DE60045574D1 - Plasmabehandlungsvorrichtung mit innenelktrode und plasmabehandlungsverfahren - Google Patents

Plasmabehandlungsvorrichtung mit innenelktrode und plasmabehandlungsverfahren

Info

Publication number: DE60045574D1
Authority: DE; Germany
Prior art keywords: plasma treatment; internal electrode; treatment device; treatment method; plasma
Prior art date: 1999-09-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60045574T

Other languages

English (en)

Inventor

Masashi Ueda

Tomoko Takagi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

IHI Corp

Original Assignee

IHI Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-09-09

Filing date

2000-09-11

Publication date

2011-03-10

2000-09-11 Application filed by IHI Corp filed Critical IHI Corp

2011-03-10 Application granted granted Critical

2011-03-10 Publication of DE60045574D1 publication Critical patent/DE60045574D1/de

2020-09-12 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Plasma & Fusion (AREA)
Analytical Chemistry (AREA)
Metallurgy (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Chemical Kinetics & Catalysis (AREA)
Organic Chemistry (AREA)
General Chemical & Material Sciences (AREA)
Electromagnetism (AREA)
Spectroscopy & Molecular Physics (AREA)
Chemical Vapour Deposition (AREA)
Plasma Technology (AREA)
Photovoltaic Devices (AREA)
ing And Chemical Polishing (AREA)
Drying Of Semiconductors (AREA)

DE60045574T 1999-09-09 2000-09-11 Plasmabehandlungsvorrichtung mit innenelktrode und plasmabehandlungsverfahren Expired - Lifetime DE60045574D1 (de)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP25521999		1999-09-09
JP2000056584		2000-03-02
PCT/JP2000/006189 WO2001019144A1 (en)	1999-09-09	2000-09-11	Inner-electrode plasma processing apparatus and method of plasma processing

Publications (1)

Publication Number	Publication Date
DE60045574D1 true DE60045574D1 (de)	2011-03-10

Family

ID=26542088

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60045574T Expired - Lifetime DE60045574D1 (de)	1999-09-09	2000-09-11	Plasmabehandlungsvorrichtung mit innenelktrode und plasmabehandlungsverfahren

Country Status (7)

