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DE60135963D1 - Mehrschichtelektronikbauteil - Google Patents

Mehrschichtelektronikbauteil

Info

Publication number
DE60135963D1
DE60135963D1 DE60135963T DE60135963T DE60135963D1 DE 60135963 D1 DE60135963 D1 DE 60135963D1 DE 60135963 T DE60135963 T DE 60135963T DE 60135963 T DE60135963 T DE 60135963T DE 60135963 D1 DE60135963 D1 DE 60135963D1
Authority
DE
Germany
Prior art keywords
electronic component
multilayer electronic
multilayer
component
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60135963T
Other languages
English (en)
Inventor
Taisuke Ahiko
Masaaki Togashi
Sunao Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Application granted granted Critical
Publication of DE60135963D1 publication Critical patent/DE60135963D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
DE60135963T 2000-10-06 2001-10-08 Mehrschichtelektronikbauteil Expired - Lifetime DE60135963D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000307097A JP4332634B2 (ja) 2000-10-06 2000-10-06 積層型電子部品

Publications (1)

Publication Number Publication Date
DE60135963D1 true DE60135963D1 (de) 2008-11-13

Family

ID=18787660

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60135963T Expired - Lifetime DE60135963D1 (de) 2000-10-06 2001-10-08 Mehrschichtelektronikbauteil

Country Status (5)

Country Link
US (1) US6452781B1 (de)
EP (1) EP1195783B1 (de)
JP (1) JP4332634B2 (de)
DE (1) DE60135963D1 (de)
TW (1) TW516052B (de)

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JP2001185442A (ja) * 1999-12-27 2001-07-06 Murata Mfg Co Ltd 積層コンデンサ、デカップリングコンデンサの接続構造および配線基板
US6760227B2 (en) * 2000-11-02 2004-07-06 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and manufacturing method thereof
US6545346B2 (en) * 2001-03-23 2003-04-08 Intel Corporation Integrated circuit package with a capacitor
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
DE60239391D1 (de) * 2002-06-07 2011-04-21 St Microelectronics Srl rgungsringes mit großem parasitärem Widerstand
CN100354995C (zh) * 2002-09-27 2007-12-12 京瓷株式会社 电容器、布线基板、去耦电路及高频电路
CN100437850C (zh) * 2002-10-30 2008-11-26 京瓷株式会社 电容器，布线基板，退耦电路以及高频电路
US6950300B2 (en) * 2003-05-06 2005-09-27 Marvell World Trade Ltd. Ultra low inductance multi layer ceramic capacitor
US6992387B2 (en) * 2003-06-23 2006-01-31 Intel Corporation Capacitor-related systems for addressing package/motherboard resonance
KR100714608B1 (ko) * 2004-12-03 2007-05-07 삼성전기주식회사 적층형 칩 커패시터
KR100649579B1 (ko) * 2004-12-07 2006-11-28 삼성전기주식회사 적층형 캐패시터 및 적층형 캐패시터 어레이
JP4167231B2 (ja) * 2005-01-13 2008-10-15 Ｔｄｋ株式会社 積層コンデンサ、及び、積層コンデンサの等価直列抵抗調整方法
JP2006286731A (ja) * 2005-03-31 2006-10-19 Tdk Corp 積層コンデンサ
JP2006295077A (ja) * 2005-04-14 2006-10-26 Rohm Co Ltd セラミック製チップ型電子部品とその製造方法
DE102005022142B4 (de) * 2005-05-12 2011-12-15 Epcos Ag Verfahren zur Herstellung eines elektrischen Durchführungsbauelementes
DE102005036102A1 (de) * 2005-08-01 2007-02-08 Epcos Ag Elektrisches Bauelement
KR100846080B1 (ko) 2005-08-19 2008-07-14 티디케이가부시기가이샤 적층 콘덴서
US7652869B2 (en) 2005-08-19 2010-01-26 Tdk Corporation Multilayer capacitor
US7414857B2 (en) * 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7697262B2 (en) 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7292429B2 (en) * 2006-01-18 2007-11-06 Kemet Electronics Corporation Low inductance capacitor
DE102006007331A1 (de) * 2006-02-16 2007-08-23 Infineon Technologies Ag Mehrlagen-Kapazitäts-Anordnung und Verfahren zum Herstellen derselben
JP2007234800A (ja) * 2006-02-28 2007-09-13 Tdk Corp 電子部品及びその製造方法
JP4433204B2 (ja) * 2006-03-10 2010-03-17 Ｔｄｋ株式会社 積層セラミックコンデンサ
JP4738218B2 (ja) * 2006-03-20 2011-08-03 日本特殊陶業株式会社 積層型電子部品
JP4335237B2 (ja) * 2006-07-21 2009-09-30 Ｔｄｋ株式会社 貫通型積層コンデンサ
JP4896642B2 (ja) * 2006-09-12 2012-03-14 Ｔｄｋ株式会社 積層コンデンサ及び電子機器
US7545623B2 (en) * 2006-11-27 2009-06-09 Kemet Electronics Corporation Interposer decoupling array having reduced electrical shorts
JP4434228B2 (ja) * 2007-03-30 2010-03-17 Ｔｄｋ株式会社 積層コンデンサアレイ
US8238116B2 (en) 2007-04-13 2012-08-07 Avx Corporation Land grid feedthrough low ESL technology
KR100925623B1 (ko) * 2007-08-31 2009-11-06 삼성전기주식회사 적층형 칩 커패시터 및 이를 구비한 회로기판 장치 및회로기판
JP4548492B2 (ja) * 2008-02-13 2010-09-22 Ｔｄｋ株式会社 積層コンデンサアレイ
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
US8242375B2 (en) 2008-09-18 2012-08-14 United Technologies Corporation Conductive emissions protection
US8713857B2 (en) * 2008-12-03 2014-05-06 Michael Logue Modular panel system
KR20110072938A (ko) * 2009-12-23 2011-06-29 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
JP5218545B2 (ja) * 2010-12-24 2013-06-26 Ｔｄｋ株式会社 積層コンデンサ
KR101376839B1 (ko) * 2012-10-12 2014-03-20 삼성전기주식회사 적층 세라믹 커패시터
US9299498B2 (en) * 2012-11-15 2016-03-29 Eulex Corp. Miniature wire-bondable capacitor
KR101477405B1 (ko) * 2013-07-05 2014-12-29 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101477426B1 (ko) * 2013-11-04 2014-12-29 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
KR102150558B1 (ko) * 2015-05-29 2020-09-01 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
KR101867982B1 (ko) * 2016-07-20 2018-06-18 삼성전기주식회사 커패시터 및 그 실장 기판
KR102494324B1 (ko) * 2016-07-27 2023-02-01 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
KR102427927B1 (ko) * 2017-11-10 2022-08-02 삼성전기주식회사 3단자 적층형 커패시터
KR102584968B1 (ko) * 2018-05-31 2023-10-05 삼성전기주식회사 커패시터 부품
US12451292B2 (en) 2019-06-27 2025-10-21 Eulex Components Inc Ceramic microelectronic devices and methods of their manufacture

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4864465A (en) * 1988-05-10 1989-09-05 The United States Of America Viad chip capacitor and method for making same
US5521332A (en) * 1992-08-31 1996-05-28 Kyocera Corporation High dielectric layer-containing alumina-based wiring substrate and package for semiconductor device
US5386339A (en) * 1993-07-29 1995-01-31 Hughes Aircraft Company Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink
US5402003A (en) * 1993-11-12 1995-03-28 Trw Inc. Low dielectric constant interconnect for multichip modules
JPH07326536A (ja) * 1994-05-31 1995-12-12 Kyocera Corp セラミックコンデンサ
JPH0855758A (ja) * 1994-08-10 1996-02-27 Sumitomo Metal Ind Ltd 積層コンデンサ
JPH0897070A (ja) * 1994-09-22 1996-04-12 Kyocera Corp セラミックコンデンサ
US5798563A (en) * 1997-01-28 1998-08-25 International Business Machines Corporation Polytetrafluoroethylene thin film chip carrier
JPH10270282A (ja) * 1997-03-21 1998-10-09 Taiyo Yuden Co Ltd 積層セラミックコンデンサ
WO1998047331A1 (fr) * 1997-04-16 1998-10-22 Kabushiki Kaisha Toshiba Tableau de connexions, son procede de fabrication et boitier de semi-conducteur
JPH10303068A (ja) * 1997-04-25 1998-11-13 Matsushita Electric Ind Co Ltd 複合積層セラミック部品
US5880925A (en) 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
JPH11135356A (ja) * 1997-10-30 1999-05-21 Kyocera Corp 積層セラミックコンデンサ
JP2991175B2 (ja) 1997-11-10 1999-12-20 株式会社村田製作所 積層コンデンサ
JPH11204372A (ja) * 1997-11-14 1999-07-30 Murata Mfg Co Ltd 積層コンデンサ
TW457498B (en) * 1998-12-03 2001-10-01 Murata Manufacturing Co Semiconductor ceramic and semiconductor ceramic device
JP4000701B2 (ja) * 1999-01-14 2007-10-31 株式会社村田製作所 積層コンデンサ
JP3489728B2 (ja) * 1999-10-18 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板および高周波回路
US6292351B1 (en) 1999-11-17 2001-09-18 Tdk Corporation Multilayer ceramic capacitor for three-dimensional mounting

Also Published As

Publication number Publication date
TW516052B (en) 2003-01-01
EP1195783A3 (de) 2006-06-07
EP1195783A2 (de) 2002-04-10
US6452781B1 (en) 2002-09-17
EP1195783B1 (de) 2008-10-01
US20020041006A1 (en) 2002-04-11
JP2002118032A (ja) 2002-04-19
JP4332634B2 (ja) 2009-09-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition