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EA200701133A1 - Система и способ удаления пленки с внешних границ поверхностей плоских подложек - Google Patents

Система и способ удаления пленки с внешних границ поверхностей плоских подложек

Info

Publication number
EA200701133A1
EA200701133A1 EA200701133A EA200701133A EA200701133A1 EA 200701133 A1 EA200701133 A1 EA 200701133A1 EA 200701133 A EA200701133 A EA 200701133A EA 200701133 A EA200701133 A EA 200701133A EA 200701133 A1 EA200701133 A1 EA 200701133A1
Authority
EA
Eurasian Patent Office
Prior art keywords
film
substrate
transport mechanism
film removal
external borders
Prior art date
Application number
EA200701133A
Other languages
English (en)
Other versions
EA011698B1 (ru
Inventor
Джеймс Эрнст Хинкл
Original Assignee
Ферст Солар, Инк.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ферст Солар, Инк. filed Critical Ферст Солар, Инк.
Publication of EA200701133A1 publication Critical patent/EA200701133A1/ru
Publication of EA011698B1 publication Critical patent/EA011698B1/ru

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Система для удаления пленки с плоской подложки содержит челнок, который транспортирует покрытую пленкой подложку через установку удаления пленки к поворотной установке. В поворотной установке подложка удаляется с транспортного механизма возвратно-поступательного движения и поворачивается в новую ориентацию. После изменения позиции на транспортном механизме возвратно-поступательного движения подложка транспортируется посредством транспортного механизма движением через вторую установку удаления пленки.
EA200701133A 2004-11-23 2005-11-23 Система и способ удаления пленки с внешних границ поверхностей плоских подложек EA011698B1 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62989704P 2004-11-23 2004-11-23
US11/284,028 US7318769B2 (en) 2004-11-23 2005-11-22 System and method for removing film from planar substrate peripheries
PCT/US2005/042646 WO2006058175A2 (en) 2004-11-23 2005-11-23 System and method for removing film from planar substrate peripheries

Publications (2)

Publication Number Publication Date
EA200701133A1 true EA200701133A1 (ru) 2008-04-28
EA011698B1 EA011698B1 (ru) 2009-04-28

Family

ID=36460134

Family Applications (1)

Application Number Title Priority Date Filing Date
EA200701133A EA011698B1 (ru) 2004-11-23 2005-11-23 Система и способ удаления пленки с внешних границ поверхностей плоских подложек

Country Status (4)

Country Link
US (1) US7318769B2 (ru)
EP (1) EP1815516B1 (ru)
EA (1) EA011698B1 (ru)
WO (1) WO2006058175A2 (ru)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005062528A1 (de) * 2005-12-16 2007-06-21 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten
TW201210747A (en) * 2010-06-04 2012-03-16 Sintokogio Ltd Apparatus for treating a plate-like member and method of treating the same
CN119038180B (zh) * 2024-08-16 2025-02-14 江门市宏丰电子科技有限公司 自动化除膜及排列设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT276230B (de) * 1967-06-22 1969-11-25 Oskar Wellauer Einrichtung zum Drehen und Ausrichten von Werkstücken
DE3035553C2 (de) 1980-09-20 1983-07-14 Flachglas AG, 8510 Fürth Anlage zum Schleifen der vollständigen Umfangsfläche von Glasscheiben unregelmäßigen Grundrisses
US5163253A (en) * 1984-04-20 1992-11-17 Pangborn Corporation Method and apparatus for cleaning workpieces
US5123207A (en) * 1990-10-30 1992-06-23 Tti Engineering Inc. Mobile co2 blasting decontamination system
US5836809A (en) * 1996-10-07 1998-11-17 Eco-Snow Systems, Inc. Apparatus and method for cleaning large glass plates using linear arrays of carbon dioxide (CO2) jet spray nozzles
JP3772456B2 (ja) * 1997-04-23 2006-05-10 三菱電機株式会社 太陽電池及びその製造方法、半導体製造装置
US6423565B1 (en) * 2000-05-30 2002-07-23 Kurt L. Barth Apparatus and processes for the massproduction of photovotaic modules
US6869341B2 (en) * 2002-06-19 2005-03-22 Glassline Corporation Single-sided finishing apparatus

Also Published As

Publication number Publication date
EP1815516A2 (en) 2007-08-08
EP1815516A4 (en) 2011-06-29
WO2006058175A2 (en) 2006-06-01
US7318769B2 (en) 2008-01-15
WO2006058175A3 (en) 2009-04-09
EA011698B1 (ru) 2009-04-28
EP1815516B1 (en) 2013-02-27
US20060108583A1 (en) 2006-05-25

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Legal Events

Date Code Title Description
MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): AM AZ BY KZ KG MD TJ TM RU