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DK0571688T3 - Anlæg til skæring af et emne - Google Patents

Anlæg til skæring af et emne

Info

Publication number
DK0571688T3
DK0571688T3 DK92810394.4T DK92810394T DK0571688T3 DK 0571688 T3 DK0571688 T3 DK 0571688T3 DK 92810394 T DK92810394 T DK 92810394T DK 0571688 T3 DK0571688 T3 DK 0571688T3
Authority
DK
Denmark
Prior art keywords
supporting arms
supporting
cut
available
coupling
Prior art date
Application number
DK92810394.4T
Other languages
English (en)
Inventor
Ernst Zumstein
Original Assignee
Bystronic Laser Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bystronic Laser Ag filed Critical Bystronic Laser Ag
Application granted granted Critical
Publication of DK0571688T3 publication Critical patent/DK0571688T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/72—Auxiliary arrangements; Interconnections between auxiliary tables and movable machine elements
    • B23Q1/76—Steadies; Rests
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q5/00—Driving or feeding mechanisms; Control arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Scissors And Nippers (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Turning (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Sawing (AREA)
DK92810394.4T 1992-05-26 1992-05-26 Anlæg til skæring af et emne DK0571688T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP92810394A EP0571688B1 (de) 1992-05-26 1992-05-26 Anlage zum Schneiden eines Werkstueckes

Publications (1)

Publication Number Publication Date
DK0571688T3 true DK0571688T3 (da) 1996-04-09

Family

ID=8211928

Family Applications (1)

Application Number Title Priority Date Filing Date
DK92810394.4T DK0571688T3 (da) 1992-05-26 1992-05-26 Anlæg til skæring af et emne

Country Status (8)

Country Link
US (1) US5382772A (da)
EP (1) EP0571688B1 (da)
JP (1) JPH06182577A (da)
AT (1) ATE134167T1 (da)
DE (1) DE59205360D1 (da)
DK (1) DK0571688T3 (da)
ES (1) ES2083720T3 (da)
GR (1) GR3019062T3 (da)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1011569A5 (nl) * 1997-11-25 1999-11-09 Lvd Co Lasersnij-inrichting.
US20030159294A1 (en) * 1998-01-21 2003-08-28 Whittenbury Clive G. Laser-assisted joining device
CA2259700C (en) 1998-01-21 2007-05-08 Clive G. Whittenbury Laser-assisted cutting device
US6176283B1 (en) 1998-06-17 2001-01-23 U.S. Natural Resources, Inc. Adjustable support for conveyor
US5918653A (en) * 1998-06-17 1999-07-06 U. S. Natural Resources Adjustable support for conveyor
EP2626165B1 (de) 2012-02-07 2018-04-18 Bystronic Laser AG Werkstückauflage
CN104402950B (zh) * 2014-12-29 2017-06-16 济南东源生物医药技术有限公司 一种胡黄连苷ⅰ结晶制备方法
CN106475670A (zh) * 2016-10-26 2017-03-08 安徽新荣钢构有限公司 一种工字钢埋弧焊用夹具
CN106493462A (zh) * 2016-10-26 2017-03-15 安徽新荣钢构有限公司 一种工字钢卡紧装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61283483A (ja) * 1985-06-10 1986-12-13 Amada Co Ltd レ−ザ加工機
DE3803918A1 (de) * 1988-02-09 1989-08-17 Interatom Auflage mit beweglichen lamellen zur halterung von werkstuecken bei laserschneidgeraeten
ATE111793T1 (de) * 1990-07-04 1994-10-15 Bystronic Laser Ag Anlage zum schneiden eines werkstücks und verfahren zur steuerung derselben.

Also Published As

Publication number Publication date
GR3019062T3 (en) 1996-05-31
US5382772A (en) 1995-01-17
JPH06182577A (ja) 1994-07-05
EP0571688A1 (de) 1993-12-01
EP0571688B1 (de) 1996-02-14
ES2083720T3 (es) 1996-04-16
ATE134167T1 (de) 1996-02-15
DE59205360D1 (de) 1996-03-28

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