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DK1581111T3 - Sensormodul til måling af overflader - Google Patents

Sensormodul til måling af overflader

Info

Publication number
DK1581111T3
DK1581111T3 DK03707262T DK03707262T DK1581111T3 DK 1581111 T3 DK1581111 T3 DK 1581111T3 DK 03707262 T DK03707262 T DK 03707262T DK 03707262 T DK03707262 T DK 03707262T DK 1581111 T3 DK1581111 T3 DK 1581111T3
Authority
DK
Denmark
Prior art keywords
sensor elements
sensor module
electronic circuit
sensor
coupled
Prior art date
Application number
DK03707262T
Other languages
English (en)
Inventor
Jon Nysaether
Original Assignee
Idex Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idex Asa filed Critical Idex Asa
Application granted granted Critical
Publication of DK1581111T3 publication Critical patent/DK1581111T3/da

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Image Input (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Measuring Fluid Pressure (AREA)
  • Stereophonic System (AREA)
  • Soil Working Implements (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Measuring Leads Or Probes (AREA)
DK03707262T 2002-03-01 2003-02-28 Sensormodul til måling af overflader DK1581111T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO20021031A NO316796B1 (no) 2002-03-01 2002-03-01 Sensormodul for maling av strukturer i en overflate, saerlig en fingeroverflate
PCT/NO2003/000071 WO2003075210A2 (en) 2002-03-01 2003-02-28 Sensor module for measuring surfaces

Publications (1)

Publication Number Publication Date
DK1581111T3 true DK1581111T3 (da) 2007-07-16

Family

ID=19913383

Family Applications (1)

Application Number Title Priority Date Filing Date
DK03707262T DK1581111T3 (da) 2002-03-01 2003-02-28 Sensormodul til måling af overflader

Country Status (9)

Country Link
US (1) US7239153B2 (da)
EP (1) EP1581111B1 (da)
AT (1) ATE359566T1 (da)
AU (1) AU2003208676A1 (da)
DE (1) DE60313219T2 (da)
DK (1) DK1581111T3 (da)
ES (1) ES2286407T3 (da)
NO (1) NO316796B1 (da)
WO (1) WO2003075210A2 (da)

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US8276816B2 (en) 2007-12-14 2012-10-02 Validity Sensors, Inc. Smart card system with ergonomic fingerprint sensor and method of using
US8116540B2 (en) 2008-04-04 2012-02-14 Validity Sensors, Inc. Apparatus and method for reducing noise in fingerprint sensing circuits
US8005276B2 (en) 2008-04-04 2011-08-23 Validity Sensors, Inc. Apparatus and method for reducing parasitic capacitive coupling and noise in fingerprint sensing circuits
US8698594B2 (en) 2008-07-22 2014-04-15 Synaptics Incorporated System, device and method for securing a user device component by authenticating the user of a biometric sensor by performance of a replication of a portion of an authentication process performed at a remote computing device
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US8391568B2 (en) 2008-11-10 2013-03-05 Validity Sensors, Inc. System and method for improved scanning of fingerprint edges
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US9274553B2 (en) 2009-10-30 2016-03-01 Synaptics Incorporated Fingerprint sensor and integratable electronic display
US9336428B2 (en) 2009-10-30 2016-05-10 Synaptics Incorporated Integrated fingerprint sensor and display
US9400911B2 (en) 2009-10-30 2016-07-26 Synaptics Incorporated Fingerprint sensor and integratable electronic display
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US8421890B2 (en) 2010-01-15 2013-04-16 Picofield Technologies, Inc. Electronic imager using an impedance sensor grid array and method of making
US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
US9666635B2 (en) 2010-02-19 2017-05-30 Synaptics Incorporated Fingerprint sensing circuit
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US9268991B2 (en) 2012-03-27 2016-02-23 Synaptics Incorporated Method of and system for enrolling and matching biometric data
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US9600709B2 (en) 2012-03-28 2017-03-21 Synaptics Incorporated Methods and systems for enrolling biometric data
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Also Published As

Publication number Publication date
NO20021031L (no) 2003-09-02
DE60313219T2 (de) 2007-12-20
WO2003075210A2 (en) 2003-09-12
DE60313219D1 (de) 2007-05-24
AU2003208676A1 (en) 2003-09-16
EP1581111A2 (en) 2005-10-05
NO316796B1 (no) 2004-05-10
ATE359566T1 (de) 2007-05-15
EP1581111B1 (en) 2007-04-11
WO2003075210A3 (en) 2005-08-11
NO20021031D0 (no) 2002-03-01
ES2286407T3 (es) 2007-12-01
US7239153B2 (en) 2007-07-03
US20050089200A1 (en) 2005-04-28
AU2003208676A8 (en) 2003-09-16

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