DK3951306T3 - Højtydende elektronisk kølesystem - Google Patents
Højtydende elektronisk kølesystem Download PDFInfo
- Publication number
- DK3951306T3 DK3951306T3 DK21197460.5T DK21197460T DK3951306T3 DK 3951306 T3 DK3951306 T3 DK 3951306T3 DK 21197460 T DK21197460 T DK 21197460T DK 3951306 T3 DK3951306 T3 DK 3951306T3
- Authority
- DK
- Denmark
- Prior art keywords
- cooling system
- high performance
- electronic cooling
- performance electronic
- performance
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/06—Hollow fins; fins with internal circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2240/00—Spacing means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/797,996 US10433461B2 (en) | 2017-10-30 | 2017-10-30 | High-performance electronics cooling system |
| EP18778774.2A EP3589904B1 (en) | 2017-10-30 | 2018-09-07 | High-performance electronics cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK3951306T3 true DK3951306T3 (da) | 2023-06-12 |
Family
ID=63684607
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK18778774.2T DK3589904T3 (da) | 2017-10-30 | 2018-09-07 | Højtydende elektronisk kølesystem |
| DK21197460.5T DK3951306T3 (da) | 2017-10-30 | 2018-09-07 | Højtydende elektronisk kølesystem |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK18778774.2T DK3589904T3 (da) | 2017-10-30 | 2018-09-07 | Højtydende elektronisk kølesystem |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US10433461B2 (da) |
| EP (2) | EP3589904B1 (da) |
| CN (1) | CN110537067A (da) |
| DK (2) | DK3589904T3 (da) |
| FI (1) | FI3951306T3 (da) |
| TW (1) | TWI684095B (da) |
| WO (1) | WO2019089126A1 (da) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230020152A1 (en) * | 2014-07-18 | 2023-01-19 | Yue Zhang | Plate vapor chamber array assembly |
| WO2019022214A1 (ja) * | 2017-07-28 | 2019-01-31 | 古河電気工業株式会社 | ウィック構造体及びウィック構造体を収容したヒートパイプ |
| TWI700471B (zh) * | 2019-05-27 | 2020-08-01 | 大陸商深圳興奇宏科技有限公司 | 具軸向毛細的散熱單元 |
| CN112055502B (zh) * | 2019-06-05 | 2022-12-20 | 英业达科技有限公司 | 冷却系统 |
| CN114383453A (zh) * | 2020-10-22 | 2022-04-22 | 讯凯国际股份有限公司 | 散热装置 |
| WO2024067973A1 (en) * | 2022-09-29 | 2024-04-04 | Huawei Technologies Co., Ltd. | Cooling apparatus for cooling electronic components and electronic apparatus comprising such a cooling apparatus |
| CN118670176A (zh) * | 2023-03-16 | 2024-09-20 | 台达电子工业股份有限公司 | 虹吸式散热器 |
| TW202522248A (zh) * | 2023-11-14 | 2025-06-01 | 美商莫仕有限公司 | 用於可插拔ｉ／ｏ模組的系統及方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4047198A (en) | 1976-04-19 | 1977-09-06 | Hughes Aircraft Company | Transistor cooling by heat pipes having a wick of dielectric powder |
| US6410982B1 (en) | 1999-11-12 | 2002-06-25 | Intel Corporation | Heatpipesink having integrated heat pipe and heat sink |
| JP2004190977A (ja) | 2002-12-12 | 2004-07-08 | Sony Corp | 熱輸送装置、熱輸送装置の製造方法及び電子デバイス |
| US6994152B2 (en) | 2003-06-26 | 2006-02-07 | Thermal Corp. | Brazed wick for a heat transfer device |
