[go: up one dir, main page]

EA200200653A1 - Способ и система защиты от коррозии проводящих конструкций - Google Patents

Способ и система защиты от коррозии проводящих конструкций

Info

Publication number
EA200200653A1
EA200200653A1 EA200200653A EA200200653A EA200200653A1 EA 200200653 A1 EA200200653 A1 EA 200200653A1 EA 200200653 A EA200200653 A EA 200200653A EA 200200653 A EA200200653 A EA 200200653A EA 200200653 A1 EA200200653 A1 EA 200200653A1
Authority
EA
Eurasian Patent Office
Prior art keywords
constructions
conducting
protection against
against corrosion
corrosion protection
Prior art date
Application number
EA200200653A
Other languages
English (en)
Other versions
EA004487B1 (ru
Inventor
Артур Дж. Спивак
Дэвид Б. Даулинг
Original Assignee
Эпплайд Семикондактор, Инк.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Эпплайд Семикондактор, Инк. filed Critical Эпплайд Семикондактор, Инк.
Publication of EA200200653A1 publication Critical patent/EA200200653A1/ru
Publication of EA004487B1 publication Critical patent/EA004487B1/ru

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/60—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only artificial stone
    • C04B41/61—Coating or impregnation
    • C04B41/65—Coating or impregnation with inorganic materials
    • C04B41/68—Silicic acid; Silicates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/5024—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08—Anti-corrosive paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08—Anti-corrosive paints
    • C09D5/10—Anti-corrosive paints containing metal dust
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/62—Treatment of iron or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F15/00—Other methods of preventing corrosion or incrustation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/90—Electrical properties
    • C04B2111/94—Electrically conducting materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Metallurgy (AREA)
  • Structural Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Prevention Of Electric Corrosion (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Apparatus For Disinfection Or Sterilisation (AREA)
  • Food Preservation Except Freezing, Refrigeration, And Drying (AREA)
  • Catalysts (AREA)

Abstract

Система для защиты от коррозии поверхности металлической конструкции при контакте с коррозионной средой, включающая в себя полупроводниковое покрытие (4), находящееся в проводящем контакте, по меньшей мере, с частью поверхности, и электронный фильтр (17) для фильтрования коррозионного шума; а также способ защиты от коррозии, использующий данную систему.Международная заявка была опубликована вместе с отчетом о международном поиске.
EA200200653A 1999-12-09 2000-12-07 Способ и система защиты от коррозии проводящих конструкций EA004487B1 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US45732899A 1999-12-09 1999-12-09
US09/585,397 US6325915B1 (en) 1999-12-09 2000-06-02 Method and system of preventing corrosion of conductive structures
PCT/US2000/032439 WO2001043173A1 (en) 1999-12-09 2000-12-07 Method and system of preventing corrosion of conductive structures

Publications (2)

Publication Number Publication Date
EA200200653A1 true EA200200653A1 (ru) 2003-06-26
EA004487B1 EA004487B1 (ru) 2004-04-29

Family

ID=27038557

Family Applications (1)

Application Number Title Priority Date Filing Date
EA200200653A EA004487B1 (ru) 1999-12-09 2000-12-07 Способ и система защиты от коррозии проводящих конструкций

Country Status (12)

Country Link
US (1) US6325915B1 (ru)
EP (1) EP1236223A4 (ru)
JP (1) JP5198702B2 (ru)
KR (1) KR100765589B1 (ru)
CN (1) CN1195591C (ru)
AU (1) AU784620B2 (ru)
CA (1) CA2393611C (ru)
EA (1) EA004487B1 (ru)
MX (1) MXPA02005702A (ru)
NO (1) NO20022726L (ru)
TW (1) TW556278B (ru)
WO (1) WO2001043173A1 (ru)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6325915B1 (en) * 1999-12-09 2001-12-04 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures
US6551491B2 (en) * 2000-06-02 2003-04-22 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures
US6524466B1 (en) * 2000-07-18 2003-02-25 Applied Semiconductor, Inc. Method and system of preventing fouling and corrosion of biomedical devices and structures
US6562201B2 (en) * 2001-06-08 2003-05-13 Applied Semiconductor, Inc. Semiconductive polymeric system, devices incorporating the same, and its use in controlling corrosion
US6402933B1 (en) * 2001-06-08 2002-06-11 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures
AU2005227402B2 (en) * 2001-06-08 2007-01-04 Applied Semiconductor, Inc. Semiconductive polymeric system, devices incorporating the same, and its use in controlling corrosion
US6811681B2 (en) * 2002-11-12 2004-11-02 Applied Semiconductor International Ltd. Semiconductive corrosion and fouling control apparatus, system, and method
CN100390323C (zh) * 2002-10-17 2008-05-28 应用半导体国际有限公司 半导体腐蚀和污染控制设备,系统和方法
JP2008533308A (ja) * 2005-03-17 2008-08-21 デイヴィッド・ビー・ダウリング 腐食を誘起するスペースウェザーの抑制及び／又は防止するための制御装置、システム、及び方法
US20060272909A1 (en) * 2005-06-02 2006-12-07 Fuller Brian K Brake assembly and coating
US7318889B2 (en) * 2005-06-02 2008-01-15 Applied Semiconductor International, Ltd. Apparatus, system and method for extending the life of sacrificial anodes on cathodic protection systems
TW200936814A (en) * 2007-09-07 2009-09-01 Applied semiconductor internat ltd Method of preparing high density metal oxide layers and the layers produced thereby
CN104502981B (zh) * 2014-12-30 2017-10-27 中国科学院电子学研究所 一种海洋电容性电极

