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DE69113645D1 - Beschichteter heisssiegelbarer aromatischer Polyimidfilm mit hoher Druckfestigkeit. - Google Patents

Beschichteter heisssiegelbarer aromatischer Polyimidfilm mit hoher Druckfestigkeit.

Info

Publication number
DE69113645D1
DE69113645D1 DE69113645T DE69113645T DE69113645D1 DE 69113645 D1 DE69113645 D1 DE 69113645D1 DE 69113645 T DE69113645 T DE 69113645T DE 69113645 T DE69113645 T DE 69113645T DE 69113645 D1 DE69113645 D1 DE 69113645D1
Authority
DE
Germany
Prior art keywords
polyimide film
compressive strength
aromatic polyimide
high compressive
coated heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69113645T
Other languages
English (en)
Other versions
DE69113645T2 (de
Inventor
James Paul Ochsner
Darrell Joe Parish
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE69113645D1 publication Critical patent/DE69113645D1/de
Application granted granted Critical
Publication of DE69113645T2 publication Critical patent/DE69113645T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
    • Y10S505/704—Wire, fiber, or cable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Medicines Containing Antibodies Or Antigens For Use As Internal Diagnostic Agents (AREA)
DE69113645T 1990-02-05 1991-02-05 Beschichteter heisssiegelbarer aromatischer Polyimidfilm mit hoher Druckfestigkeit. Expired - Fee Related DE69113645T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/475,044 US5106667A (en) 1990-02-05 1990-02-05 Coated, heat-sealable aromatic polyimide film having superior compressive strength

Publications (2)

Publication Number Publication Date
DE69113645D1 true DE69113645D1 (de) 1995-11-16
DE69113645T2 DE69113645T2 (de) 1996-04-11

Family

ID=23886016

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69113645T Expired - Fee Related DE69113645T2 (de) 1990-02-05 1991-02-05 Beschichteter heisssiegelbarer aromatischer Polyimidfilm mit hoher Druckfestigkeit.

Country Status (5)

Country Link
US (1) US5106667A (de)
EP (1) EP0441321B1 (de)
JP (1) JP2526325B2 (de)
CA (1) CA2035676A1 (de)
DE (1) DE69113645T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206091A (en) * 1988-06-28 1993-04-27 Amoco Corporation Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings
US5260413A (en) * 1990-02-05 1993-11-09 E. I. Du Pont De Nemours And Company Coated, heat-sealable aromatic polyimide film having superior compressive strength
JP2868167B2 (ja) * 1991-08-05 1999-03-10 インターナショナル・ビジネス・マシーンズ・コーポレイション 多重レベル高密度相互接続構造体及び高密度相互接続構造体
CA2111294A1 (en) * 1992-12-16 1994-06-17 Hiroyuki Furutani Thermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wires
US5514444A (en) * 1994-06-17 1996-05-07 Hexcel Corporation Fiber reinforced polyimide honeycomb for high temperature applications
WO1997001437A1 (en) * 1995-06-28 1997-01-16 Fraivillig Materials Company Circuit board laminates and method of making
DE69822973T2 (de) * 1997-11-28 2005-03-31 Ube Industries, Ltd., Ube Aromatische Polyimidfolie mit verbesserter Haftung
TW412754B (en) * 1999-02-12 2000-11-21 Tai I Electric Wire & Cable Co Anti-inrush varnished wire
AU2003282894A1 (en) * 2002-08-13 2004-02-25 Dinesh M. Anam Friction and release coated polymide film for electrical insulation and the process of manufacturing the same
US20060127686A1 (en) * 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device
FR2889537B1 (fr) * 2005-08-08 2007-09-28 Nexans Sa Composition resistante au feu notamment pour materiau de cable d'energie et/ou de telecommunication
US8574720B2 (en) 2009-08-03 2013-11-05 E.I. Du Pont De Nemours & Company Matte finish polyimide films and methods relating thereto
US11203192B2 (en) 2009-08-03 2021-12-21 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US20130196134A1 (en) * 2009-08-03 2013-08-01 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US9631054B2 (en) 2010-07-23 2017-04-25 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8541107B2 (en) 2009-08-13 2013-09-24 E. I. Du Pont De Nemours And Company Pigmented polyimide films and methods relating thereto
US9926415B2 (en) 2010-08-05 2018-03-27 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8784993B2 (en) * 2010-12-15 2014-07-22 General Electric Company High temperature high frequency magnet wire and method of making
EP2596052A1 (de) * 2010-07-23 2013-05-29 E.I. Du Pont De Nemours And Company Polyimidfolien mit matter oberfläche und verfahren im zusammenhang damit
JP2013095057A (ja) * 2011-11-01 2013-05-20 Du Pont Teijin Advanced Paper Kk アラミド−ポリオレフィン積層体
JP7332508B2 (ja) * 2020-03-17 2023-08-23 株式会社東芝 超電導コイル及び超電導機器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3505168A (en) * 1964-09-04 1970-04-07 Du Pont Heat-sealable laminar structures of polyimides and methods of laminating
US3616177A (en) * 1969-09-17 1971-10-26 Du Pont Laminar structures of polyimides and wire insulated therewith
US3770573A (en) * 1971-06-08 1973-11-06 Du Pont Interdiffusionally bonded structures of polyimide polymeric material
JPS56118857A (en) * 1980-02-25 1981-09-18 Nitto Electric Ind Co Thermofusing polyimide composite film and its manufacture
US4389510A (en) * 1981-04-17 1983-06-21 United Technologies Corporation Water soluble polyimide prepared from 1,2,3,4 butane tetracarboxylic acid and method of preparation
US4537804A (en) * 1982-05-05 1985-08-27 General Electric Company Corona-resistant wire enamel compositions and conductors insulated therewith
IT1175511B (it) * 1984-06-18 1987-07-01 Safi Conel Spa Strato isolante a caratteristiche migliorate per l'impiego come dielettrico per conduttori elettrici metallici e conduttore elettrico isolato cosi' ottenuto
DE3566483D1 (en) * 1984-06-30 1988-12-29 Akzo Gmbh Flexible polyimide multilayer laminate
JPS61111359A (ja) * 1984-11-06 1986-05-29 Ube Ind Ltd ポリイミド膜
JPS6367145A (ja) * 1986-09-09 1988-03-25 三菱化学株式会社 積層ポリイミドフイルム
CA1326319C (en) * 1987-05-06 1994-01-18 Mitsui Chemicals, Incorporated Thermosetting resin composition

Also Published As

Publication number Publication date
JP2526325B2 (ja) 1996-08-21
JPH05131596A (ja) 1993-05-28
EP0441321B1 (de) 1995-10-11
EP0441321A2 (de) 1991-08-14
US5106667A (en) 1992-04-21
EP0441321A3 (en) 1991-10-23
DE69113645T2 (de) 1996-04-11
CA2035676A1 (en) 1991-08-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee