EP0167751B1 - Procédé de traitement de surfaces d'aluminium - Google Patents
Procédé de traitement de surfaces d'aluminium Download PDFInfo
- Publication number
- EP0167751B1 EP0167751B1 EP85105850A EP85105850A EP0167751B1 EP 0167751 B1 EP0167751 B1 EP 0167751B1 EP 85105850 A EP85105850 A EP 85105850A EP 85105850 A EP85105850 A EP 85105850A EP 0167751 B1 EP0167751 B1 EP 0167751B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- process according
- acid
- disulphate
- peroxydisulphate
- persulphate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 39
- 229910052782 aluminium Inorganic materials 0.000 title claims description 38
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 38
- 230000008569 process Effects 0.000 title claims description 32
- 239000004411 aluminium Substances 0.000 title claims 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 18
- 239000002253 acid Substances 0.000 claims description 17
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 16
- 239000003792 electrolyte Substances 0.000 claims description 15
- 229910017604 nitric acid Inorganic materials 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 11
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004327 boric acid Substances 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 3
- 239000012954 diazonium Substances 0.000 claims description 3
- -1 fluoride ions Chemical class 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- 229910003638 H2SiF6 Inorganic materials 0.000 claims description 2
- 229910004039 HBF4 Inorganic materials 0.000 claims description 2
- 229910004713 HPF6 Inorganic materials 0.000 claims description 2
- 229910020491 K2TiF6 Inorganic materials 0.000 claims description 2
- 229910020148 K2ZrF6 Inorganic materials 0.000 claims description 2
- 229910017665 NH4HF2 Inorganic materials 0.000 claims description 2
- 239000004115 Sodium Silicate Substances 0.000 claims description 2
- 150000007513 acids Chemical class 0.000 claims description 2
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical compound [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 claims description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 2
- 239000001117 sulphuric acid Substances 0.000 claims description 2
- ZEFWRWWINDLIIV-UHFFFAOYSA-N tetrafluorosilane;dihydrofluoride Chemical compound F.F.F[Si](F)(F)F ZEFWRWWINDLIIV-UHFFFAOYSA-N 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims 4
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims 4
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims 4
- 238000002048 anodisation reaction Methods 0.000 claims 3
- 239000004160 Ammonium persulphate Substances 0.000 claims 2
- 239000004159 Potassium persulphate Substances 0.000 claims 2
- JLDSOYXADOWAKB-UHFFFAOYSA-N aluminium nitrate Chemical compound [Al+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O JLDSOYXADOWAKB-UHFFFAOYSA-N 0.000 claims 2
- 235000019395 ammonium persulphate Nutrition 0.000 claims 2
- OYLGLPVAKCEIKU-UHFFFAOYSA-N diazanium;sulfonato sulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OS([O-])(=O)=O OYLGLPVAKCEIKU-UHFFFAOYSA-N 0.000 claims 2
- NDPMPJMMNVDDLJ-UHFFFAOYSA-L dilithium sulfonato sulfate Chemical compound [Li+].[Li+].[O-]S(=O)(=O)OS([O-])(=O)=O NDPMPJMMNVDDLJ-UHFFFAOYSA-L 0.000 claims 2
- PQEGXTONHQWLFQ-UHFFFAOYSA-L dilithium;sulfonatooxy sulfate Chemical compound [Li+].[Li+].[O-]S(=O)(=O)OOS([O-])(=O)=O PQEGXTONHQWLFQ-UHFFFAOYSA-L 0.000 claims 2
- 235000019394 potassium persulphate Nutrition 0.000 claims 2
- KAQHZJVQFBJKCK-UHFFFAOYSA-L potassium pyrosulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OS([O-])(=O)=O KAQHZJVQFBJKCK-UHFFFAOYSA-L 0.000 claims 2
- JXAZAUKOWVKTLO-UHFFFAOYSA-L sodium pyrosulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OS([O-])(=O)=O JXAZAUKOWVKTLO-UHFFFAOYSA-L 0.000 claims 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-N sulfonic acid Chemical compound OS(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-N 0.000 claims 2
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical compound [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 claims 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims 1
- 229910052783 alkali metal Inorganic materials 0.000 claims 1
- 150000001340 alkali metals Chemical class 0.000 claims 1
- 235000011149 sulphuric acid Nutrition 0.000 claims 1
- 238000007788 roughening Methods 0.000 description 34
- 230000000052 comparative effect Effects 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 239000000243 solution Substances 0.000 description 13
- 239000011888 foil Substances 0.000 description 11
- 230000008901 benefit Effects 0.000 description 5
- 239000000725 suspension Substances 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 229910017855 NH 4 F Inorganic materials 0.000 description 4
- 238000007743 anodising Methods 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012876 topography Methods 0.000 description 3
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- VFNGKCDDZUSWLR-UHFFFAOYSA-L disulfate(2-) Chemical compound [O-]S(=O)(=O)OS([O-])(=O)=O VFNGKCDDZUSWLR-UHFFFAOYSA-L 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- IRPGOXJVTQTAAN-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropanal Chemical compound FC(F)(F)C(F)(F)C=O IRPGOXJVTQTAAN-UHFFFAOYSA-N 0.000 description 1
- LXFQSRIDYRFTJW-UHFFFAOYSA-M 2,4,6-trimethylbenzenesulfonate Chemical compound CC1=CC(C)=C(S([O-])(=O)=O)C(C)=C1 LXFQSRIDYRFTJW-UHFFFAOYSA-M 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-O diazynium Chemical compound [NH+]#N IJGRMHOSHXDMSA-UHFFFAOYSA-O 0.000 description 1
- BJZIJOLEWHWTJO-UHFFFAOYSA-H dipotassium;hexafluorozirconium(2-) Chemical compound [F-].[F-].[F-].[F-].[F-].[F-].[K+].[K+].[Zr+4] BJZIJOLEWHWTJO-UHFFFAOYSA-H 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000010665 pine oil Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000012224 working solution Substances 0.000 description 1
- OMQSJNWFFJOIMO-UHFFFAOYSA-J zirconium tetrafluoride Chemical class F[Zr](F)(F)F OMQSJNWFFJOIMO-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/034—Chemical or electrical pretreatment characterised by the electrochemical treatment of the aluminum support, e.g. anodisation, electro-graining; Sealing of the anodised layer; Treatment of the anodic layer with inorganic compounds; Colouring of the anodic layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/20—Acidic compositions for etching aluminium or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/04—Etching of light metals
Definitions
- the present invention relates to a method for treating the surface of aluminum foils, by means of which the foil surface is made suitable for use in planographic printing plates.
- Electrolytic roughening processes of aluminum have many advantages over mechanical roughening (see e.g. U.S.-A-3,072,546 and 3,073,765). A particularly fine and even roughening is desired for certain purposes. These properties are of particular importance if the aluminum is to be used as a support for planographic printing plates. Very fine roughening can be achieved in an aqueous hydrochloric acid electrolyte, but the current density must be kept quite low, otherwise pitting will occur on the aluminum surface. Due to the low current density, the roughening times are relatively long.
- the surface is greatly enlarged by the electrochemical roughening, which leads to an improvement in the printing properties.
- a method for roughening aluminum carriers in which the carriers are first mechanically roughened, e.g. with the aid of a wire brush or an abrasive suspension, and then in a saturated aqueous solution of an aluminum salt of a mineral acid, which may also contain up to 10% of a mineral acid.
- the roughening effect of this solution can optionally be enhanced by electrolysis.
- the surface is structured in a direction-oriented manner due to the roughening in the abrasive suspension, as a result of which the print quality and the ink / water balance are impaired.
- tiny particles of the abrasive contaminate the surface.
- the roughening process using an abrasive suspension is subject to constant fluctuations. The bristles of the brushes will shorten due to use, and the abrasive suspension loses its abrasion ability in use, so that fresh material must be added.
- the purity of the aluminum surface depends on the time, since A) (OH) g, Al 2 0 3 and aluminum particles are constantly formed. All this leads to surfaces of different quality.
- GB-A-1 027 695 discloses a four-stage process for the production of printing plate supports, in which an electrolytic roughening is carried out in the second stage.
- the electrolyte contains nitric acid, sulfite waste liquor, aromatic aldehydes or aromatic ketones, their derivatives or pine oil.
- the object of the present invention is to obtain the advantages of electrochemical roughening without having to accept the disadvantages of the prior art or mechanical roughening, and to produce printing plate supports which have a uniform and good topography.
- the surfaces treated according to the invention are thus matted by the chemical etching process, thereby avoiding the directional orientation that can be clearly observed in mechanical roughening processes.
- the chemical etching is followed by an electrochemical roughening step in which an additional grain is applied to the etched surface.
- a surface with an increased surface area and better capillary wetting is obtained, which is expressed by an improved ink / water balance of the printing plates produced with the supports according to the invention.
- Aluminum foils which are suitable according to the invention are those which partially contain alloying constituents due to contamination, such as e.g. Aluminum Association alloys 1050, 1100 and 3003.
- the thickness of the aluminum foils used according to the invention is in the range customary for these purposes and is e.g. between 0.01 and 0.064 cm (0.004 and 0.025 inches). The choice of the best thickness of the aluminum foil is left to the expert.
- the amount of hydrochloric and / or nitric acid used is preferably between 5 and 18% by weight, in particular between 7 and 12% by weight.
- the amount of the fluorine ion-containing compound used in the bath is preferably 3 to 15% by weight, in particular 5 to 12% by weight.
- the bath described above may also contain other constituents, such as ammonium, potassium, sodium or lithium persulfate, peroxydisulfate or disulfate.
- the bath can also contain sulfonic acids.
- the temperature of the bath is between 10 and 95 ° C, preferably between 20 and 80 ° C, in particular between 25 and 60 ° C.
- the immersion time is preferably about 5 s to 3 min. Longer times are possible, but not expedient, since excessive aluminum dissolution takes place in these cases.
- the immersion time is preferably 20 to 120 s, in particular 40 to 80 s.
- the immersion process can be converted into electrolysis, but this is a question of the application and a question of cost.
- electrolysis alternating or direct current with a density of 30 to 45 A / dm 2 can be used for 30 to 60 s, the aluminum foil being the cathode.
- the nature of the etching solution does not change, since the aluminum is etched to form a water-insoluble aluminum fluoride that can be constantly removed by simply filtering it off. After the etching, the film is preferably rinsed off before the electrochemical roughening of stage b) begins.
- the next process step is an electrolytic roughening of the aluminum in an aqueous electrolyte solution which is free from organic solvents and contains nitric and / or hydrochloric acid.
- the optimal concentration of hydrochloric acid and / or nitric acid depends on various factors, such as the respective current density, the temperature of the electrolyte solution and the properties of the aluminum object to be roughened. The cheapest parameters can easily be determined in a few simple tests.
- the electrolytic solution can also contain oxalic acid, aluminum nitrate, aluminum chloride or hydrogen peroxide (see US ⁇ A ⁇ 4,336,113), boric acid (see US ⁇ A ⁇ 4,374,710) or another of the many additives known for electrochemical roughening processes .
- the concentration of nitric acid is preferably 3 to 20 g / l, particularly preferably 8 to 20 g / l, in particular 10 to 15 g / l. At a concentration of more than 20 g / l to about 500 g / l there is no noticeable difference in the effect; from about 500 g / l the effect begins to wear off.
- the concentration of hydrochloric acid in the electrochemical roughening step is preferably 3 to 100 g / l, particularly preferably 5 to 60 g / l, in particular 8 to 15 g / l.
- the concentration of the optionally used oxalic acid is preferably 1 to 80 g / l, particularly preferably 5 to 45 g / l, in particular 8 to 20 g / l.
- the concentration of hydrogen peroxide optionally used is preferably 1 to 60 g / l, particularly preferably 10 to 30 g / l, in particular 15 to 20 g / l.
- the concentration of aluminum nitrate optionally used is preferably at the saturation limit, particularly preferably 65 to 70 g / l, in particular 65 g / l.
- the concentration of optionally used aluminum chloride is preferably 1 to 10 g / l, particularly preferably 1 to 8 g / l, in particular 1 to 5 g / l.
- the concentration of the boric acid optionally used is preferably 1 g / l to the saturation limit, particularly preferably 5 to 15 g / l, in particular 8 to 12 g / l.
- the current density in the electrolyte is 30 to 120 A / dm 2 , preferably 45 to 80 A / dm 2 , in particular 45 to 60 A / dm 2 .
- the electrolysis time is preferably 20 s to 3 min, particularly preferably 20 to 90 s, in particular 20 to 60 s.
- the distance between the aluminum surface and the inert electrode, which is preferably made up of Graphite, chrome or lead is preferably up to about 1.5 cm, in particular 1 to 1.5 cm.
- the roughening is preferably carried out with alternating current, the best roughening effect being achieved at a frequency above 50 Hz.
- the frequency range particularly preferably extends from 60 to 300 Hz.
- the electrochemical roughening [stage b)] is followed by an anodic oxidation [stage c)] of the film.
- the film is passed through an anodizing bath containing sulfuric or phosphoric acid.
- the acid concentration is preferably between 10 and 20% by weight.
- the temperature of the anodizing bath is 20 to 80 ° C, with the best results being achieved at temperatures between 20 and 40 ° C. Very good results are also achieved if the film in the anodizing bath under the action of direct current has a density of 0.11 to 11.1 Aldm 2 (1 to 100 A / ft 2 ), preferably 1.1 to 5.6 Aldm 2 (10 up to 50 A / ft 2 ).
- the anodic oxidation takes 0.5 to 30 minutes, but usually no longer than 1 to 2 minutes.
- the surface treated according to the invention In the production of planographic printing plates, it is advantageous to subject the surface treated according to the invention to a hydrophilizing aftertreatment before the photosensitive layer is applied.
- the application of such an intermediate layer improves the adhesion of the light-sensitive layer to the plate surface and the hydrophilicity of the aluminum surface.
- Polyvinylphosphonic acid, sodium silicate, alkali zirconium fluorides, such as potassium zirconium hexafluoride, and hydrofluoric zirconic acid are usually used for the hydrophilizing treatment.
- Photosensitive mixtures suitable for planographic printing typically include aromatic diazonium salts, quinonediazides and photopolymerizable compounds known from the prior art. These are normally used in a mixture with resinous binders to increase the print run. Examples of the large number of known suitable binders of this type include polyurethanes and phenol / formaldehyde resins.
- An aluminum plate made of an alloy of type 1100 was degreased in a common aqueous alkaline degreasing solution and with alternating current of 900 ° C. in an aqueous solution containing 13 g / l of HN0 3 and 65 g / 1 of Al (N0 3 ) 3 electrolytically roughened and then rinsed off.
- the aluminum surface was then anodized using direct current of 240 ° C., the aluminum serving as the anode.
- the electrolyte contained 150 g / l of H Z S0 4 .
- the anodized surface was rinsed off and hydrophilized by treatment with a solution containing 2.2 g / l of polyvinylphosphonic acid at 65 ° C. for 30 s.
- the plate was again rinsed, dried and coated with a negative working solution consisting of a polyvinyl formal / acetate / alcohol terpolymer, phosphoric acid, a phthalocyanine pigment and a diazonium condensation product of 3-methoxy-4-diazo-diphenylamine sulfate and 4,4'- Bismethoxymethyldiphenylether, isolated as mesitylene sulfonate, existed.
- the solution was applied so that a layer weight of 700 mg / m 2 resulted.
- the coated plate was exposed and developed to give a fully covered step 7 on a 21 step Stauffer wedge.
- the developed and preserved plate was used under normal printing conditions on a sheetfed press using Dahlgren fountain solution and a medium toughness ink.
- a comparison experiment to determine the color / water balance consisted in reducing the amount of water until the plate began to tone, or increasing the amount of water until the plate was completely flooded. In the first case, the amount of water was not sufficient for the plate to run clean. As a result, color got on the non-image areas of the printed copy. In the second case, an excess of water accumulated in the ink system, which resulted in undesired ink clogging and bare running of the rollers.
- the measuring scale of the ink / water balance which ranges from 0 to 100, is a relative scale that varies from press to press, but it reliably indicates the respective balance for each machine. In the present case, the minimum is 36 and the maximum is 40.
- Part of the plate was checked for surface roughness using a scanning electron microscope (SEM) and a perthometer. At 240x, 1200x and 6000x magnification, it was found that the surface consisted of uniform holes with a diameter of 2 to 6 pm. In addition, the surface was essentially flat because the roughness was practically the same everywhere. On average, it was 4.5 pm.
- SEM scanning electron microscope
- a plate was treated, coated and tested as described in Comparative Example A, except that 8 g / l of HCI and 40 g / l of AICI 3 were used instead of HNO 3 / Al (NO 3 ) 3 for the electrochemical roughening of the aluminum. Under practical pressure conditions, the plate was used for fountain solution values between 36 and 42 achieved only moderately satisfactory results. Only 180,000 flawless prints could be made.
- the surface When viewed by the SEM, it was found that the surface had fewer individual pores than when roughened with HN0 3 .
