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DK3446059T3 - LAMINATED MICRO-CHANNEL HEAT EXCHANGERS - Google Patents

LAMINATED MICRO-CHANNEL HEAT EXCHANGERS Download PDF

Info

Publication number
DK3446059T3
DK3446059T3 DK17786489.9T DK17786489T DK3446059T3 DK 3446059 T3 DK3446059 T3 DK 3446059T3 DK 17786489 T DK17786489 T DK 17786489T DK 3446059 T3 DK3446059 T3 DK 3446059T3
Authority
DK
Denmark
Prior art keywords
heat exchangers
channel heat
laminated micro
laminated
micro
Prior art date
Application number
DK17786489.9T
Other languages
Danish (da)
Inventor
Richard Todd Miller
Steven G Schon
Original Assignee
Univ Oregon State
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Oregon State filed Critical Univ Oregon State
Application granted granted Critical
Publication of DK3446059T3 publication Critical patent/DK3446059T3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/24—Safety or protection arrangements; Arrangements for preventing malfunction for electrical insulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
DK17786489.9T 2016-04-18 2017-04-18 LAMINATED MICRO-CHANNEL HEAT EXCHANGERS DK3446059T3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662324327P 2016-04-18 2016-04-18
US201715402511A 2017-01-10 2017-01-10
PCT/US2017/028183 WO2017184635A1 (en) 2016-04-18 2017-04-18 Laminated microchannel heat exchangers

Publications (1)

Publication Number Publication Date
DK3446059T3 true DK3446059T3 (en) 2024-09-30

Family

ID=60116305

Family Applications (1)

Application Number Title Priority Date Filing Date
DK17786489.9T DK3446059T3 (en) 2016-04-18 2017-04-18 LAMINATED MICRO-CHANNEL HEAT EXCHANGERS

Country Status (7)

Country Link
EP (1) EP3446059B1 (en)
KR (1) KR102494649B1 (en)
CN (1) CN109416224B (en)
DK (1) DK3446059T3 (en)
FI (1) FI3446059T3 (en)
IL (1) IL263805A (en)
WO (1) WO2017184635A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI835709B (en) 2016-04-18 2024-03-21 俄勒岡州大學 Laminated microchannel heat exchangers
CN113446883B (en) * 2021-06-25 2022-10-25 西安交通大学 Double-fluid loop staggered wave type micro-channel radiator based on elastic turbulence
TWI827117B (en) * 2022-06-29 2023-12-21 國立勤益科技大學 Heat dissipator using three dimensional(3d) printed microfluidic heat sinks applied on flexible electronic device
US20240186218A1 (en) * 2022-10-21 2024-06-06 Semiconductor Components Industries, Llc Molded power modules with fluidic-channel cooled substrates
CN118089458B (en) * 2024-03-27 2024-08-23 中国石油大学(华东) Flow boiling enhanced heat exchange device under action of micro-channel flexible pin rib

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2701554B1 (en) * 1993-02-12 1995-05-12 Transcal Heat exchanger for electronic components and electro-technical equipment.
CN1057424C (en) * 1996-02-29 2000-10-11 中国科学院上海光学精密机械研究所 micro-channel cooling heat sink
FR2763204A1 (en) * 1997-05-12 1998-11-13 Ferraz HEAT EXCHANGER FOR ELECTRONIC COMPONENTS AND ELECTROTECHNICAL APPARATUS
US6446442B1 (en) * 1999-10-07 2002-09-10 Hydrocool Pty Limited Heat exchanger for an electronic heat pump
US20050189342A1 (en) * 2004-02-23 2005-09-01 Samer Kabbani Miniature fluid-cooled heat sink with integral heater
KR100594185B1 (en) * 2004-12-02 2006-06-28 주식회사 이노윌 Plate with three-dimensional microchannel and heat exchanger using the same
CN1946278A (en) * 2005-10-05 2007-04-11 精工爱普生株式会社 Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment
JP2007127398A (en) * 2005-10-05 2007-05-24 Seiko Epson Corp Heat exchanger, heat exchanger manufacturing method, liquid cooling system, light source device, projector, electronic device unit, electronic equipment
CN100584169C (en) * 2006-04-21 2010-01-20 富准精密工业(深圳)有限公司 Liquid cooling device
US8418751B2 (en) * 2008-05-13 2013-04-16 International Business Machines Corporation Stacked and redundant chip coolers
US9310135B1 (en) 2010-05-28 2016-04-12 Cool Energy, Inc. Configureable heat exchanger
CN201830605U (en) * 2010-10-12 2011-05-11 讯凯国际股份有限公司 Liquid-cooled radiator and its heat exchanger
CN201897410U (en) * 2010-12-01 2011-07-13 杭州沈氏换热器有限公司 Micro-channel heat exchanger
CN102003899B (en) * 2010-12-01 2012-05-02 杭州沈氏换热器有限公司 Microchannel heat exchanger
JP5944104B2 (en) * 2011-03-15 2016-07-05 株式会社東芝 Heat exchanger
PL2730878T3 (en) * 2012-11-07 2019-07-31 Alfa Laval Corporate Ab Plate package and method of making a plate package

Also Published As

Publication number Publication date
EP3446059A4 (en) 2020-01-01
KR102494649B1 (en) 2023-01-31
IL263805A (en) 2019-03-31
WO2017184635A1 (en) 2017-10-26
FI3446059T3 (en) 2024-09-25
EP3446059A1 (en) 2019-02-27
CN109416224A (en) 2019-03-01
EP3446059B1 (en) 2024-06-26
CN109416224B (en) 2022-05-06
KR20190016489A (en) 2019-02-18

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