EP0173808A1 - Circuit de commande de panneaux d'affichage à cristaux liquides - Google Patents
Circuit de commande de panneaux d'affichage à cristaux liquides Download PDFInfo
- Publication number
- EP0173808A1 EP0173808A1 EP85107726A EP85107726A EP0173808A1 EP 0173808 A1 EP0173808 A1 EP 0173808A1 EP 85107726 A EP85107726 A EP 85107726A EP 85107726 A EP85107726 A EP 85107726A EP 0173808 A1 EP0173808 A1 EP 0173808A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- display
- voltage
- segment
- segments
- lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G1/00—Control arrangements or circuits, of interest only in connection with cathode-ray tube indicators; General aspects or details, e.g. selection emphasis on particular characters, dashed line or dotted line generation; Preprocessing of data
- G09G1/06—Control arrangements or circuits, of interest only in connection with cathode-ray tube indicators; General aspects or details, e.g. selection emphasis on particular characters, dashed line or dotted line generation; Preprocessing of data using single beam tubes, e.g. three-dimensional or perspective representation, rotation or translation of display pattern, hidden lines, shadows
- G09G1/14—Control arrangements or circuits, of interest only in connection with cathode-ray tube indicators; General aspects or details, e.g. selection emphasis on particular characters, dashed line or dotted line generation; Preprocessing of data using single beam tubes, e.g. three-dimensional or perspective representation, rotation or translation of display pattern, hidden lines, shadows the beam tracing a pattern independent of the information to be displayed, this latter determining the parts of the pattern rendered respectively visible and invisible
- G09G1/18—Control arrangements or circuits, of interest only in connection with cathode-ray tube indicators; General aspects or details, e.g. selection emphasis on particular characters, dashed line or dotted line generation; Preprocessing of data using single beam tubes, e.g. three-dimensional or perspective representation, rotation or translation of display pattern, hidden lines, shadows the beam tracing a pattern independent of the information to be displayed, this latter determining the parts of the pattern rendered respectively visible and invisible a small local pattern covering only a single character, and stepping to a position for the following character, e.g. in rectangular or polar co-ordinates, or in the form of a framed star
Definitions
- the invention is based on a circuit arrangement as defined in the preamble in the claim.
- LC displays which consist of many segments, are controlled in multiplex mode.
- the individual segments and their counter electrodes are combined in a matrix.
- each individual segment can be displayed by applying an alternating voltage, in that two opposing segments are activated simultaneously.
- Microprocessors are used to control the segments of the LC display, and the corresponding control voltages are applied to their outputs.
- the control voltages reach the LC display unit via LCD driver ICs.
- the advantage of the invention lies in the low manufacturing costs and in a higher reliability.
- FIG. 1a shows the electrodes of the same shape opposite the segments of FIG. 1a, which can be controlled via so-called common lines C1 to C4, these segments also being combined into groups.
- the lines S1 to S10 and C1 to C4 are arranged in a matrix, so that each individual element of the display can be controlled separately and individually. Only the element to which the corresponding control voltage is present via lines S1 to S10 and C1 to C4 is always displayed.
- FIGS. 2a-h The control voltages for the segment lines S1 and S2 and the common lines C1 to C4 are shown in FIGS. 2a-h.
- a character formed from the segments can be displayed by the phase relationship of the signals on lines S1 and S2 with respect to the phase relationship of the signals on lines C1 to C4.
- the mark "TUNING” and "FM” will come to the display, since the voltages according to Figures 2a and 2e, and FIG have mutually 2b and 2e the right for a display Phesenlage. (Fig.g, h)
- FIG. 3 a Heidelberg constructed according to the feature of the invention is shown.
- An LC display 1 with the inputs C1 to C4 and S1 to S10 is connected to a control unit 2.
- At the output A1 of the microprocessor 2 there is a square wave of constant amplitude and phase, which are switched cyclically via the analog switch 3 to the inputs C1 to C4 of the LC display.
- the analog switches 3 are controlled via control outputs A2 to A5, as a result of which the display is multiplexed.
- the example shown is a microprocessor with open-drain outputs, for which a pull-up resistor 4 is required.
