DE602004009584D1 - Halbleiterreinigungslösung - Google Patents
HalbleiterreinigungslösungInfo
- Publication number
- DE602004009584D1 DE602004009584D1 DE602004009584T DE602004009584T DE602004009584D1 DE 602004009584 D1 DE602004009584 D1 DE 602004009584D1 DE 602004009584 T DE602004009584 T DE 602004009584T DE 602004009584 T DE602004009584 T DE 602004009584T DE 602004009584 D1 DE602004009584 D1 DE 602004009584D1
- Authority
- DE
- Germany
- Prior art keywords
- compound
- cleaning solution
- equal
- present
- chemical formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 4
- 239000000126 substance Substances 0.000 abstract 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 125000003636 chemical group Chemical group 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229910021645 metal ion Inorganic materials 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
- C11D3/3947—Liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US48314703P | 2003-06-27 | 2003-06-27 | |
| US483147P | 2003-06-27 | ||
| PCT/BE2004/000095 WO2005001016A1 (en) | 2003-06-27 | 2004-06-26 | Semiconductor cleaning solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE602004009584D1 true DE602004009584D1 (de) | 2007-11-29 |
| DE602004009584T2 DE602004009584T2 (de) | 2008-08-07 |
Family
ID=33552033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE602004009584T Expired - Lifetime DE602004009584T2 (de) | 2003-06-27 | 2004-06-26 | Halbleiterreinigungslösung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7521408B2 (de) |
| EP (1) | EP1648991B1 (de) |
| AT (1) | ATE376050T1 (de) |
| DE (1) | DE602004009584T2 (de) |
| WO (1) | WO2005001016A1 (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE376050T1 (de) * | 2003-06-27 | 2007-11-15 | Imec Inter Uni Micro Electr | Halbleiterreinigungslösung |
| US7700533B2 (en) | 2005-06-23 | 2010-04-20 | Air Products And Chemicals, Inc. | Composition for removal of residue comprising cationic salts and methods using same |
| GB0520380D0 (en) | 2005-10-07 | 2005-11-16 | Unilever Plc | Stain removal |
| DE602006014551D1 (de) * | 2006-10-31 | 2010-07-08 | Soitec Silicon On Insulator | Verfahren zur Charakterisierung von Defekten auf Silizium-Oberflächen, Ätzlösung für Silizium-Oberflächen und Verfahren zur Behandlung von Silizium-Oberflächen mit der Ätzlösung |
| WO2008061258A2 (en) * | 2006-11-17 | 2008-05-22 | Sachem, Inc. | Selective metal wet etch composition and process |
| CN101270325A (zh) * | 2007-03-23 | 2008-09-24 | 安集微电子（上海）有限公司 | 一种清洗液及其应用 |
| JP2009099945A (ja) * | 2007-09-28 | 2009-05-07 | Fujifilm Corp | 半導体デバイス用洗浄剤及びそれを用いた洗浄方法 |
| US7976638B2 (en) * | 2007-11-13 | 2011-07-12 | Sachem, Inc. | High negative zeta potential polyhedral silsesquioxane composition and method for damage free semiconductor wet clean |
| TWI426125B (zh) * | 2007-11-20 | 2014-02-11 | Anji Microelectronics Co Ltd | 清洗液及其應用 |
| JP5278492B2 (ja) * | 2010-06-16 | 2013-09-04 | 株式会社デンソー | 半導体装置の製造方法 |
| CN102064090B (zh) * | 2010-10-15 | 2013-01-09 | 北京通美晶体技术有限公司 | 化合物半导体晶片清洗方法 |
| US20120295447A1 (en) * | 2010-11-24 | 2012-11-22 | Air Products And Chemicals, Inc. | Compositions and Methods for Texturing of Silicon Wafers |
| CA2896589A1 (en) | 2012-12-31 | 2014-07-03 | Volcano Corporation | Devices, systems, and methods for assessment of vessels |
| US10780461B2 (en) * | 2015-05-15 | 2020-09-22 | Taiwan Semiconductor Manufacturing Co., Ltd | Methods for processing substrate in semiconductor fabrication |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2842862A1 (de) * | 1978-10-02 | 1980-04-10 | Boehringer Mannheim Gmbh | Verfahren zur bestimmung von ionen, polaren und/oder lipophilen substanzen in fluessigkeiten |
| US5686410A (en) * | 1989-07-20 | 1997-11-11 | Novartis Ag | Polypeptide derivatives |
| EP0496605B1 (de) | 1991-01-24 | 2001-08-01 | Wako Pure Chemical Industries Ltd | Lösungen zur Oberflächenbehandlung von Halbleitern |
| JP3075290B2 (ja) | 1991-02-28 | 2000-08-14 | 三菱瓦斯化学株式会社 | 半導体基板の洗浄液 |
| DE4136590A1 (de) | 1991-11-07 | 1993-05-13 | Bosch Gmbh Robert | Pumpe |
| US5421897A (en) * | 1992-07-17 | 1995-06-06 | Grawe; John | Abatement process for contaminants |
| TW274630B (de) | 1994-01-28 | 1996-04-21 | Wako Zunyaku Kogyo Kk | |
| US5466389A (en) | 1994-04-20 | 1995-11-14 | J. T. Baker Inc. | PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates |
| US5498293A (en) * | 1994-06-23 | 1996-03-12 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| KR100429440B1 (ko) * | 1995-07-27 | 2004-07-15 | 미쓰비시 가가꾸 가부시키가이샤 | 기체의표면처리방법및그에사용되는표면처리조성물 |
| US5989353A (en) * | 1996-10-11 | 1999-11-23 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| US6066609A (en) * | 1997-07-31 | 2000-05-23 | Siemens Aktiengesellschaft | Aqueous solution for cleaning a semiconductor substrate |
| US6599370B2 (en) * | 2000-10-16 | 2003-07-29 | Mallinckrodt Inc. | Stabilized alkaline compositions for cleaning microelectronic substrates |
| DE60121468T2 (de) * | 2000-12-22 | 2007-03-29 | Interuniversitair Microelektronica Centrum (Imec) | Zusammensetzung mit einer oxidierenden und komplexierenden verbindung |
| KR20020061530A (ko) * | 2001-01-18 | 2002-07-24 | 쉬플리 캄파니, 엘.엘.씨. | 촉매 금속의 회수방법 |
| GB0116212D0 (en) * | 2001-07-03 | 2001-08-29 | Avecia Ltd | Process |
| KR100546169B1 (ko) * | 2001-09-21 | 2006-01-24 | 주식회사 하이닉스반도체 | 포토레지스트 제거용 용액 조성물 |
| RU2329298C2 (ru) * | 2002-11-05 | 2008-07-20 | Басф Акциенгезельшафт | Обработка поверхности полупроводников и используемая при этом смесь |
| ATE376050T1 (de) * | 2003-06-27 | 2007-11-15 | Imec Inter Uni Micro Electr | Halbleiterreinigungslösung |
| WO2005043245A2 (en) * | 2003-10-29 | 2005-05-12 | Mallinckrodt Baker Inc. | Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors |
| US7432233B2 (en) * | 2003-12-18 | 2008-10-07 | Interuniversitair Microelektronica Centrum (Imec) | Composition and method for treating a semiconductor substrate |
| US20080260653A1 (en) * | 2004-05-06 | 2008-10-23 | Buttar Rashid A | Transdermal Delivery Systems and Transdermal Chelation Preparations |
-
2004
- 2004-06-26 AT AT04737678T patent/ATE376050T1/de not_active IP Right Cessation
- 2004-06-26 DE DE602004009584T patent/DE602004009584T2/de not_active Expired - Lifetime
- 2004-06-26 EP EP04737678A patent/EP1648991B1/de not_active Expired - Lifetime
- 2004-06-26 WO PCT/BE2004/000095 patent/WO2005001016A1/en not_active Ceased
-
2005
- 2005-12-12 US US11/301,130 patent/US7521408B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| ATE376050T1 (de) | 2007-11-15 |
| US20060089280A1 (en) | 2006-04-27 |
| EP1648991A1 (de) | 2006-04-26 |
| DE602004009584T2 (de) | 2008-08-07 |
| WO2005001016A1 (en) | 2005-01-06 |
| EP1648991B1 (de) | 2007-10-17 |
| US7521408B2 (en) | 2009-04-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |