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DE69433375D1 - Verfahren zur Herstellung eines Dünnschichtmusters - Google Patents

Verfahren zur Herstellung eines Dünnschichtmusters

Info

Publication number
DE69433375D1
DE69433375D1 DE69433375T DE69433375T DE69433375D1 DE 69433375 D1 DE69433375 D1 DE 69433375D1 DE 69433375 T DE69433375 T DE 69433375T DE 69433375 T DE69433375 T DE 69433375T DE 69433375 D1 DE69433375 D1 DE 69433375D1
Authority
DE
Germany
Prior art keywords
making
thin film
film pattern
pattern
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69433375T
Other languages
English (en)
Other versions
DE69433375T2 (de
Inventor
Hiroshi Tsushima
Iwao Sumiyoshi
Masaaki Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Paint Co Ltd
Original Assignee
Nippon Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Paint Co Ltd filed Critical Nippon Paint Co Ltd
Publication of DE69433375D1 publication Critical patent/DE69433375D1/de
Application granted granted Critical
Publication of DE69433375T2 publication Critical patent/DE69433375T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0754—Non-macromolecular compounds containing silicon-to-silicon bonds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemically Coating (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Silicon Polymers (AREA)
DE69433375T 1993-09-27 1994-09-27 Verfahren zur Herstellung eines Dünnschichtmusters Expired - Lifetime DE69433375T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23967193 1993-09-27
JP5239671A JP2888741B2 (ja) 1993-09-27 1993-09-27 薄膜パターン形成法

Publications (2)

Publication Number Publication Date
DE69433375D1 true DE69433375D1 (de) 2004-01-15
DE69433375T2 DE69433375T2 (de) 2004-09-16

Family

ID=17048183

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69433375T Expired - Lifetime DE69433375T2 (de) 1993-09-27 1994-09-27 Verfahren zur Herstellung eines Dünnschichtmusters

Country Status (6)

