with surface-mounted connectors with high contact element density. | |
| DE8630076U1 (en) | Surface mount connectors | |
| DE6607308U (en) | SWITCH ASSEMBLY WITH A CONTACT CONNECTION TO A PRINTED CIRCUIT | |
| DE2901678B1 (en) | Distributor for small telephone exchanges | |
| EP0087126A1 (en) | Push connector for printed circuit boards | |
| DE2810575A1 (en) | PRINTED ELECTRIC CIRCUIT BOARD | |
| DE8428437U1 (en) | Circuit hybrid for electronic circuits | |
| DE3430573A1 (en) | Electrical connection | |
| DE2811204A1 (en) | DEVICE FOR ELECTRICAL CONNECTION TO THE CIRCUITS OF A PRESSURE CIRCUIT CARD IN THE AREA OF THE FRONT, FREE EDGE OF THE CARD |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE CH DE FR GB IT LI NL |
|
| 17P | Request for examination filed |
Effective date: 19901205 |
|
| PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME AG |
|
| AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH DE FR GB IT LI NL |
|
| RAP3 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME AG |
|
| 17Q | First examination report despatched |
Effective date: 19940328 |
|
| GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
| AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH DE FR GB IT LI NL |
|
| REF | Corresponds to: |
Ref document number: 112896 Country of ref document: AT Date of ref document: 19941015 Kind code of ref document: T |
|
| REF | Corresponds to: |
Ref document number: 59007421 Country of ref document: DE Date of ref document: 19941117 |
|
| ITF | It: translation for a ep patent filed | ||
| GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) |
Effective date: 19941221 |
|
| ET | Fr: translation filed | ||
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: AT Payment date: 19950324 Year of fee payment: 6 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 19950419 Year of fee payment: 6 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Effective date: 19950430 Ref country code: CH Effective date: 19950430 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 19950430 Year of fee payment: 6 |
|
| PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
| 26N | No opposition filed | ||
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19960322 Year of fee payment: 7 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 19960422 Year of fee payment: 7 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AT Effective date: 19960426 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Effective date: 19960430 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 19960620 Year of fee payment: 7 |
|
| BERE | Be: lapsed |
Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME A.G. Effective date: 19960430 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Effective date: 19961101 |
|
| NLV4 | Nl: lapsed or anulled due to non-payment of the annual fee |
Effective date: 19961101 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Effective date: 19970426 |
|
| GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 19970426 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19971231 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19980101 |
|
| REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 20050426 |