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DK1611468T3 - Pakning af optoelektronisk komponent på waferniveau - Google Patents

Pakning af optoelektronisk komponent på waferniveau

Info

Publication number
DK1611468T3
DK1611468T3 DK04758439T DK04758439T DK1611468T3 DK 1611468 T3 DK1611468 T3 DK 1611468T3 DK 04758439 T DK04758439 T DK 04758439T DK 04758439 T DK04758439 T DK 04758439T DK 1611468 T3 DK1611468 T3 DK 1611468T3
Authority
DK
Denmark
Prior art keywords
wafer
optoelectronic component
optoelectronic device
component packing
layer
Prior art date
Application number
DK04758439T
Other languages
English (en)
Inventor
Alan D Kathman
James E Morris
John Barnett Hammond
Michael R Feldman
Original Assignee
Digital Optics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Optics Corp filed Critical Digital Optics Corp
Application granted granted Critical
Publication of DK1611468T3 publication Critical patent/DK1611468T3/da

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
DK04758439T 2003-03-26 2004-03-26 Pakning af optoelektronisk komponent på waferniveau DK1611468T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45766403P 2003-03-26 2003-03-26
PCT/US2004/009383 WO2004088380A2 (en) 2003-03-26 2004-03-26 Package for optoelectronic device on wafer level and associated methods

Publications (1)

Publication Number Publication Date
DK1611468T3 true DK1611468T3 (da) 2008-09-08

Family

ID=33131703

Family Applications (1)

Application Number Title Priority Date Filing Date
DK04758439T DK1611468T3 (da) 2003-03-26 2004-03-26 Pakning af optoelektronisk komponent på waferniveau

Country Status (6)

Country Link
EP (2) EP1953577B1 (da)
AT (1) ATE396418T1 (da)
CA (1) CA2523418C (da)
DE (1) DE602004013945D1 (da)
DK (1) DK1611468T3 (da)
WO (1) WO2004088380A2 (da)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873566A (en) * 1985-10-28 1989-10-10 American Telephone And Telegraph Company Multilayer ceramic laser package
US5011256A (en) * 1988-10-28 1991-04-30 E. I. Du Pont De Nemours And Company Package for an opto-electronic component
TW272311B (da) * 1994-01-12 1996-03-11 At & T Corp
US5886971A (en) * 1996-09-27 1999-03-23 Digital Optics Corporation Optical head structures including support substrates adjacent transparent substrates and related methods
US6096155A (en) 1996-09-27 2000-08-01 Digital Optics Corporation Method of dicing wafer level integrated multiple optical elements
US5912872A (en) * 1996-09-27 1999-06-15 Digital Optics Corporation Integrated optical apparatus providing separated beams on a detector and associated methods
US6981804B2 (en) * 1998-06-08 2006-01-03 Arrayed Fiberoptics Corporation Vertically integrated optical devices coupled to optical fibers
EP1047970B1 (en) 1998-08-31 2014-10-29 FLIR Systems Trading Belgium BVBA Diffractive vertical cavity surface emitting laser power monitor and system
US6249136B1 (en) * 1999-06-28 2001-06-19 Advanced Micro Devices, Inc. Bottom side C4 bumps for integrated circuits
US6351027B1 (en) * 2000-02-29 2002-02-26 Agilent Technologies, Inc. Chip-mounted enclosure
US6492699B1 (en) * 2000-05-22 2002-12-10 Amkor Technology, Inc. Image sensor package having sealed cavity over active area
US6798931B2 (en) * 2001-03-06 2004-09-28 Digital Optics Corp. Separating of optical integrated modules and structures formed thereby

Also Published As

Publication number Publication date
CA2523418C (en) 2011-05-03
DE602004013945D1 (de) 2008-07-03
EP1953577A3 (en) 2010-06-16
EP1611468A2 (en) 2006-01-04
WO2004088380A2 (en) 2004-10-14
ATE396418T1 (de) 2008-06-15
EP1953577B1 (en) 2013-07-17
CA2523418A1 (en) 2004-10-14
EP1953577A2 (en) 2008-08-06
EP1611468B1 (en) 2008-05-21
WO2004088380A3 (en) 2005-04-21

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