- the surface consisted of uniform holes with a diameter of 6 to 9 pm. It was also found that the surface was substantially flat, ie there were no noticeable differences in the roughness. The average roughness was 5.25 pm.
- An aluminum plate made of an 1100 type alloy was degreased and rinsed in a common aqueous alkaline degreasing solution. The plate was then immersed for 60 s at a temperature of 60 ° C. in a solution which contained 100 g / l of HN0 3 (100%) and 100 g / l of NH 4 F. The treated plate was rinsed well and dried. When evaluated by an SEM at 240x, 1200x and 6000x magnification, it was found that the surface was strongly structured. It had evenly distributed bumps that were about 10 ⁇ m in diameter and about 8-10 ⁇ m high; the distance from tip to tip was 40-50 pm. It also appeared to be obvious that the effect of the etching solution on the aluminum began at the intermetallic limit and resulted in a substantially directional topography.
- a 1100 aluminum alloy plate was treated as described in Comparative Example C, but an alternating current of 900 ° C was also used to accelerate the etching with HN0 3 and NH 4 F. After the treatment, the plate was rinsed thoroughly and dried. When evaluated by an SEM at 240x, 1200x and 6000x magnification, it was also found that the surface was strongly structured. It was characterized by evenly distributed elevations, which had a diameter of about 10 ⁇ m and a height of about 6-8 pm; the distance from tip to tip was 35 ⁇ 45 pm. The topography appeared even and essentially directional.
- a piece of the plate treated in this way was anodically oxidized, hydrophilized and likewise coated in accordance with the information from comparative example A.
- the exposed and developed plate was used in a printing press for printing in order to determine the range of the color / water balance. A range of 28 to 56 was found.
- the printing test showed that only about 80,000 good prints can be obtained before the plate becomes unusable.
- the plate treated, rinsed and dried in this way was coated, exposed, developed and used for printing in a sheet-fed printing machine as described there. 220,000 good prints were obtained before the plate was unusable.
- the color / water balance range ranged from 28 to 56.
- a piece of the plate was evaluated under an SEM at 240x, 1200x and 6000x magnification.
- the surface consisted of uniform holes with a diameter of 2 ⁇ 4 ⁇ m. It was also found that the surface was not flat, but rather three-dimensional. The mean roughness was 6.2 pm.
- the examples show the effect of treatment with various combinations of mordants followed by electrochemical roughening.
- plates made of aluminum alloy 1100 were degreased according to comparative example A, anodically oxidized and hydrophilized.
- HNO 3 / Al (NO 3 ) 3 was used as the roughening electrolyte
- the process parameters were the same as in Comparative Example A.
- Comparative Example A specifies a conventional method known from the prior art for producing an aluminum base material roughened electrochemically by means of HNO 3 / Al (NO 3 ) 3 .
- Comparative example B specifies a conventional process known from the prior art for producing an aluminum base material which has been electrochemically roughened by means of HCI / AICI 3 .
- Comparative examples C and D show the advantages of an etching treatment prior to electrochemical roughening.
- the surface is given a three-dimensional structure by increasing the roughness. This effects the ink / water balance over a larger area.
- the printing tests show that the electrochemical roughening cannot be replaced by this method, since the print run decreases.
- Example 1 illustrates the advantage which is achieved according to the invention if etching is first carried out to obtain an enlarged, three-dimensional surface and then electrochemically roughened to obtain a very pore-rich surface. In this case, both the improved ink-water balance and the print run are increased.
- Examples 2, 3, 4 and 5 demonstrate the benefits of using an acid and a fluoride-containing compound as a mordant prior to electrochemical roughening to improve color / water balance and print run.