| TWM309091U (en) | 2004-03-15 | 2007-04-01 | Delta Electronics Inc | Heat sink |
| TWM258337U (en) | 2004-05-31 | 2005-03-01 | Hua Yin Electric Co Ltd | The improved structure of a heat sink with heat pipes |
| CN1805133A (zh) | 2005-01-14 | 2006-07-19 | 杨洪武 | 板式热管散热器 |
| CN2874398Y (zh) * | 2005-05-10 | 2007-02-28 | 苏子欣 | 一体化热导管散热结构 |
| US7705342B2 (en) | 2005-09-16 | 2010-04-27 | University Of Cincinnati | Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes |
| JP4714638B2 (ja) * | 2006-05-25 | 2011-06-29 | 富士通株式会社 | ヒートシンク |
| US8422218B2 (en) * | 2007-04-16 | 2013-04-16 | Stephen Samuel Fried | Liquid cooled condensers for loop heat pipe like enclosure cooling |
| US7957132B2 (en) * | 2007-04-16 | 2011-06-07 | Fried Stephen S | Efficiently cool data centers and electronic enclosures using loop heat pipes |
| WO2008131587A1 (fr) * | 2007-04-28 | 2008-11-06 | Jenshyan Chen | Tuyau de chauffage et son procédé de fabrication |
| US20090040726A1 (en) | 2007-08-09 | 2009-02-12 | Paul Hoffman | Vapor chamber structure and method for manufacturing the same |
| WO2010036442A1 (en) | 2008-07-21 | 2010-04-01 | The Regents Of The University Of California | Titanium-based thermal ground plane |
| US8587944B2 (en) | 2009-04-01 | 2013-11-19 | Harris Corporation | Multi-layer mesh wicks for heat pipes |
| JP5684228B2 (ja) * | 2010-02-26 | 2015-03-11 | 古河電気工業株式会社 | ヒートシンク |
| CN102095323A (zh) | 2010-11-04 | 2011-06-15 | 华中科技大学 | 一种平板均热板 |
| TWM455153U (zh) | 2013-01-03 | 2013-06-11 | Enermax Technology Corp | 熱交換模組 |
| US9436235B2 (en) | 2013-02-26 | 2016-09-06 | Nvidia Corporation | Heat sink with an integrated vapor chamber |
| TWI644074B (zh) * | 2016-02-15 | 2018-12-11 | 訊凱國際股份有限公司 | 立體傳熱裝置 |
-
2017
- 2017-10-30 US US15/797,996 patent/US10433461B2/en active Active
-
2018
- 2018-09-07 FI FIEP21197460.5T patent/FI3951306T3/fi active
- 2018-09-07 EP EP18778774.2A patent/EP3589904B1/en active Active
- 2018-09-07 WO PCT/US2018/050041 patent/WO2019089126A1/en not_active Ceased
- 2018-09-07 DK DK18778774.2T patent/DK3589904T3/da active
- 2018-09-07 CN CN201880025929.6A patent/CN110537067A/zh active Pending
- 2018-09-07 EP EP21197460.5A patent/EP3951306B1/en active Active
- 2018-09-07 DK DK21197460.5T patent/DK3951306T3/da active
- 2018-09-13 TW TW107132170A patent/TWI684095B/zh active
-
2019
- 2019-08-16 US US16/543,120 patent/US11051427B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DK3589904T3 (da) | 2022-06-07 |
| US10433461B2 (en) | 2019-10-01 |
| EP3589904A1 (en) | 2020-01-08 |
| US11051427B2 (en) | 2021-06-29 |
| EP3951306B1 (en) | 2023-03-22 |
| WO2019089126A1 (en) | 2019-05-09 |
| US20190132992A1 (en) | 2019-05-02 |
| TWI684095B (zh) | 2020-02-01 |
| EP3951306A1 (en) | 2022-02-09 |
| EP3589904B1 (en) | 2022-03-02 |
| TW201923513A (zh) | 2019-06-16 |
| CN110537067A (zh) | 2019-12-03 |
| FI3951306T3 (fi) | 2023-06-06 |
| US20190373770A1 (en) | 2019-12-05 |
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