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH507882A (de) * 1967-12-06 1971-05-31 Repla Sa Verfahren zur Herstellung kunstharzgebundener Platten
US3620784A (en) * 1968-01-24 1971-11-16 Nasa Potassium silicate-zinc coatings
US3562124A (en) * 1968-08-02 1971-02-09 Hooker Chemical Corp Composition for corrosion protection
US3864234A (en) * 1973-05-08 1975-02-04 Smith Corp A O Cathodic Protection System for Water Heaters with Sealant
GB2004560B (en) * 1977-09-13 1982-08-18 Dainippon Toryo Kk Anti-corrosion coating composition
US4381981A (en) * 1980-12-17 1983-05-03 S. A. Texaco Belgium N.V. Sacrificial cathodic protection system
FR2502001B1 (fr) * 1981-03-19 1985-07-12 Beghin Say Sa Articles d'hygiene pour l'absorption des liquides corporels
US4528460A (en) * 1982-12-23 1985-07-09 Brunswick Corporation Cathodic protection controller
GB8427138D0 (en) * 1984-10-26 1984-12-05 Wilson A D Coated substrates
US4957612A (en) * 1987-02-09 1990-09-18 Raychem Corporation Electrodes for use in electrochemical processes
US5009757A (en) * 1988-01-19 1991-04-23 Marine Environmental Research, Inc. Electrochemical system for the prevention of fouling on steel structures in seawater
US4863578A (en) * 1988-04-25 1989-09-05 Corrosion Service Company Limited Corrodible link for cathodic protection systems
GB9106218D0 (en) * 1991-03-23 1991-05-08 Capcis March Ltd Electrochemical impedance monitoring
JPH05256809A (ja) * 1991-03-29 1993-10-08 Osaka Gas Co Ltd 外部電源法による被防食物体の対地電位測定方法
US5352342A (en) * 1993-03-19 1994-10-04 William J. Riffe Method and apparatus for preventing corrosion of metal structures
US5500629A (en) * 1993-09-10 1996-03-19 Meyer Dennis R Noise suppressor
US5371695A (en) * 1993-10-14 1994-12-06 Ford Motor Company Method for automatically controlling the bandwidth of a digital filter and adaptive filter utilizing same
US5888374A (en) * 1997-05-08 1999-03-30 The University Of Chicago In-situ process for the monitoring of localized pitting corrosion
US6325915B1 (en) * 1999-12-09 2001-12-04 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures

Also Published As

Publication number Publication date
TW556278B (en) 2003-10-01
EP1236223A4 (en) 2009-11-18
JP5198702B2 (ja) 2013-05-15
CA2393611C (en) 2010-10-19
HK1034480A1 (en) 2001-10-26
KR20020071884A (ko) 2002-09-13
NO20022726D0 (no) 2002-06-07
NO20022726L (no) 2002-06-07
CN1195591C (zh) 2005-04-06
KR100765589B1 (ko) 2007-10-09
AU1931301A (en) 2001-06-18
MXPA02005702A (es) 2004-09-10
EP1236223A1 (en) 2002-09-04
AU784620B2 (en) 2006-05-18
CN1298770A (zh) 2001-06-13
WO2001043173A1 (en) 2001-06-14
EA004487B1 (ru) 2004-04-29
JP2003519725A (ja) 2003-06-24
US6325915B1 (en) 2001-12-04
CA2393611A1 (en) 2001-06-14

Similar Documents

Publication Publication Date Title
EA200300160A1 (ru) Способ и система предотвращения биологического загрязнения и коррозии биомедицинских устройств и структур
EA200200653A1 (ru) Способ и система защиты от коррозии проводящих конструкций
EA200000873A1 (ru) Ингибиторы фосфолипазы a
EP0573714A3 (en) Integrated circuit board with an electrical connector.
DE69200845D1 (de) Immobilisierung von blei in festen rückständen aus der rückgewinnung von metallen.
EP0918376A3 (en) Modular connectors
ES2193657T3 (es) Zocalo para componente electrico.
CA2236184A1 (en) Network-based determination of cost-effective access
ATE233434T1 (de) Optoelektronisches sensor-bauelement
ATE204032T1 (de) Verfahren und vorrichtung zum verhindern von korrosion auf metallstrukturen
MY121455A (en) Electroplating apparatus and method using a compressible contact.
EP0700124A3 (en) Electrical contact with improved locking part
DE69809761D1 (de) Aufbau eines elektrischen steckverbinders
DE69700856D1 (de) Structur für den Zusammenbau von Anschlussklemmen aus Metall
EA200400020A1 (ru) Полупроводниковая полимерная система, включающие её устройства и её применение для борьбы с коррозией
GB2337876B (en) Ceramic electronic part and mounting structure for the same
SE0000290L (sv) En antennanordning och en metod för tillverkning av en antennanordning
DK0721524T3 (da) Anvendelse af en vandig garvesyreopløsning til at forbedre resistensen over for pletter på fibrøse substrater
DE59510918D1 (de) Halbleiterbauelement mit isolierendem Gehäuse
IT1284624B1 (it) Elettrodo a diffusione di gas e metodo elettrolitico che lo impiega.
DE59600084D1 (de) Metallgehäuse für den Einbau elektrischer oder elektronischer Bauteile
DE59303918D1 (de) Gehäuse zum Einbau von elektrischen oder elektronischen Bauteilen bzw. Baugruppen
DE59303802D1 (de) Gehäuse zum Einbau von elektrischen oder elektronischen Bauteilen bzw. Baugruppen
DE69833350D1 (de) Extraktion von Metallrückständen aus Polymerlösungen
NO904504L (no) Fremgangsmaate for paavisning av korrosjonsangrep i metalloverflater.

Legal Events

Date Code Title Description
MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): AM AZ BY KZ KG MD TJ TM RU