Country Link
US (1) US5863679A (de)
EP (1) EP0654712B1 (de)
JP (1) JP2888741B2 (de)
KR (1) KR100307698B1 (de)
DE (1) DE69433375T2 (de)
TW (1) TW354389B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2250578C (en) * 1996-04-23 2003-06-24 Versicor Inc. Improved chemical process for preparing amide derivatives of antibiotic a 40926
US6341701B1 (en) * 1996-12-27 2002-01-29 Ngk Insulators, Ltd. Ceramic porous membrane including ceramic of ceramic and ceramic sol particles, ceramic porous body including the membrane, and method of manufacturing the membrane
US5976625A (en) * 1997-04-11 1999-11-02 Lucent Technologies Inc. Process for forming patterned dielectric oxide films
DE19805977A1 (de) * 1998-02-13 1999-08-19 Inst Neue Mat Gemein Gmbh Photochrome Beschichtungszusammensetzung und damit beschichtete Substrate
JP3539234B2 (ja) * 1998-10-22 2004-07-07 信越化学工業株式会社 金属パターン用被膜形成用ポリシラン組成物及び金属パターン形成方法
US6514576B1 (en) * 1999-03-11 2003-02-04 Agency Of Industrial Science And Technology Method of manufacturing a diffraction grating
EP1363363B1 (de) * 1999-07-02 2004-09-22 Shin-Etsu Polymer Co., Ltd. Rohrförmiger Schaltkreisverbinder
JP2001236885A (ja) * 2000-02-22 2001-08-31 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルおよびその製造方法
DE10018697A1 (de) * 2000-04-14 2001-10-18 Inst Neue Mat Gemein Gmbh Substrate mit einer Dickschicht aus anorganischem Gel-, Glas-, Glaskeramik- oder Keramikmaterial, Verfahren zu deren Herstellung und ihre Verwendung
JP2002110344A (ja) * 2000-09-29 2002-04-12 Tdk Corp 薄膜ｅｌ素子及びその製造方法
JP4000853B2 (ja) * 2000-12-28 2007-10-31 セイコーエプソン株式会社 分子膜パターンの形成方法、分子膜パターン、及び半導体装置の製造方法
WO2002077321A1 (en) * 2001-03-26 2002-10-03 Nippon Paint Co.,Ltd. Method for forming metal pattern
US6723198B1 (en) 2001-05-24 2004-04-20 Seagate Technology Llc Servo pattern formation via transfer of sol-gel layer and magnetic media obtained thereby
JP4000836B2 (ja) * 2001-11-28 2007-10-31 セイコーエプソン株式会社 膜パターンの形成方法
JP2004006700A (ja) * 2002-03-27 2004-01-08 Seiko Epson Corp 表面処理方法、表面処理基板、膜パターンの形成方法、電気光学装置の製造方法、電気光学装置、及び電子機器
US6699748B2 (en) 2002-05-30 2004-03-02 Mitsubishi Denki Kabushiki Kaisha Method of fabricating capacitor having a photosensitive resin layer as a dielectric
JP3910908B2 (ja) * 2002-10-29 2007-04-25 新光電気工業株式会社 半導体装置用基板及びこの製造方法、並びに半導体装置
JP3910907B2 (ja) * 2002-10-29 2007-04-25 新光電気工業株式会社 キャパシタ素子及びこの製造方法、半導体装置用基板、並びに半導体装置
DE10322500A1 (de) 2003-05-19 2004-12-09 Alfred Dr. Meyerhuber Vogelschutzvorrichtung für einen transparenten Stoff, Glas mit einer Vogelschutzvorrichtung und Herstellungsverfahren hierfür
KR20050040275A (ko) * 2003-10-28 2005-05-03 삼성전자주식회사 절연막 형성용 조성물 및 이를 이용한 절연막 또는 절연막패턴의 형성방법
WO2005096321A1 (ja) * 2004-03-30 2005-10-13 Sumitomo Chemical Company, Limited パターニング基板とその製造方法
US20090206296A1 (en) * 2008-02-14 2009-08-20 Bakul Dave Methods and compositions for improving the surface properties of fabrics, garments, textiles and other substrates
WO2014136892A1 (ja) * 2013-03-06 2014-09-12 ユニマテック株式会社 含フッ素オリゴマー、それを用いたナノシリカコンポジット粒子およびそれらの製造法
JP6550350B2 (ja) * 2015-05-15 2019-07-24 富士フイルム株式会社 抗菌液、抗菌膜およびウェットワイパー
US10655769B1 (en) 2017-01-26 2020-05-19 Jeffrey Hartman Safety lock for cam lock fitting
US11187363B2 (en) 2019-09-13 2021-11-30 Jeffrey Hartman Cam lock fitting with vent and safety lock
US11585476B2 (en) * 2020-04-03 2023-02-21 Jeffrey Hartman Pivoting lock for double lever cam lock fitting

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6221151A (ja) * 1985-07-19 1987-01-29 Matsushita Electric Ind Co Ltd パタ−ン形成方法
US5077085A (en) * 1987-03-06 1991-12-31 Schnur Joel M High resolution metal patterning of ultra-thin films on solid substrates
US5021398A (en) * 1989-10-26 1991-06-04 Amp Incorporated Method of forming patterned oxide superconducting films
CA2087110A1 (en) * 1992-01-14 1993-07-15 Hiroshi Tsushima Method of forming color pattern

Also Published As

Publication number Publication date
KR950009357A (ko) 1995-04-21
US5863679A (en) 1999-01-26
EP0654712B1 (de) 2003-12-03
TW354389B (en) 1999-03-11
KR100307698B1 (ko) 2001-12-01
EP0654712A1 (de) 1995-05-24
JPH0792695A (ja) 1995-04-07
DE69433375T2 (de) 2004-09-16
JP2888741B2 (ja) 1999-05-10

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Legal Events

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