- voltage dividers 5 are connected to the operating voltage, at the dividing points of which the output A1 of the control unit 2 is connected via the analog switch 3.
- the analog switches 3 shown can be omitted if a microprocessor with tri-state outputs is used.
- the inputs S1 to S10 of the display are connected to the outputs B1 to B10 of the microprocessor.
- the inputs S1 to S10 are connected to taps of voltage dividers 6 and via resistors 7 to the outputs B1 to B10 of the control unit 2.
- the LC display is effective at a certain voltage UD between the intersection of a segment line and a common line and e.g. switched off at 1/3 of this voltage UD. This is called 1/3 bias.
- the voltage dividers 5 for the common lines C1 to C4 and the voltage dividers 6 for the segment lines S1 to S10 are to be dimensioned such that a voltage swing of 4/3 of the voltage UD arises at the taps for the common lines C1 to C4, so that between common - And segment line either the full display voltage UD or 1/3 UD arises.
- a display voltage UD of e.g. 3 volts the potential on the common line must change between 4 volts and 0 volts if the potential of the segment line changes between 1 volt and 3 volts.
- FIG. 4 shows a dimensioning example for the voltage dividers 5 and 6, with which the required voltages can be generated.
- the A outputs and the B outputs are connected to the taps of the voltage dividers 5 and 6.
- the resistors 14 and 7 are, depending on the switching state of the stages 12 ', 13' at the outputs A and B, at the positive operating voltage + U in parallel with the resistor 8 or 10, or in parallel with the reference potential Resistors 9 and 11 or the resistors 14 and 7 are switched off with a high homing.
- the voltage swing on the common line 4/3 is the display voltage UD, i.e. 4 volts. Since the undervoltage only drops to 0.5 volts, the upper voltage has to be raised to 4.5 volts.
- the example shown relates to an LC display with 4 common and 10 segment lines. Of course, any combination of the number of segment and common lines can be used.
Landscapes
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Liquid Crystal (AREA)
- Liquid Crystal Display Device Control (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843427986 DE3427986A1 (de) | 1984-07-28 | 1984-07-28 | Schaltungsanordnung zur ansteuerung von fluessigkristall-anzeigen |
| DE3427986 | 1984-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP0173808A1 true EP0173808A1 (fr) | 1986-03-12 |
Family
ID=6241883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP85107726A Withdrawn EP0173808A1 (fr) | 1984-07-28 | 1985-06-22 | Circuit de commande de panneaux d'affichage à cristaux liquides |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0173808A1 (fr) |
| DE (1) | DE3427986A1 (fr) |
Cited By (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005078693A3 (fr) * | 2004-02-03 | 2005-10-13 | Idc Llc | Dispositif de reglage de tension d'une commande |
| US7250315B2 (en) | 2002-02-12 | 2007-07-31 | Idc, Llc | Method for fabricating a structure for a microelectromechanical system (MEMS) device |
| US7256922B2 (en) | 2004-07-02 | 2007-08-14 | Idc, Llc | Interferometric modulators with thin film transistors |
| US7291921B2 (en) | 2003-09-30 | 2007-11-06 | Qualcomm Mems Technologies, Inc. | Structure of a micro electro mechanical system and the manufacturing method thereof |
| US7321457B2 (en) | 2006-06-01 | 2008-01-22 | Qualcomm Incorporated | Process and structure for fabrication of MEMS device having isolated edge posts |
| US7349136B2 (en) | 2004-09-27 | 2008-03-25 | Idc, Llc | Method and device for a display having transparent components integrated therein |
| US7369296B2 (en) | 2004-09-27 | 2008-05-06 | Idc, Llc | Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator |
| US7369292B2 (en) | 2006-05-03 | 2008-05-06 | Qualcomm Mems Technologies, Inc. | Electrode and interconnect materials for MEMS devices |