Country	Link
US (2)	US6719876B1 (de)
EP (1)	EP1130948B1 (de)
JP (1)	JP4029615B2 (de)
KR (1)	KR100732148B1 (de)
DE (1)	DE60045574D1 (de)
TW (1)	TW574412B (de)
WO (1)	WO2001019144A1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4509337B2 (ja) *	2000-09-04	2010-07-21	株式会社Ihi	薄膜形成方法及び薄膜形成装置
KR100797423B1 (ko) *	2000-05-17	2008-01-23	가부시키가이샤 아이에이치아이	플라즈마 ｃｖｄ 장치 및 방법
JP4770029B2 (ja) *	2001-01-22	2011-09-07	株式会社Ｉｈｉ	プラズマｃｖｄ装置及び太陽電池の製造方法
US7096819B2 (en) *	2001-03-30	2006-08-29	Lam Research Corporation	Inductive plasma processor having coil with plural windings and method of controlling plasma density
JP4605940B2 (ja) *	2001-06-15	2011-01-05	三菱電機株式会社	プラズマエッチング装置、プラズマエッチング方法および半導体装置の製造方法
JP5017762B2 (ja) *	2001-09-27	2012-09-05	株式会社Ｉｈｉ	放電装置、プラズマ処理方法
WO2003079740A1 (en) *	2002-03-18	2003-09-25	Tokyo Electron Limited	Plasma device
JP2004055600A (ja) *	2002-07-16	2004-02-19	Tokyo Electron Ltd	プラズマ処理装置
JP4120546B2 (ja) *	2002-10-04	2008-07-16	株式会社Ｉｈｉ	薄膜形成方法及び装置並びに太陽電池の製造方法及び装置並びに太陽電池
US8974630B2 (en) *	2003-05-07	2015-03-10	Sungkyunkwan University	Inductively coupled plasma processing apparatus having internal linear antenna for large area processing
US20050067934A1 (en) *	2003-09-26	2005-03-31	Ishikawajima-Harima Heavy Industries Co., Ltd.	Discharge apparatus, plasma processing method and solar cell
ES2326082T3 (es) *	2003-12-01	2009-09-30	L'oreal	Derivados de 4-5-diamino-n,n-dihidro-pirazol-3-ona condensados, utilizados para la tincion de fibras queratinicas.
WO2006093136A1 (ja) *	2005-03-01	2006-09-08	Hitachi Kokusai Electric Inc.	基板処理装置および半導体デバイスの製造方法
KR100735868B1 (ko) *	2005-08-04	2007-07-06	주식회사 누리테크	패럴린 코팅 전처리용 플라즈마 발생장치
JP2007123008A (ja) *	2005-10-27	2007-05-17	Nissin Electric Co Ltd	プラズマ生成方法及び装置並びにプラズマ処理装置
EP1918967B1 (de) *	2006-11-02	2013-12-25	Dow Corning Corporation	Verfahren zur Herstellung einer Schicht durch Abscheidung aus einem Plasma
US7845310B2 (en) *	2006-12-06	2010-12-07	Axcelis Technologies, Inc.	Wide area radio frequency plasma apparatus for processing multiple substrates
JP5329796B2 (ja) *	2007-11-14	2013-10-30	株式会社イー・エム・ディー	プラズマ処理装置
US20090169341A1 (en) *	2008-01-01	2009-07-02	Dongguan Anwell Digital Machinery Ltd.	Method and system for handling objects in chambers
JP2009209447A (ja) *	2008-02-04	2009-09-17	Hitachi Kokusai Electric Inc	基板処理装置
KR101215089B1 (ko) *	2008-06-06	2012-12-24	가부시키가이샤 아루박	박막 태양전지 제조 장치
TWI420683B (zh) *	2008-06-06	2013-12-21	Ulvac Inc	薄膜太陽能電池製造裝置
US20110097518A1 (en) *	2009-10-28	2011-04-28	Applied Materials, Inc.	Vertically integrated processing chamber
TWI432100B (zh) *	2009-11-25	2014-03-21	Ind Tech Res Inst	電漿產生裝置
US20130104803A1 (en)	2010-03-03	2013-05-02	Mitsui Engineering & Shipbuilding Co., Ltd.	Thin film forming apparatus
JP2013044044A (ja) *	2011-08-26	2013-03-04	Ihi Corp	アレイアンテナ式のｃｖｄプラズマ装置
GB2489761B (en) *	2011-09-07	2015-03-04	Europlasma Nv	Surface coatings
JP6010981B2 (ja) *	2012-04-03	2016-10-19	株式会社Ihi	プラズマ処理装置
JP5817646B2 (ja) *	2012-05-29	2015-11-18	株式会社島津製作所	サンプルホルダ
JP2014109060A (ja) *	2012-12-03	2014-06-12	Ihi Corp	アレイアンテナ式のｃｖｄプラズマ装置
JP2015074792A (ja) *	2013-10-07	2015-04-20	株式会社Ｓｃｒｅｅｎホールディングス	プラズマｃｖｄ装置
WO2020023874A1 (en) *	2018-07-26	2020-01-30	Lam Research Corporation	Compact high density plasma source

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE69032952T2 (de) *	1989-11-15	1999-09-30	Haruhisa Kinoshita	Trocken-Behandlungsvorrichtung
NL9000809A (nl) *	1990-04-06	1991-11-01	Philips Nv	Plasmagenerator.
JP2785442B2 (ja)	1990-05-15	1998-08-13	三菱重工業株式会社	プラズマｃｖｄ装置
JP2989279B2 (ja)	1991-01-21	1999-12-13	三菱重工業株式会社	プラズマｃｖｄ装置
US5801915A (en) *	1994-01-31	1998-09-01	Applied Materials, Inc.	Electrostatic chuck having a unidirectionally conducting coupler layer
US5558718A (en) *	1994-04-08	1996-09-24	The Regents, University Of California	Pulsed source ion implantation apparatus and method
JPH08299785A (ja) *	1995-05-10	1996-11-19	Mitsubishi Heavy Ind Ltd	放電反応装置
JP3208079B2 (ja)	1996-02-27	2001-09-10	松下電器産業株式会社	高周波電力印加装置及びプラズマ処理装置
JPH11246971A (ja) *	1998-03-03	1999-09-14	Canon Inc	微結晶シリコン系薄膜の作製方法及び作製装置
JP3068604B2 (ja) *	1998-04-08	2000-07-24	三菱重工業株式会社	プラズマｃｖｄ装置
JP3697110B2 (ja) *	1998-05-29	2005-09-21	三菱重工業株式会社	プラズマ化学蒸着装置
JP2000235953A (ja) *	1999-02-15	2000-08-29	Canon Inc	プラズマ処理による堆積膜形成装置
JP4770029B2 (ja) *	2001-01-22	2011-09-07	株式会社Ｉｈｉ	プラズマｃｖｄ装置及び太陽電池の製造方法

2000
- 2000-09-11 US US09/830,879 patent/US6719876B1/en not_active Expired - Lifetime
- 2000-09-11 KR KR1020017005587A patent/KR100732148B1/ko not_active Expired - Fee Related
- 2000-09-11 EP EP00957087A patent/EP1130948B1/de not_active Expired - Lifetime
- 2000-09-11 DE DE60045574T patent/DE60045574D1/de not_active Expired - Lifetime
- 2000-09-11 TW TW89118617A patent/TW574412B/zh not_active IP Right Cessation
- 2000-09-11 JP JP2001522205A patent/JP4029615B2/ja not_active Expired - Lifetime
- 2000-09-11 WO PCT/JP2000/006189 patent/WO2001019144A1/ja not_active Ceased
2003
- 2003-03-26 US US10/396,381 patent/US20030183169A1/en not_active Abandoned

Also Published As

Publication number	Publication date
US20030183169A1 (en)	2003-10-02
EP1130948B1 (de)	2011-01-26
WO2001019144A1 (en)	2001-03-15
EP1130948A1 (de)	2001-09-05
TW574412B (en)	2004-02-01
JP4029615B2 (ja)	2008-01-09
KR100732148B1 (ko)	2007-06-25
US6719876B1 (en)	2004-04-13
EP1130948A4 (de)	2007-03-07
KR20020004935A (ko)	2002-01-16

Publication	Publication Date	Title
DE60045574D1 (de)	2011-03-10	Plasmabehandlungsvorrichtung mit innenelktrode und plasmabehandlungsverfahren
DE60019490D1 (de)	2005-05-25	Brennstofförder-und behandlungsvorrichtung
DE50000979D1 (de)	2003-01-30	Lenkvorrichtung und lenkverfahren
DE60036631D1 (de)	2007-11-15	Plasmabehandlungsapparatur und plasmabehandlungsverfahren
DE60022939D1 (de)	2006-02-16	Ausbringbare Sensorvorrichtung und Ausbringverfahren
DE60044764D1 (de)	2010-09-16	Durchgangs -Vorrichtung und -Verfahren
EE200000366A (et)	2001-04-16	Seade ja meetod keha kudede ravimiseks elektri või ravimitega
DE60038669D1 (de)	2008-06-05	Wärmebehandlungsgerät und methode
ATE311741T1 (de)	2005-12-15	Ernteverfahren und erntevorrichtung
DE60040005D1 (de)	2008-10-02	Anpassungsvorrichtung und plasma-behandlungsanlage
DE60030931D1 (de)	2006-11-09	Halbleiteranordnung und Herstellungsverfahren dafür
DE60034476D1 (de)	2007-05-31	Topische nasenbehandlung mit desloratadin und mometason furoat
DE60041641D1 (de)	2009-04-09	Plasma behandlungsapparat
DE60020102D1 (de)	2005-06-16	Haarbehandlungsgerät und verfahren
DE60025136D1 (de)	2006-02-02	Empfangsvorrichtung und Empfangsverarbeitungsverfahren
EP1365446A4 (de)	2006-01-04	Plasmabehandlungseinrichtung und plasmabehandlungsverfahren
DE69838398D1 (de)	2007-10-18	Methode und vorrichtung zum behandeln mit plasma
DE60324133D1 (de)	2008-11-27	Implantierbare medizinische vorrichtung und herstellungsverfahren dafür
DE60039547D1 (de)	2008-08-28	Bestückungsverfahren und Bestückungsvorrichtung
DE60038914D1 (de)	2008-06-26	Dekodierungsvorrichtung und Dekodierungsverfahren
DE60026278D1 (de)	2006-04-27	Anzeigevorrichtung und herstellungsverfahren
DE69736267D1 (de)	2006-08-17	Plasmabehandlungsvorrichtung und -verfahren
DE69515626D1 (de)	2000-04-20	Plasmabehandlungsverfahren und -vorrichtung
DE60322669D1 (de)	2008-09-18	Wärmebehandlungseinrichtung und wärmebehandlungsverfahren
DE19883021T1 (de)	2002-01-31	Entladungsoberflächenbehandlungsgerät und Entladungsoberflächenbehandlungsverfahren