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DK3603877T3 - Loddelegering, loddepasta og loddeforbindelse - Google Patents

Loddelegering, loddepasta og loddeforbindelse Download PDF

Info

Publication number
DK3603877T3
DK3603877T3 DK18774478.4T DK18774478T DK3603877T3 DK 3603877 T3 DK3603877 T3 DK 3603877T3 DK 18774478 T DK18774478 T DK 18774478T DK 3603877 T3 DK3603877 T3 DK 3603877T3
Authority
DK
Denmark
Prior art keywords
solder
pasta
soldering connection
alloy
solder alloy
Prior art date
Application number
DK18774478.4T
Other languages
English (en)
Inventor
Naoko Izumita
Shunsaku Yoshikawa
Yoshie Tachibana
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Application granted granted Critical
Publication of DK3603877T3 publication Critical patent/DK3603877T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DK18774478.4T 2017-03-31 2018-03-30 Loddelegering, loddepasta og loddeforbindelse DK3603877T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017073270 2017-03-31
PCT/JP2018/013555 WO2018181873A1 (ja) 2017-03-31 2018-03-30 はんだ合金、ソルダペースト及びはんだ継手

Publications (1)

Publication Number Publication Date
DK3603877T3 true DK3603877T3 (da) 2021-09-06

Family

ID=63676469

Family Applications (1)

Application Number Title Priority Date Filing Date
DK18774478.4T DK3603877T3 (da) 2017-03-31 2018-03-30 Loddelegering, loddepasta og loddeforbindelse

Country Status (16)

Country Link
US (1) US10967464B2 (da)
EP (1) EP3603877B1 (da)
JP (1) JP6447790B1 (da)
KR (1) KR102071255B1 (da)
CN (1) CN110430968B (da)
BR (1) BR112019020490B1 (da)
DK (1) DK3603877T3 (da)
ES (1) ES2887361T3 (da)
HR (1) HRP20211378T1 (da)
HU (1) HUE056341T2 (da)
MX (1) MX374387B (da)
MY (1) MY188597A (da)
PH (1) PH12019502148B1 (da)
PT (1) PT3603877T (da)
TW (1) TWI677580B (da)
WO (1) WO2018181873A1 (da)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6624322B1 (ja) * 2019-03-27 2019-12-25 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手
TWI742813B (zh) * 2019-09-02 2021-10-11 美商阿爾發金屬化工公司 高溫超高可靠性合金
JP7212300B2 (ja) * 2020-04-10 2023-01-25 千住金属工業株式会社 はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム及びはんだ継手
JP6836040B1 (ja) * 2020-07-31 2021-02-24 千住金属工業株式会社 はんだ合金
JP6936926B1 (ja) * 2021-03-10 2021-09-22 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびはんだ継手
TWI778648B (zh) * 2021-06-04 2022-09-21 岱暉股份有限公司 焊料合金
TWI858864B (zh) * 2022-08-12 2024-10-11 日商千住金屬工業股份有限公司 焊接合金、焊接膏及焊接接點
KR20250041178A (ko) * 2022-08-12 2025-03-25 센주긴조쿠고교 가부시키가이샤 땜납 합금, 땜납 페이스트 및 땜납 조인트
CN117798544B (zh) * 2023-11-10 2024-09-20 苏州优诺电子材料科技有限公司 一种高强抗热疲劳无铅焊料合金及其制备方法

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JPS5349703A (en) 1976-10-19 1978-05-06 Nitto Tire Pneumatic tire and rim assembly
JPS53117216A (en) 1977-03-23 1978-10-13 Sugie Seitou Kk Roof structure
JPS5723056A (en) 1980-07-17 1982-02-06 Nippon Steel Corp Preparation of molten lead-tin alloy plated steel plate with excellent plating appearance and corrosion resistance
JPS6053248B2 (ja) 1981-03-27 1985-11-25 工業技術院長 軟鋼等超厚板の水中ガス切断法
JPS6047254A (ja) 1983-08-26 1985-03-14 Hitachi Ltd 光デイスクの作製方法
JPS6053248A (ja) 1983-08-31 1985-03-26 Daido Kogyo Co Ltd スチ−ルベルト
JP2005340275A (ja) * 2004-05-24 2005-12-08 Denso Corp 電子部品接合体、その製造方法、およびそれを含む電子装置
WO2014002304A1 (ja) 2012-06-29 2014-01-03 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
WO2014013632A1 (ja) * 2012-07-19 2014-01-23 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
JP5730354B2 (ja) 2013-07-17 2015-06-10 ハリマ化成株式会社 はんだ組成物、ソルダペーストおよび電子回路基板
RU2695791C2 (ru) 2014-04-30 2019-07-26 Нихон Супериор Ко., Лтд. Бессвинцовый припой
JP5723056B1 (ja) * 2014-12-15 2015-05-27 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
US20160279741A1 (en) 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
JP6200534B2 (ja) 2015-03-24 2017-09-20 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
US11229979B2 (en) 2015-05-05 2022-01-25 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
MY188659A (en) 2015-07-24 2021-12-22 Harima Chemicals Inc Solder alloy, solder paste, and electronic circuit board
EP3326745B1 (en) * 2015-07-24 2020-09-02 Harima Chemicals, Inc. Solder alloy, solder paste, and electronic circuit board
JP2016107343A (ja) 2015-12-24 2016-06-20 千住金属工業株式会社 鉛フリーはんだ合金と車載電子回路
JP6052381B2 (ja) 2015-12-24 2016-12-27 千住金属工業株式会社 鉛フリーはんだ合金
JP6047254B1 (ja) * 2016-03-22 2016-12-21 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
KR102052448B1 (ko) 2016-03-22 2019-12-05 가부시키가이샤 다무라 세이사쿠쇼 납 프리 땜납 합금, 플럭스 조성물, 솔더 페이스트 조성물, 전자 회로 기판 및 전자 제어 장치
JP2018083211A (ja) 2016-11-24 2018-05-31 ハリマ化成株式会社 ソルダペースト、フラックスおよび電子回路基板

Also Published As

Publication number Publication date
PH12019502148A1 (en) 2020-06-08
CN110430968B (zh) 2021-07-16
MY188597A (en) 2021-12-22
HRP20211378T1 (hr) 2021-12-24
JPWO2018181873A1 (ja) 2019-04-04
HUE056341T2 (hu) 2022-02-28
BR112019020490A2 (pt) 2020-04-28
EP3603877A1 (en) 2020-02-05
EP3603877B1 (en) 2021-08-11
KR20190112166A (ko) 2019-10-02
WO2018181873A1 (ja) 2018-10-04
US20200114475A1 (en) 2020-04-16
PH12019502148B1 (en) 2021-08-27
JP6447790B1 (ja) 2019-01-09
ES2887361T3 (es) 2021-12-22
CN110430968A (zh) 2019-11-08
BR112019020490B1 (pt) 2023-03-28
US10967464B2 (en) 2021-04-06
MX374387B (es) 2025-03-06
PT3603877T (pt) 2021-09-09
KR102071255B1 (ko) 2020-01-31
MX2019011465A (es) 2019-11-01
EP3603877A4 (en) 2020-02-05
TW201842206A (zh) 2018-12-01
TWI677580B (zh) 2019-11-21

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