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DE602007005259D1 - Kraftsensor mit einem halbleitenden träger - Google Patents

Kraftsensor mit einem halbleitenden träger

Info

Publication number
DE602007005259D1
DE602007005259D1 DE602007005259T DE602007005259T DE602007005259D1 DE 602007005259 D1 DE602007005259 D1 DE 602007005259D1 DE 602007005259 T DE602007005259 T DE 602007005259T DE 602007005259 T DE602007005259 T DE 602007005259T DE 602007005259 D1 DE602007005259 D1 DE 602007005259D1
Authority
DE
Germany
Prior art keywords
fuel sensor
semiconductive carrier
semiconductive
carrier
fuel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007005259T
Other languages
English (en)
Inventor
Takeshi Ohsato
Shigenori Yasuie
Yusuke Hirabayashi
Hiroshi Yokobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Publication of DE602007005259D1 publication Critical patent/DE602007005259D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
    • G01L5/162—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of piezoresistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
    • G01L1/2231—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports the supports being disc- or ring-shaped, adapted for measuring a force along a single direction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49103—Strain gauge making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Joining Of Glass To Other Materials (AREA)
DE602007005259T 2006-08-24 2007-08-24 Kraftsensor mit einem halbleitenden träger Active DE602007005259D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006227467A JP5243704B2 (ja) 2006-08-24 2006-08-24 力覚センサ
PCT/JP2007/066952 WO2008023846A2 (en) 2006-08-24 2007-08-24 Force sensor using a semiconductive substrate

Publications (1)

Publication Number Publication Date
DE602007005259D1 true DE602007005259D1 (de) 2010-04-22

Family

ID=38983721

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007005259T Active DE602007005259D1 (de) 2006-08-24 2007-08-24 Kraftsensor mit einem halbleitenden träger

Country Status (6)

Country Link
US (1) US8113065B2 (de)
EP (1) EP2038628B1 (de)
JP (1) JP5243704B2 (de)
CN (1) CN101506636B (de)
DE (1) DE602007005259D1 (de)
WO (1) WO2008023846A2 (de)

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JP5243704B2 (ja) * 2006-08-24 2013-07-24 本田技研工業株式会社 力覚センサ
JP5024358B2 (ja) * 2009-01-08 2012-09-12 株式会社日本自動車部品総合研究所 作用力検出装置
JP5243988B2 (ja) * 2009-02-10 2013-07-24 本田技研工業株式会社 多軸力覚センサおよび加速度センサ
US9007190B2 (en) 2010-03-31 2015-04-14 Tk Holdings Inc. Steering wheel sensors
US8587422B2 (en) 2010-03-31 2013-11-19 Tk Holdings, Inc. Occupant sensing system
JP5759230B2 (ja) 2010-04-02 2015-08-05 ティーケー ホールディングス，インコーポレーテッド 手センサを有するステアリング・ホイール
EP2573534A1 (de) * 2011-09-20 2013-03-27 General Electric Company Wandler mit mehrfachem Freiheitsgrad
WO2013154720A1 (en) 2012-04-13 2013-10-17 Tk Holdings Inc. Pressure sensor including a pressure sensitive material for use with control systems and methods of using the same
US9493342B2 (en) 2012-06-21 2016-11-15 Nextinput, Inc. Wafer level MEMS force dies
WO2014008377A1 (en) 2012-07-05 2014-01-09 Ian Campbell Microelectromechanical load sensor and methods of manufacturing the same
JP6260622B2 (ja) 2012-09-17 2018-01-17 ティーケー ホールディングス インク．Ｔｋ Ｈｏｌｄｉｎｇｓ Ｉｎｃ． 単一層力センサ
US9381647B2 (en) 2013-02-19 2016-07-05 Seiko Epson Corporation Force detection device, robot, and moving object
US10500471B2 (en) * 2013-05-17 2019-12-10 CNOWire, Inc. Impedance-based impact determination and scoring
WO2015106246A1 (en) 2014-01-13 2015-07-16 Nextinput, Inc. Miniaturized and ruggedized wafer level mems force sensors
DE102015104410B4 (de) * 2015-03-24 2018-09-13 Tdk-Micronas Gmbh Drucksensor
US10466119B2 (en) 2015-06-10 2019-11-05 Nextinput, Inc. Ruggedized wafer level MEMS force sensor with a tolerance trench
EP3321653B1 (de) * 2015-07-07 2020-03-11 Hitachi Automotive Systems, Ltd. Halbleiterbauelement, vorrichtung zur mechanischen mengenmessung und verfahren zur herstellung eines halbleiterbauelements
JP6694062B2 (ja) * 2016-06-08 2020-05-13 日立オートモティブシステムズ株式会社 力センサ
JP6342971B2 (ja) * 2016-11-14 2018-06-13 ファナック株式会社 力検出装置及びロボット
CN110494724B (zh) 2017-02-09 2023-08-01 触控解决方案股份有限公司 集成数字力传感器和相关制造方法
US11243125B2 (en) 2017-02-09 2022-02-08 Nextinput, Inc. Integrated piezoresistive and piezoelectric fusion force sensor
US11221263B2 (en) 2017-07-19 2022-01-11 Nextinput, Inc. Microelectromechanical force sensor having a strain transfer layer arranged on the sensor die
US11423686B2 (en) 2017-07-25 2022-08-23 Qorvo Us, Inc. Integrated fingerprint and force sensor
US11243126B2 (en) 2017-07-27 2022-02-08 Nextinput, Inc. Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture
US11579028B2 (en) 2017-10-17 2023-02-14 Nextinput, Inc. Temperature coefficient of offset compensation for force sensor and strain gauge
WO2019090057A1 (en) 2017-11-02 2019-05-09 Nextinput, Inc. Sealed force sensor with etch stop layer
CN111480059B (zh) 2017-11-14 2022-10-04 直观外科手术操作公司 分离桥式电路力传感器
US11874185B2 (en) 2017-11-16 2024-01-16 Nextinput, Inc. Force attenuator for force sensor
JP2020012660A (ja) * 2018-07-13 2020-01-23 日本電産コパル電子株式会社 トルクセンサ
EP3671141B1 (de) * 2018-12-20 2022-08-03 Bizerba SE & Co. KG Wägezelle und wiegefuss
US10962427B2 (en) 2019-01-10 2021-03-30 Nextinput, Inc. Slotted MEMS force sensor
US11121096B2 (en) 2019-03-21 2021-09-14 International Business Machines Corporation Active control of electronic package warpage
JP2021071305A (ja) * 2019-10-29 2021-05-06 ミネベアミツミ株式会社 力覚センサ装置
US12379267B2 (en) * 2019-11-15 2025-08-05 Intuitive Surgical Operations, Inc. Spread bridge XY force sensor
JP6771794B1 (ja) * 2020-02-25 2020-10-21 株式会社トライフォース・マネジメント 力覚センサ
CN112326076A (zh) * 2020-11-04 2021-02-05 重庆大学 一种压力传感器和该压力传感器的安装机构
JP7618916B2 (ja) * 2020-12-24 2025-01-22 ミネベアミツミ株式会社 起歪体、力覚センサ装置
US20240167896A1 (en) * 2021-03-01 2024-05-23 Hahn-Schickard-Gesellschaft Für Angewandte Forschung E. V. Device for measuring deformations, stresses, forces and/or torques in a plurality of axes
JP2022142116A (ja) * 2021-03-16 2022-09-30 ミネベアミツミ株式会社 起歪体、力覚センサ装置
CN115112286A (zh) * 2021-03-19 2022-09-27 美蓓亚三美株式会社 应变体、力传感器装置
JP2023109029A (ja) * 2022-01-26 2023-08-07 アルプスアルパイン株式会社 荷重センサ装置
CN117053958A (zh) * 2022-05-06 2023-11-14 精量电子（深圳）有限公司 力传感器
CN115290232A (zh) * 2022-06-20 2022-11-04 无锡盛赛传感科技有限公司 环状超小型力敏陶瓷张力传感器
CN119063897A (zh) * 2024-11-05 2024-12-03 苏州敏芯微电子技术股份有限公司 一种基于mems工艺的六维力传感器

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Also Published As

Publication number Publication date
EP2038628A2 (de) 2009-03-25
US20090320610A1 (en) 2009-12-31
WO2008023846A3 (en) 2008-04-17
JP5243704B2 (ja) 2013-07-24
WO2008023846A2 (en) 2008-02-28
US8113065B2 (en) 2012-02-14
CN101506636B (zh) 2011-04-20
JP2008051625A (ja) 2008-03-06
EP2038628B1 (de) 2010-03-10
CN101506636A (zh) 2009-08-12

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