- Comparative Examples E, F and G show that the use of an acid without the addition of a fluorine-containing compound or a fluorine-containing compound without the addition of an acid is by no means sufficient to achieve significantly better results than in the other comparative examples.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Printing Plates And Materials Therefor (AREA)
Claims (16)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/619,105 US4502925A (en) | 1984-06-11 | 1984-06-11 | Process for aluminum surface preparation |
| US619105 | 1984-06-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0167751A1 EP0167751A1 (fr) | 1986-01-15 |
| EP0167751B1 true EP0167751B1 (fr) | 1990-07-18 |
Family
ID=24480475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP85105850A Expired - Lifetime EP0167751B1 (fr) | 1984-06-11 | 1985-05-13 | Procédé de traitement de surfaces d'aluminium |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4502925A (fr) |
| EP (1) | EP0167751B1 (fr) |
| JP (1) | JPS6110491A (fr) |
| AU (1) | AU584899B2 (fr) |
| BR (1) | BR8502751A (fr) |
| CA (1) | CA1235380A (fr) |
| DE (1) | DE3578698D1 (fr) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068997A (ja) * | 1983-09-27 | 1985-04-19 | Fuji Photo Film Co Ltd | 平版印刷版用アルミニウム支持体の製造方法 |
| DE3400250A1 (de) * | 1984-01-05 | 1985-07-18 | Hoechst Ag, 6230 Frankfurt | Verfahren zur elektrochemischen aufrauhung von aluminium fuer druckplattentraeger in einem waessrigen mischelektrolyten |
| DE3400248A1 (de) * | 1984-01-05 | 1985-07-18 | Hoechst Ag, 6230 Frankfurt | Verfahren zur elektrochemischen aufrauhung von aluminium fuer druckplattentraeger in einem waessrigen mischelektrolyten |
| GB2160222B (en) * | 1984-04-02 | 1988-08-17 | Fuji Photo Film Co Ltd | Lithographic support and process of preparing the same |
| US4721552A (en) * | 1987-04-27 | 1988-01-26 | Polychrome Corporation | Two-step method for electrolytically graining lithographic metal plates |
| DE3715791A1 (de) * | 1987-05-12 | 1988-11-24 | Hoechst Ag | Druckplattentraeger sowie verfahren und vorrichtung zu dessen herstellung |
| US5152877A (en) * | 1989-10-13 | 1992-10-06 | Fuji Photo Film Co., Ltd. | Method for producing support for printing plate |
| EP0471351B1 (fr) * | 1990-08-16 | 1995-01-04 | Fuji Photo Film Co., Ltd. | Procédé de fabrication d'un substrat pour des plaques d'impression lithographiques, substrat pour des plaques d'impression lithographiques fabriqué par cette méthode et une plaque présensibilisée comprenant le substrat |
| FR2692599B1 (fr) * | 1992-06-17 | 1994-09-16 | Prod Ind Cfpi Franc | Procédé de traitement de substrats à base d'aluminium en vue de leur anodisation, bain mis en Óoeuvre dans ce procédé et concentré pour préparer le bain. |
| US5288372A (en) * | 1992-07-07 | 1994-02-22 | Alumax Inc. | Altering a metal body surface |
| JP3117322B2 (ja) * | 1993-04-05 | 2000-12-11 | 富士写真フイルム株式会社 | 感光性平版印刷版およびその支持体の製造方法 |
| EP0721397B1 (fr) * | 1993-09-29 | 1998-10-21 | Bayer Corporation | Procede de preparation de plaques d'impression lithographiques ameliorees |
| JPH07281423A (ja) * | 1994-04-07 | 1995-10-27 | Konica Corp | 印刷版の製版方法 |
| US6461794B1 (en) * | 1999-08-11 | 2002-10-08 | Kodak Polychrome Graphics Llc | Lithographic printing forms |
| US6297208B1 (en) * | 1999-10-11 | 2001-10-02 | Iron Out, Inc. | Rust stain removal formula |
| EP1157854A3 (fr) * | 2000-05-15 | 2004-05-12 | Fuji Photo Film Co., Ltd. | Support pour plaque d'impression lithographique et plaque présensibilisée |
| US6716569B2 (en) * | 2000-07-07 | 2004-04-06 | Fuji Photo Film Co., Ltd. | Preparation method for lithographic printing plate |
| US6692890B2 (en) * | 2001-04-04 | 2004-02-17 | Kodak Polychrome Graphics Llc | Substrate improvements for thermally imageable composition and methods of preparation |
| JP3930709B2 (ja) * | 2001-07-09 | 2007-06-13 | 日本軽金属株式会社 | アルミニウム材の表面処理方法及び表面処理アルミニウム材 |
| JP3930708B2 (ja) * | 2001-07-09 | 2007-06-13 | 日本軽金属株式会社 | アルミニウム材の表面処理方法及び表面処理アルミニウム材 |
| JP3930706B2 (ja) * | 2001-07-09 | 2007-06-13 | 日本軽金属株式会社 | アルミニウム材の表面処理方法及び表面処理アルミニウム材 |
| JP3828387B2 (ja) * | 2001-07-09 | 2006-10-04 | 日本軽金属株式会社 | アルミニウム材の表面処理方法及び表面処理アルミニウム材 |
| DE10227867A1 (de) * | 2002-06-22 | 2004-01-08 | Merck Patent Gmbh | Zusammensetzung zum Entfernen von Sidewall-Residues |
| TW200417628A (en) * | 2002-09-09 | 2004-09-16 | Shipley Co Llc | Improved cleaning composition |
| WO2004035861A1 (fr) * | 2002-10-15 | 2004-04-29 | Henkel Kommanditgesellschaft Auf Aktien | Solution et procede de derochage ou de brillantage/passivation d'acier inoxydable |
| JP4410714B2 (ja) * | 2004-08-13 | 2010-02-03 | 富士フイルム株式会社 | 平版印刷版用支持体の製造方法 |
| CN101956184B (zh) * | 2010-09-29 | 2012-04-25 | 厦门华弘昌科技有限公司 | 瓷片上钼或钨图形选择性化学镀镍工艺及一种还原性微蚀液 |
| CN104404516A (zh) * | 2014-11-28 | 2015-03-11 | 沈阳飞机工业(集团)有限公司 | 一种提高铝合金蚀刻标牌表面质量的方法 |
| US10435806B2 (en) | 2015-10-12 | 2019-10-08 | Prc-Desoto International, Inc. | Methods for electrolytically depositing pretreatment compositions |
| CN108570699A (zh) * | 2018-05-16 | 2018-09-25 | 扬州虹扬科技发展有限公司 | 一种电镀前处理药剂及处理工艺 |
| CN110284174B (zh) * | 2019-08-12 | 2021-04-09 | 潍坊国一铝材有限公司 | 一种铝合金氧化成膜所用的电解氧化液以及铝合金氧化成膜方法 |
| CN114318341B (zh) * | 2021-12-16 | 2023-09-05 | 东风汽车集团股份有限公司 | 一种铝合金金相腐蚀方法及其金相腐蚀剂 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL293884A (fr) * | 1962-06-15 | |||
| AU435005B2 (en) * | 1970-05-22 | 1973-04-18 | NAMEPLATES & DIALS PTY. LIMITED andr. COLLIE & CO. PROPRIETARY LIMITED | Process forthe production of anodised aluminium lithographic printing plates |
| JPS5177099A (en) * | 1974-12-27 | 1976-07-03 | Fuji Photo Film Co Ltd | Kankoseineemu pureetozairyo |
| DE2836803A1 (de) * | 1978-08-23 | 1980-03-06 | Hoechst Ag | Verfahren zur anodischen oxidation von aluminium und dessen verwendung als druckplatten-traegermaterial |
| US4242417A (en) * | 1979-08-24 | 1980-12-30 | Polychrome Corporation | Lithographic substrates |
| US4336113A (en) * | 1981-06-26 | 1982-06-22 | American Hoechst Corporation | Electrolytic graining of aluminum with hydrogen peroxide and nitric or hydrochloric acid |
| US4396468A (en) * | 1981-12-21 | 1983-08-02 | American Hoechst Corporation | Three phase graining of aluminum substrates |
| US4374710A (en) * | 1982-03-18 | 1983-02-22 | American Hoechst Corporation | Electrolytic graining of aluminum with nitric and oxalic acids |
-
1984
- 1984-06-11 US US06/619,105 patent/US4502925A/en not_active Expired - Fee Related
-
1985
- 1985-05-13 DE DE8585105850T patent/DE3578698D1/de not_active Expired - Fee Related
- 1985-05-13 EP EP85105850A patent/EP0167751B1/fr not_active Expired - Lifetime
- 1985-05-23 AU AU42806/85A patent/AU584899B2/en not_active Ceased
- 1985-05-27 CA CA000482400A patent/CA1235380A/fr not_active Expired
- 1985-06-10 BR BR8502751A patent/BR8502751A/pt unknown
- 1985-06-11 JP JP60125265A patent/JPS6110491A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| BR8502751A (pt) | 1986-02-12 |
| CA1235380A (fr) | 1988-04-19 |
| AU584899B2 (en) | 1989-06-08 |
| US4502925A (en) | 1985-03-05 |
| JPS6110491A (ja) | 1986-01-17 |
| EP0167751A1 (fr) | 1986-01-15 |
| DE3578698D1 (de) | 1990-08-23 |
| AU4280685A (en) | 1985-12-19 |
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