DK3577406T3 - Væskekølesystemer til varmegenererende indretninger - Google Patents
Væskekølesystemer til varmegenererende indretninger Download PDFInfo
- Publication number
- DK3577406T3 DK3577406T3 DK18704312.0T DK18704312T DK3577406T3 DK 3577406 T3 DK3577406 T3 DK 3577406T3 DK 18704312 T DK18704312 T DK 18704312T DK 3577406 T3 DK3577406 T3 DK 3577406T3
- Authority
- DK
- Denmark
- Prior art keywords
- heat generating
- liquid cooling
- cooling systems
- generating devices
- devices
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/0207—Wire harnesses
- B60R16/0215—Protecting, fastening and routing means therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
- F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
- F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0239—Electronic boxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762454321P | 2017-02-03 | 2017-02-03 | |
| US201762534316P | 2017-07-19 | 2017-07-19 | |
| PCT/IB2018/050616 WO2018142310A1 (en) | 2017-02-03 | 2018-01-31 | Liquid cooling systems for heat generating devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK3577406T3 true DK3577406T3 (da) | 2021-06-21 |
Family
ID=61189495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK18704312.0T DK3577406T3 (da) | 2017-02-03 | 2018-01-31 | Væskekølesystemer til varmegenererende indretninger |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20180228040A1 (da) |
| EP (1) | EP3577406B1 (da) |
| CN (1) | CN110268217A (da) |
| DK (1) | DK3577406T3 (da) |
| ES (1) | ES2872875T3 (da) |
| PL (1) | PL3577406T3 (da) |
| TW (1) | TW201839343A (da) |
| WO (1) | WO2018142310A1 (da) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7181443B2 (ja) * | 2018-02-14 | 2022-12-01 | 日本電産サンキョー株式会社 | 冷却装置 |
| JP2019179832A (ja) * | 2018-03-30 | 2019-10-17 | 日本電産株式会社 | 冷却装置 |
| JP7238401B2 (ja) * | 2018-03-30 | 2023-03-14 | 日本電産株式会社 | 冷却装置 |
| CN109976484B (zh) * | 2019-04-16 | 2021-01-08 | 山东劳动职业技术学院(山东劳动技师学院) | 一种用于计算机cpu的降温装置 |
| CN113672059B (zh) * | 2020-05-15 | 2025-01-24 | 亚浩电子五金塑胶(惠州)有限公司 | 电脑液冷系统 |
| TWI734634B (zh) * | 2020-06-12 | 2021-07-21 | 雙鴻科技股份有限公司 | 水冷頭 |
| CN114121849B (zh) * | 2020-08-27 | 2025-10-31 | 讯凯国际股份有限公司 | 水冷散热装置及其制造方法 |
| CN114138082A (zh) * | 2020-09-03 | 2022-03-04 | 北京图森智途科技有限公司 | 散热系统以及服务器系统 |
| US11812582B2 (en) * | 2020-11-09 | 2023-11-07 | Baidu Usa Llc | Symmetrical cold plate design |
| CN114554779B (zh) * | 2020-11-24 | 2025-01-28 | 深圳引望智能技术有限公司 | 一种散热装置和车辆 |
| EP4092720A1 (en) * | 2021-05-20 | 2022-11-23 | Aptiv Technologies Limited | Heat sink |
| US12324127B2 (en) * | 2022-07-19 | 2025-06-03 | Hewlett Packard Enterprise Development Lp | Folded-fin vapor chamber cold plate |
| CN118843018B (zh) * | 2024-09-13 | 2024-11-22 | 长春电子科技学院 | 一种适用于5g通讯基站机柜的换热设备 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5020586A (en) * | 1989-09-08 | 1991-06-04 | Hewlett-Packard Company | Air-cooled heat exchanger for electronic circuit modules |
| TW556074B (en) * | 1998-12-15 | 2003-10-01 | Foxconn Prec Components Co Ltd | Heat sink and the manufacturing method thereof |
| CN102902329B (zh) * | 2005-05-06 | 2015-09-09 | 阿塞泰克丹麦公司 | 用于计算机系统的冷却系统 |
| US7411290B2 (en) * | 2005-08-05 | 2008-08-12 | Delphi Technologies, Inc. | Integrated circuit chip and method for cooling an integrated circuit chip |
| US7331378B2 (en) * | 2006-01-17 | 2008-02-19 | Delphi Technologies, Inc. | Microchannel heat sink |
| US20080017360A1 (en) * | 2006-07-20 | 2008-01-24 | International Business Machines Corporation | Heat exchanger with angled secondary fins extending from primary fins |
| CN101155501B (zh) * | 2006-09-27 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | 散热器 |
| US20090260789A1 (en) * | 2008-04-21 | 2009-10-22 | Dana Canada Corporation | Heat exchanger with expanded metal turbulizer |
| JP4485583B2 (ja) * | 2008-07-24 | 2010-06-23 | トヨタ自動車株式会社 | 熱交換器及びその製造方法 |
| US20100065248A1 (en) * | 2008-09-17 | 2010-03-18 | Asia Vital Components Co., Ltd. | Heat sink |
| CN102422413B (zh) * | 2009-05-11 | 2014-07-30 | 丰田自动车株式会社 | 热交换器、半导体装置及它们的制造方法 |
| JP4920071B2 (ja) * | 2009-11-12 | 2012-04-18 | 株式会社日本自動車部品総合研究所 | 半導体素子の冷却装置 |
| CN201655785U (zh) * | 2010-04-15 | 2010-11-24 | 华中科技大学 | 用于电子封装器件的微通道热沉 |
| US20120175094A1 (en) * | 2011-01-10 | 2012-07-12 | Asetek A/S | Liquid Cooling System Cold Plate Assembly |
| JP5768795B2 (ja) * | 2011-10-18 | 2015-08-26 | カルソニックカンセイ株式会社 | 排気熱交換装置 |
| CN103547115A (zh) * | 2012-07-13 | 2014-01-29 | 台达电子工业股份有限公司 | 散热器、电子装置与热交换装置 |
| US9765694B2 (en) * | 2012-08-07 | 2017-09-19 | Unison Industries, Llc | Gas turbine engine heat exchangers and methods of assembling the same |
| US9224673B2 (en) * | 2013-03-08 | 2015-12-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices |
-
2018
- 2018-01-31 ES ES18704312T patent/ES2872875T3/es active Active
- 2018-01-31 CN CN201880010297.6A patent/CN110268217A/zh active Pending
- 2018-01-31 PL PL18704312T patent/PL3577406T3/pl unknown
- 2018-01-31 DK DK18704312.0T patent/DK3577406T3/da active
- 2018-01-31 EP EP18704312.0A patent/EP3577406B1/en active Active
- 2018-01-31 US US15/885,020 patent/US20180228040A1/en not_active Abandoned
- 2018-01-31 WO PCT/IB2018/050616 patent/WO2018142310A1/en not_active Ceased
- 2018-02-02 TW TW107103855A patent/TW201839343A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018142310A1 (en) | 2018-08-09 |
| ES2872875T3 (es) | 2021-11-03 |
| EP3577406A1 (en) | 2019-12-11 |
| TW201839343A (zh) | 2018-11-01 |
| PL3577406T3 (pl) | 2021-10-04 |
| CN110268217A (zh) | 2019-09-20 |
| US20180228040A1 (en) | 2018-08-09 |
| EP3577406B1 (en) | 2021-04-21 |
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