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DK3340303T3 - Optoelektronisk 3d-billeddannelsesmodul - Google Patents

Optoelektronisk 3d-billeddannelsesmodul Download PDF

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Publication number
DK3340303T3
DK3340303T3 DK17207777.8T DK17207777T DK3340303T3 DK 3340303 T3 DK3340303 T3 DK 3340303T3 DK 17207777 T DK17207777 T DK 17207777T DK 3340303 T3 DK3340303 T3 DK 3340303T3
Authority
DK
Denmark
Prior art keywords
image module
option electronic
option
electronic
module
Prior art date
Application number
DK17207777.8T
Other languages
English (en)
Inventor
Didier Gambart
Original Assignee
3D Plus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3D Plus filed Critical 3D Plus
Application granted granted Critical
Publication of DK3340303T3 publication Critical patent/DK3340303T3/da

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/50Encapsulations or containers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • G01J1/0219Electrical interface; User interface
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • G01J1/0204Compact construction
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • G01J1/0252Constructional arrangements for compensating for fluctuations caused by, e.g. temperature, or using cooling or temperature stabilization of parts of the device; Controlling the atmosphere inside a photometer; Purge systems, cleaning devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • G01J1/0271Housings; Attachments or accessories for photometers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/42Photometry, e.g. photographic exposure meter using electric radiation detectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/804Containers or encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/40Optical elements or arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
DK17207777.8T 2016-12-20 2017-12-15 Optoelektronisk 3d-billeddannelsesmodul DK3340303T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1662823A FR3060851B1 (fr) 2016-12-20 2016-12-20 Module optoelectronique 3d d'imagerie

Publications (1)

Publication Number Publication Date
DK3340303T3 true DK3340303T3 (da) 2019-12-16

Family

ID=58779095

Family Applications (1)

Application Number Title Priority Date Filing Date
DK17207777.8T DK3340303T3 (da) 2016-12-20 2017-12-15 Optoelektronisk 3d-billeddannelsesmodul

Country Status (9)

Country Link
US (1) US10466097B2 (da)
EP (1) EP3340303B1 (da)
JP (1) JP7007888B2 (da)
CN (1) CN108231914B (da)
CA (1) CA2989486A1 (da)
DK (1) DK3340303T3 (da)
ES (1) ES2755886T3 (da)
FR (1) FR3060851B1 (da)
TW (1) TWI758379B (da)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10832993B1 (en) * 2019-05-09 2020-11-10 Texas Instruments Incorporated Packaged multichip device with stacked die having a metal die attach
CN110197818B (zh) * 2019-05-10 2025-01-10 中国科学院西安光学精密机械研究所 一种可见光成像芯片制冷散热装置
AT522995B1 (de) * 2019-10-07 2021-05-15 Vexcel Imaging Gmbh Sensoranordnung
CN113347325B (zh) * 2020-03-02 2023-04-18 浙江宇视科技有限公司 一种成像模组及其制备方法
FR3136110B1 (fr) 2022-05-25 2025-06-20 3D Plus Pièce de drainage thermique d’un module électronique 3D

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251717A (ja) * 1992-03-04 1993-09-28 Hitachi Ltd 半導体パッケージおよび半導体モジュール
JPH1084509A (ja) * 1996-09-06 1998-03-31 Matsushita Electron Corp 撮像装置およびその製造方法
JP4129071B2 (ja) * 1998-03-20 2008-07-30 富士通株式会社 半導体部品および半導体実装装置
JP3407218B2 (ja) 1998-12-09 2003-05-19 富士電機株式会社 半導体光センサデバイス
JP2001188155A (ja) * 1999-12-28 2001-07-10 Kuurii Components Kk 撮像素子の固定手段
WO2001091193A2 (en) * 2000-05-23 2001-11-29 Atmel Corporation Integrated ic chip package for electronic image sensor die
JP4185236B2 (ja) 2000-06-19 2008-11-26 イーストマン コダック カンパニー 固体撮像素子および撮像装置
US7078791B1 (en) * 2001-05-09 2006-07-18 Ess Technology, Inc. Chip on board package for imager
JP4223851B2 (ja) * 2003-03-31 2009-02-12 ミツミ電機株式会社 小型カメラモジュール
JP4510403B2 (ja) * 2003-05-08 2010-07-21 富士フイルム株式会社 カメラモジュール及びカメラモジュールの製造方法
US6860652B2 (en) * 2003-05-23 2005-03-01 Intel Corporation Package for housing an optoelectronic assembly
US7372141B2 (en) * 2005-03-31 2008-05-13 Stats Chippac Ltd. Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides
KR100790996B1 (ko) * 2006-08-30 2008-01-03 삼성전자주식회사 이미지 센서 패키지, 그 제조 방법 및 이를 포함하는이미지 센서 모듈
US7928358B2 (en) * 2007-02-08 2011-04-19 Olympus Imaging Corp. Imaging device module and portable electronic apparatus utilizing the same
US8723283B2 (en) * 2011-02-10 2014-05-13 Electronics And Telecommunications Research Institute Optical module
US8890047B2 (en) 2011-09-21 2014-11-18 Aptina Imaging Corporation Stacked-chip imaging systems
FR2985367A1 (fr) * 2011-12-29 2013-07-05 3D Plus Procede de fabrication collective de modules electroniques 3d ne comportant que des pcbs valides
EP2663070A1 (de) * 2012-05-10 2013-11-13 Basler AG Bildsensor-Baugruppe für eine Kamera, sowie Verfahren und Biegewerkzeug zu dessen Herstellung
US8759930B2 (en) * 2012-09-10 2014-06-24 Optiz, Inc. Low profile image sensor package
TW201421987A (zh) * 2012-11-19 2014-06-01 Hon Hai Prec Ind Co Ltd 影像感測器模組及取像模組
JP5904957B2 (ja) * 2013-02-28 2016-04-20 キヤノン株式会社 電子部品および電子機器。
US9768361B2 (en) * 2014-07-23 2017-09-19 Heptagon Micro Optics Pte. Ltd. Light emitter and light detector modules including vertical alignment features

Also Published As

Publication number Publication date
ES2755886T3 (es) 2020-04-24
EP3340303A1 (fr) 2018-06-27
FR3060851B1 (fr) 2018-12-07
US10466097B2 (en) 2019-11-05
CN108231914A (zh) 2018-06-29
JP7007888B2 (ja) 2022-02-10
HK1256224A1 (zh) 2019-09-20
US20180172504A1 (en) 2018-06-21
EP3340303B1 (fr) 2019-09-11
CA2989486A1 (en) 2018-06-20
JP2018117344A (ja) 2018-07-26
CN108231914B (zh) 2023-01-31
TW201837438A (zh) 2018-10-16
TWI758379B (zh) 2022-03-21
FR3060851A1 (fr) 2018-06-22

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