DK3340303T3 - Optoelektronisk 3d-billeddannelsesmodul - Google Patents
Optoelektronisk 3d-billeddannelsesmodul Download PDFInfo
- Publication number
- DK3340303T3 DK3340303T3 DK17207777.8T DK17207777T DK3340303T3 DK 3340303 T3 DK3340303 T3 DK 3340303T3 DK 17207777 T DK17207777 T DK 17207777T DK 3340303 T3 DK3340303 T3 DK 3340303T3
- Authority
- DK
- Denmark
- Prior art keywords
- image module
- option electronic
- option
- electronic
- module
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0219—Electrical interface; User interface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0204—Compact construction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0252—Constructional arrangements for compensating for fluctuations caused by, e.g. temperature, or using cooling or temperature stabilization of parts of the device; Controlling the atmosphere inside a photometer; Purge systems, cleaning devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0271—Housings; Attachments or accessories for photometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1662823A FR3060851B1 (fr) | 2016-12-20 | 2016-12-20 | Module optoelectronique 3d d'imagerie |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK3340303T3 true DK3340303T3 (da) | 2019-12-16 |
Family
ID=58779095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK17207777.8T DK3340303T3 (da) | 2016-12-20 | 2017-12-15 | Optoelektronisk 3d-billeddannelsesmodul |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10466097B2 (da) |
| EP (1) | EP3340303B1 (da) |
| JP (1) | JP7007888B2 (da) |
| CN (1) | CN108231914B (da) |
| CA (1) | CA2989486A1 (da) |
| DK (1) | DK3340303T3 (da) |
| ES (1) | ES2755886T3 (da) |
| FR (1) | FR3060851B1 (da) |
| TW (1) | TWI758379B (da) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10832993B1 (en) * | 2019-05-09 | 2020-11-10 | Texas Instruments Incorporated | Packaged multichip device with stacked die having a metal die attach |
| CN110197818B (zh) * | 2019-05-10 | 2025-01-10 | 中国科学院西安光学精密机械研究所 | 一种可见光成像芯片制冷散热装置 |
| AT522995B1 (de) * | 2019-10-07 | 2021-05-15 | Vexcel Imaging Gmbh | Sensoranordnung |
| CN113347325B (zh) * | 2020-03-02 | 2023-04-18 | 浙江宇视科技有限公司 | 一种成像模组及其制备方法 |
| FR3136110B1 (fr) | 2022-05-25 | 2025-06-20 | 3D Plus | Pièce de drainage thermique d’un module électronique 3D |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05251717A (ja) * | 1992-03-04 | 1993-09-28 | Hitachi Ltd | 半導体パッケージおよび半導体モジュール |
| JPH1084509A (ja) * | 1996-09-06 | 1998-03-31 | Matsushita Electron Corp | 撮像装置およびその製造方法 |
| JP4129071B2 (ja) * | 1998-03-20 | 2008-07-30 | 富士通株式会社 | 半導体部品および半導体実装装置 |
| JP3407218B2 (ja) | 1998-12-09 | 2003-05-19 | 富士電機株式会社 | 半導体光センサデバイス |
| JP2001188155A (ja) * | 1999-12-28 | 2001-07-10 | Kuurii Components Kk | 撮像素子の固定手段 |
| WO2001091193A2 (en) * | 2000-05-23 | 2001-11-29 | Atmel Corporation | Integrated ic chip package for electronic image sensor die |
| JP4185236B2 (ja) | 2000-06-19 | 2008-11-26 | イーストマン コダック カンパニー | 固体撮像素子および撮像装置 |
| US7078791B1 (en) * | 2001-05-09 | 2006-07-18 | Ess Technology, Inc. | Chip on board package for imager |
| JP4223851B2 (ja) * | 2003-03-31 | 2009-02-12 | ミツミ電機株式会社 | 小型カメラモジュール |
| JP4510403B2 (ja) * | 2003-05-08 | 2010-07-21 | 富士フイルム株式会社 | カメラモジュール及びカメラモジュールの製造方法 |
| US6860652B2 (en) * | 2003-05-23 | 2005-03-01 | Intel Corporation | Package for housing an optoelectronic assembly |
| US7372141B2 (en) * | 2005-03-31 | 2008-05-13 | Stats Chippac Ltd. | Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides |
| KR100790996B1 (ko) * | 2006-08-30 | 2008-01-03 | 삼성전자주식회사 | 이미지 센서 패키지, 그 제조 방법 및 이를 포함하는이미지 센서 모듈 |
| US7928358B2 (en) * | 2007-02-08 | 2011-04-19 | Olympus Imaging Corp. | Imaging device module and portable electronic apparatus utilizing the same |
| US8723283B2 (en) * | 2011-02-10 | 2014-05-13 | Electronics And Telecommunications Research Institute | Optical module |
| US8890047B2 (en) | 2011-09-21 | 2014-11-18 | Aptina Imaging Corporation | Stacked-chip imaging systems |
| FR2985367A1 (fr) * | 2011-12-29 | 2013-07-05 | 3D Plus | Procede de fabrication collective de modules electroniques 3d ne comportant que des pcbs valides |
| EP2663070A1 (de) * | 2012-05-10 | 2013-11-13 | Basler AG | Bildsensor-Baugruppe für eine Kamera, sowie Verfahren und Biegewerkzeug zu dessen Herstellung |
| US8759930B2 (en) * | 2012-09-10 | 2014-06-24 | Optiz, Inc. | Low profile image sensor package |
| TW201421987A (zh) * | 2012-11-19 | 2014-06-01 | Hon Hai Prec Ind Co Ltd | 影像感測器模組及取像模組 |
| JP5904957B2 (ja) * | 2013-02-28 | 2016-04-20 | キヤノン株式会社 | 電子部品および電子機器。 |
| US9768361B2 (en) * | 2014-07-23 | 2017-09-19 | Heptagon Micro Optics Pte. Ltd. | Light emitter and light detector modules including vertical alignment features |
-
2016
- 2016-12-20 FR FR1662823A patent/FR3060851B1/fr not_active Expired - Fee Related
-
2017
- 2017-12-15 US US15/843,883 patent/US10466097B2/en active Active
- 2017-12-15 DK DK17207777.8T patent/DK3340303T3/da active
- 2017-12-15 EP EP17207777.8A patent/EP3340303B1/fr active Active
- 2017-12-15 ES ES17207777T patent/ES2755886T3/es active Active
- 2017-12-19 CA CA2989486A patent/CA2989486A1/en active Pending
- 2017-12-19 JP JP2017242404A patent/JP7007888B2/ja active Active
- 2017-12-19 TW TW106144556A patent/TWI758379B/zh active
- 2017-12-20 CN CN201711382773.0A patent/CN108231914B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| ES2755886T3 (es) | 2020-04-24 |
| EP3340303A1 (fr) | 2018-06-27 |
| FR3060851B1 (fr) | 2018-12-07 |
| US10466097B2 (en) | 2019-11-05 |
| CN108231914A (zh) | 2018-06-29 |
| JP7007888B2 (ja) | 2022-02-10 |
| HK1256224A1 (zh) | 2019-09-20 |
| US20180172504A1 (en) | 2018-06-21 |
| EP3340303B1 (fr) | 2019-09-11 |
| CA2989486A1 (en) | 2018-06-20 |
| JP2018117344A (ja) | 2018-07-26 |
| CN108231914B (zh) | 2023-01-31 |
| TW201837438A (zh) | 2018-10-16 |
| TWI758379B (zh) | 2022-03-21 |
| FR3060851A1 (fr) | 2018-06-22 |
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