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DK1969903T3 - Forbedret LED-array - Google Patents

Forbedret LED-array

Info

Publication number
DK1969903T3
DK1969903T3 DK06820445.2T DK06820445T DK1969903T3 DK 1969903 T3 DK1969903 T3 DK 1969903T3 DK 06820445 T DK06820445 T DK 06820445T DK 1969903 T3 DK1969903 T3 DK 1969903T3
Authority
DK
Denmark
Prior art keywords
led
optical sensor
light
array
led array
Prior art date
Application number
DK06820445.2T
Other languages
English (en)
Inventor
Gareth Jones
Kenneth Board
Gareth Peter Evans
Original Assignee
Enfis Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enfis Ltd filed Critical Enfis Ltd
Application granted granted Critical
Publication of DK1969903T3 publication Critical patent/DK1969903T3/da

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20Controlling the colour of the light
    • H05B45/22Controlling the colour of the light using optical feedback
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10Controlling the intensity of the light
    • H05B45/12Controlling the intensity of the light using optical feedback
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40Details of LED load circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/20Responsive to malfunctions or to light source life; for protection
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142Two-dimensional arrangements, e.g. asymmetric LED layout
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61CDENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C19/00Dental auxiliary appliances
    • A61C19/003Apparatus for curing resins by radiation
    • A61C19/004Hand-held apparatus, e.g. guns
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61CDENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C19/00Dental auxiliary appliances
    • A61C19/06Implements for therapeutic treatment
    • A61C19/063Medicament applicators for teeth or gums, e.g. treatment with fluorides
    • A61C19/066Bleaching devices; Whitening agent applicators for teeth, e.g. trays or strips
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00Radiation therapy
    • A61N5/06Radiation therapy using light
    • A61N2005/065Light sources therefor
    • A61N2005/0651Diodes
    • A61N2005/0652Arrays of diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/20Responsive to malfunctions or to light source life; for protection
    • H05B47/28Circuit arrangements for protecting against abnormal temperature

Landscapes

  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • General Health & Medical Sciences (AREA)
  • Veterinary Medicine (AREA)
  • Public Health (AREA)
  • Animal Behavior & Ethology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dentistry (AREA)
  • Epidemiology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
DK06820445.2T 2005-12-06 2006-12-06 Forbedret LED-array DK1969903T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0524909.9A GB0524909D0 (en) 2005-12-06 2005-12-06 Improved LED array
PCT/GB2006/004571 WO2007066112A1 (en) 2005-12-06 2006-12-06 Improved led array

Publications (1)

Publication Number Publication Date
DK1969903T3 true DK1969903T3 (da) 2010-07-12

Family

ID=35686197

Family Applications (1)

Application Number Title Priority Date Filing Date
DK06820445.2T DK1969903T3 (da) 2005-12-06 2006-12-06 Forbedret LED-array

Country Status (13)

Country Link
US (1) US20100176729A2 (da)
EP (1) EP1969903B1 (da)
JP (1) JP2009518840A (da)
KR (1) KR20080089380A (da)
CN (1) CN101322438A (da)
AT (1) ATE462288T1 (da)
AU (1) AU2006323418A1 (da)
CA (1) CA2632641A1 (da)
DE (1) DE602006013194D1 (da)
DK (1) DK1969903T3 (da)
ES (1) ES2343588T3 (da)
GB (4) GB0524909D0 (da)
WO (1) WO2007066112A1 (da)

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JP7043277B2 (ja) * 2018-02-06 2022-03-29 シャープ株式会社 光源モジュール及びバックライト装置
CN109585636A (zh) * 2018-12-05 2019-04-05 中山市华南理工大学现代产业技术研究院 一种可见光通信led芯片阵列的封装结构
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Also Published As

Publication number Publication date
ATE462288T1 (de) 2010-04-15
GB2443988B (en) 2009-01-28
CA2632641A1 (en) 2007-06-14
GB0803490D0 (en) 2008-04-02
US20090322227A1 (en) 2009-12-31
GB2443767B (en) 2008-11-19
US20100176729A2 (en) 2010-07-15
GB0803488D0 (en) 2008-04-02
GB0524909D0 (en) 2006-01-11
AU2006323418A1 (en) 2007-06-14
KR20080089380A (ko) 2008-10-06
JP2009518840A (ja) 2009-05-07
GB0624433D0 (en) 2007-01-17
GB2443767A (en) 2008-05-14
EP1969903A1 (en) 2008-09-17
EP1969903B1 (en) 2010-03-24
GB2433837A (en) 2007-07-04
CN101322438A (zh) 2008-12-10
ES2343588T3 (es) 2010-08-04
DE602006013194D1 (de) 2010-05-06
GB2443988A (en) 2008-05-21
GB2433837B (en) 2008-12-17
AU2006323418A8 (en) 2008-06-26
WO2007066112A1 (en) 2007-06-14

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