| US7373026B2 (en) | 2004-09-27 | 2008-05-13 | Idc, Llc | MEMS device fabricated on a pre-patterned substrate |
| US7382515B2 (en) | 2006-01-18 | 2008-06-03 | Qualcomm Mems Technologies, Inc. | Silicon-rich silicon nitrides as etch stops in MEMS manufacture |
| US7405861B2 (en) | 2004-09-27 | 2008-07-29 | Idc, Llc | Method and device for protecting interferometric modulators from electrostatic discharge |
| US7405863B2 (en) | 2006-06-01 | 2008-07-29 | Qualcomm Mems Technologies, Inc. | Patterning of mechanical layer in MEMS to reduce stresses at supports |
| US7417784B2 (en) | 2006-04-19 | 2008-08-26 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing a porous surface |
| US7417783B2 (en) | 2004-09-27 | 2008-08-26 | Idc, Llc | Mirror and mirror layer for optical modulator and method |
| US7420728B2 (en) | 2004-09-27 | 2008-09-02 | Idc, Llc | Methods of fabricating interferometric modulators by selectively removing a material |
| US7450295B2 (en) | 2006-03-02 | 2008-11-11 | Qualcomm Mems Technologies, Inc. | Methods for producing MEMS with protective coatings using multi-component sacrificial layers |
| US7485236B2 (en) | 2003-08-26 | 2009-02-03 | Qualcomm Mems Technologies, Inc. | Interference display cell and fabrication method thereof |
| US7492502B2 (en) | 2004-09-27 | 2009-02-17 | Idc, Llc | Method of fabricating a free-standing microstructure |
| US7527996B2 (en) | 2006-04-19 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
| US7534640B2 (en) | 2005-07-22 | 2009-05-19 | Qualcomm Mems Technologies, Inc. | Support structure for MEMS device and methods therefor |
| US7547568B2 (en) | 2006-02-22 | 2009-06-16 | Qualcomm Mems Technologies, Inc. | Electrical conditioning of MEMS device and insulating layer thereof |
| US7547565B2 (en) | 2005-02-04 | 2009-06-16 | Qualcomm Mems Technologies, Inc. | Method of manufacturing optical interference color display |
| US7550794B2 (en) | 2002-09-20 | 2009-06-23 | Idc, Llc | Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer |
| US7553684B2 (en) | 2004-09-27 | 2009-06-30 | Idc, Llc | Method of fabricating interferometric devices using lift-off processing techniques |
| US7566664B2 (en) | 2006-08-02 | 2009-07-28 | Qualcomm Mems Technologies, Inc. | Selective etching of MEMS using gaseous halides and reactive co-etchants |
| US7616369B2 (en) | 2003-06-24 | 2009-11-10 | Idc, Llc | Film stack for manufacturing micro-electromechanical systems (MEMS) devices |
| US7623287B2 (en) | 2006-04-19 | 2009-11-24 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
| US7630114B2 (en) | 2005-10-28 | 2009-12-08 | Idc, Llc | Diffusion barrier layer for MEMS devices |
| US7643203B2 (en) | 2006-04-10 | 2010-01-05 | Qualcomm Mems Technologies, Inc. | Interferometric optical display system with broadband characteristics |
| US7684104B2 (en) | 2004-09-27 | 2010-03-23 | Idc, Llc | MEMS using filler material and method |
| US7706044B2 (en) | 2003-05-26 | 2010-04-27 | Qualcomm Mems Technologies, Inc. | Optical interference display cell and method of making the same |
| US7711239B2 (en) | 2006-04-19 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing nanoparticles |
| US7763546B2 (en) | 2006-08-02 | 2010-07-27 | Qualcomm Mems Technologies, Inc. | Methods for reducing surface charges during the manufacture of microelectromechanical systems devices |
| US7781850B2 (en) | 2002-09-20 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Controlling electromechanical behavior of structures within a microelectromechanical systems device |
| US7795061B2 (en) | 2005-12-29 | 2010-09-14 | Qualcomm Mems Technologies, Inc. | Method of creating MEMS device cavities by a non-etching process |
| US8736590B2 (en) | 2009-03-27 | 2014-05-27 | Qualcomm Mems Technologies, Inc. | Low voltage driver scheme for interferometric modulators |
| US8791897B2 (en) | 2004-09-27 | 2014-07-29 | Qualcomm Mems Technologies, Inc. | Method and system for writing data to MEMS display elements |
| US8830557B2 (en) | 2007-05-11 | 2014-09-09 | Qualcomm Mems Technologies, Inc. | Methods of fabricating MEMS with spacers between plates and devices formed by same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0741897A1 (fr) * | 1994-11-28 | 1996-11-13 | Koninklijke Philips Electronics N.V. | Microcontroleur se raccordant a un affichage a cristaux liquides |
| KR100253378B1 (ko) * | 1997-12-15 | 2000-04-15 | 김영환 | 주문형반도체의외부표시장치 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2266420A1 (en) * | 1974-03-29 | 1975-10-24 | Thomson Csf | Liq. crystal cell controller and visual panel - incorporates triacs connected to system supplying logic information as binary signals |
-
1984
- 1984-07-28 DE DE19843427986 patent/DE3427986A1/de not_active Withdrawn
-
1985
- 1985-06-22 EP EP85107726A patent/EP0173808A1/fr not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2266420A1 (en) * | 1974-03-29 | 1975-10-24 | Thomson Csf | Liq. crystal cell controller and visual panel - incorporates triacs connected to system supplying logic information as binary signals |
Non-Patent Citations (1)
| Title |
|---|
| L'ELECTRICITE ELECTRONIQUE MODERNE, Band 42, Nr. 267, Oktober 1972, Seiten 35-37, Paris, FR; M. SCHIEKEL: "Affichage alphanumérique par dispositif à cristaux liquides" * |
Cited By (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7250315B2 (en) | 2002-02-12 | 2007-07-31 | Idc, Llc | Method for fabricating a structure for a microelectromechanical system (MEMS) device |
| US7642110B2 (en) | 2002-02-12 | 2010-01-05 | Qualcomm Mems Technologies, Inc. | Method for fabricating a structure for a microelectromechanical systems (MEMS) device |
| US7781850B2 (en) | 2002-09-20 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Controlling electromechanical behavior of structures within a microelectromechanical systems device |
| US7550794B2 (en) | 2002-09-20 | 2009-06-23 | Idc, Llc | Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer |
| US7706044B2 (en) | 2003-05-26 | 2010-04-27 | Qualcomm Mems Technologies, Inc. | Optical interference display cell and method of making the same |
| US7616369B2 (en) | 2003-06-24 | 2009-11-10 | Idc, Llc | Film stack for manufacturing micro-electromechanical systems (MEMS) devices |
| US7485236B2 (en) | 2003-08-26 | 2009-02-03 | Qualcomm Mems Technologies, Inc. | Interference display cell and fabrication method thereof |
| US7291921B2 (en) | 2003-09-30 | 2007-11-06 | Qualcomm Mems Technologies, Inc. | Structure of a micro electro mechanical system and the manufacturing method thereof |
| US7532194B2 (en) | 2004-02-03 | 2009-05-12 | Idc, Llc | Driver voltage adjuster |
| WO2005078693A3 (fr) * | 2004-02-03 | 2005-10-13 | Idc Llc | Dispositif de reglage de tension d'une commande |
| US7256922B2 (en) | 2004-07-02 | 2007-08-14 | Idc, Llc | Interferometric modulators with thin film transistors |
| US7405861B2 (en) | 2004-09-27 | 2008-07-29 | Idc, Llc | Method and device for protecting interferometric modulators from electrostatic discharge |
| US7492502B2 (en) | 2004-09-27 | 2009-02-17 | Idc, Llc | Method of fabricating a free-standing microstructure |
| US7417783B2 (en) | 2004-09-27 | 2008-08-26 | Idc, Llc | Mirror and mirror layer for optical modulator and method |
| US7420728B2 (en) | 2004-09-27 | 2008-09-02 | Idc, Llc | Methods of fabricating interferometric modulators by selectively removing a material |
| US7429334B2 (en) | 2004-09-27 | 2008-09-30 | Idc, Llc | Methods of fabricating interferometric modulators by selectively removing a material |
| US7553684B2 (en) | 2004-09-27 | 2009-06-30 | Idc, Llc | Method of fabricating interferometric devices using lift-off processing techniques |
| US8791897B2 (en) | 2004-09-27 | 2014-07-29 | Qualcomm Mems Technologies, Inc. | Method and system for writing data to MEMS display elements |
| US7349136B2 (en) | 2004-09-27 | 2008-03-25 | Idc, Llc | Method and device for a display having transparent components integrated therein |
| US7373026B2 (en) | 2004-09-27 | 2008-05-13 | Idc, Llc | MEMS device fabricated on a pre-patterned substrate |
| US7369296B2 (en) | 2004-09-27 | 2008-05-06 | Idc, Llc | Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator |
| US7684104B2 (en) | 2004-09-27 | 2010-03-23 | Idc, Llc | MEMS using filler material and method |
| US7547565B2 (en) | 2005-02-04 | 2009-06-16 | Qualcomm Mems Technologies, Inc. | Method of manufacturing optical interference color display |
| US7534640B2 (en) | 2005-07-22 | 2009-05-19 | Qualcomm Mems Technologies, Inc. | Support structure for MEMS device and methods therefor |
| US7630114B2 (en) | 2005-10-28 | 2009-12-08 | Idc, Llc | Diffusion barrier layer for MEMS devices |
| US8394656B2 (en) | 2005-12-29 | 2013-03-12 | Qualcomm Mems Technologies, Inc. | Method of creating MEMS device cavities by a non-etching process |
| US7795061B2 (en) | 2005-12-29 | 2010-09-14 | Qualcomm Mems Technologies, Inc. | Method of creating MEMS device cavities by a non-etching process |
| US7382515B2 (en) | 2006-01-18 | 2008-06-03 | Qualcomm Mems Technologies, Inc. | Silicon-rich silicon nitrides as etch stops in MEMS manufacture |
| US7547568B2 (en) | 2006-02-22 | 2009-06-16 | Qualcomm Mems Technologies, Inc. | Electrical conditioning of MEMS device and insulating layer thereof |
| US7450295B2 (en) | 2006-03-02 | 2008-11-11 | Qualcomm Mems Technologies, Inc. | Methods for producing MEMS with protective coatings using multi-component sacrificial layers |
| US7643203B2 (en) | 2006-04-10 | 2010-01-05 | Qualcomm Mems Technologies, Inc. | Interferometric optical display system with broadband characteristics |
| US7527996B2 (en) | 2006-04-19 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
| US7623287B2 (en) | 2006-04-19 | 2009-11-24 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
| US7711239B2 (en) | 2006-04-19 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing nanoparticles |
| US7564613B2 (en) | 2006-04-19 | 2009-07-21 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing a porous surface |
| US7417784B2 (en) | 2006-04-19 | 2008-08-26 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing a porous surface |
| US7369292B2 (en) | 2006-05-03 | 2008-05-06 | Qualcomm Mems Technologies, Inc. | Electrode and interconnect materials for MEMS devices |
| US7321457B2 (en) | 2006-06-01 | 2008-01-22 | Qualcomm Incorporated | Process and structure for fabrication of MEMS device having isolated edge posts |
| US7405863B2 (en) | 2006-06-01 | 2008-07-29 | Qualcomm Mems Technologies, Inc. | Patterning of mechanical layer in MEMS to reduce stresses at supports |
| US7566664B2 (en) | 2006-08-02 | 2009-07-28 | Qualcomm Mems Technologies, Inc. | Selective etching of MEMS using gaseous halides and reactive co-etchants |
| US7763546B2 (en) | 2006-08-02 | 2010-07-27 | Qualcomm Mems Technologies, Inc. | Methods for reducing surface charges during the manufacture of microelectromechanical systems devices |
| US8830557B2 (en) | 2007-05-11 | 2014-09-09 | Qualcomm Mems Technologies, Inc. | Methods of fabricating MEMS with spacers between plates and devices formed by same |
| US8736590B2 (en) | 2009-03-27 | 2014-05-27 | Qualcomm Mems Technologies, Inc. | Low voltage driver scheme for interferometric modulators |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3427986A1 (de) | 1986-01-30 |
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Legal Events
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| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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| AK | Designated contracting states |
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| 18D | Application deemed to be withdrawn |
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| RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: FUELDNER, FRIEDRICH |