[go: up one dir, main page]

DE60011764D1 - Werkstoffsprüfung - Google Patents

Werkstoffsprüfung

Info

Publication number
DE60011764D1
DE60011764D1 DE60011764T DE60011764T DE60011764D1 DE 60011764 D1 DE60011764 D1 DE 60011764D1 DE 60011764 T DE60011764 T DE 60011764T DE 60011764 T DE60011764 T DE 60011764T DE 60011764 D1 DE60011764 D1 DE 60011764D1
Authority
DE
Germany
Prior art keywords
werkstoffprüfung
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60011764T
Other languages
English (en)
Other versions
DE60011764T2 (de
Inventor
Adrian Boyle
Peter Conlon
Mark Owen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MV Res Ltd
Original Assignee
MV Res Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MV Res Ltd filed Critical MV Res Ltd
Publication of DE60011764D1 publication Critical patent/DE60011764D1/de
Application granted granted Critical
Publication of DE60011764T2 publication Critical patent/DE60011764T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
DE60011764T 1999-04-07 2000-04-07 Werkstoffsprüfung Expired - Fee Related DE60011764T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IE990282 1999-04-07
IE990282 1999-04-07
PCT/IE2000/000039 WO2000059671A1 (en) 1999-04-07 2000-04-07 Material inspection

Publications (2)

Publication Number Publication Date
DE60011764D1 true DE60011764D1 (de) 2004-07-29
DE60011764T2 DE60011764T2 (de) 2005-07-07

Family

ID=11042037

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60011764T Expired - Fee Related DE60011764T2 (de) 1999-04-07 2000-04-07 Werkstoffsprüfung

Country Status (7)

Country Link
US (1) US6697151B2 (de)
EP (1) EP1175276B1 (de)
JP (1) JP2002541443A (de)
AU (1) AU3667900A (de)
DE (1) DE60011764T2 (de)
IE (2) IE20000263A1 (de)
WO (1) WO2000059671A1 (de)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1653297B (zh) * 2002-05-08 2010-09-29 佛森技术公司 高效固态光源及其使用和制造方法
EP1452260A1 (de) * 2003-02-26 2004-09-01 Behr GmbH & Co. Vorrichtung und Verfahren zum Aufbringen eines Flussmittels für das Hartlöten von Teilen
US6970240B2 (en) * 2003-03-10 2005-11-29 Applera Corporation Combination reader
US6924440B2 (en) * 2003-03-28 2005-08-02 Sony Corporation Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board
US7538440B2 (en) * 2003-04-30 2009-05-26 Intel Corporation Method for improved high current component interconnections
WO2005041632A2 (en) 2003-10-31 2005-05-12 Phoseon Technology, Inc. Collection optics for led array with offset hemispherical or faceted surfaces
EP1735844B1 (de) 2004-03-18 2019-06-19 Phoseon Technology, Inc. Verwendung eines hochdichten leuchtdioden-arrays mit mikro-reflektoren für aushärtungsverfahren
US7816638B2 (en) * 2004-03-30 2010-10-19 Phoseon Technology, Inc. LED array having array-based LED detectors
WO2005100961A2 (en) 2004-04-19 2005-10-27 Phoseon Technology, Inc. Imaging semiconductor strucutures using solid state illumination
TWI288885B (en) * 2004-06-24 2007-10-21 Checkpoint Systems Inc Die attach area cut-on-fly method and apparatus
US20060055032A1 (en) * 2004-09-14 2006-03-16 Kuo-Chin Chang Packaging with metal studs formed on solder pads
GB2418729A (en) * 2004-09-30 2006-04-05 Mv Res Ltd Determination of solder paste composition quality by measuring emitted fluorescence radiation intensity
US8103331B2 (en) 2004-12-06 2012-01-24 Cambridge Research & Instrumentation, Inc. Systems and methods for in-vivo optical imaging and measurement
KR101288758B1 (ko) * 2004-12-30 2013-07-23 포세온 테크날러지 인코퍼레이티드 산업 공정에서 광원을 사용하는 시스템 및 방법
US7245024B2 (en) * 2005-01-21 2007-07-17 Delphi Technologies, Inc. Electronic assembly with reduced leakage current
US7105834B2 (en) * 2005-01-21 2006-09-12 Innovative Productivity, Inc. Fluorescent coating void detection system and method
DE102006017668B4 (de) * 2006-04-12 2016-06-02 Infineon Technologies Ag Verfahren zur Herstellung von Leistungshalbleiterbauteilen mit Verwendung von Farbstoffen
US7589869B2 (en) * 2006-04-28 2009-09-15 Electro Scientific Industries, Inc. Adjusting image quality using multi-wavelength light
US8115213B2 (en) 2007-02-08 2012-02-14 Phoseon Technology, Inc. Semiconductor light sources, systems, and methods
JP4899113B2 (ja) * 2007-02-26 2012-03-21 千住金属工業株式会社 はんだ付け回路基板、その処理方法、およびはんだ層・バンプの形成方法
US20080233658A1 (en) * 2007-03-22 2008-09-25 Southwest Research Institute Environmental Fluorescent Sensors
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US8383202B2 (en) 2008-06-13 2013-02-26 Kateeva, Inc. Method and apparatus for load-locked printing
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US9604245B2 (en) 2008-06-13 2017-03-28 Kateeva, Inc. Gas enclosure systems and methods utilizing an auxiliary enclosure
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
US9048344B2 (en) 2008-06-13 2015-06-02 Kateeva, Inc. Gas enclosure assembly and system
US8899171B2 (en) 2008-06-13 2014-12-02 Kateeva, Inc. Gas enclosure assembly and system
US8678612B2 (en) 2009-04-14 2014-03-25 Phoseon Technology, Inc. Modular light source
US8653737B2 (en) 2009-04-14 2014-02-18 Phoseon Technology, Inc. Controller for semiconductor lighting device
US8465172B2 (en) 2009-12-17 2013-06-18 Phoseon Technology, Inc. Lighting module with diffractive optical element
US8669697B2 (en) 2010-03-11 2014-03-11 Phoseon Technology, Inc. Cooling large arrays with high heat flux densities
FR2960689B1 (fr) * 2010-05-28 2013-05-10 Univ Bordeaux 1 Procedes d'ecriture et de lecture de donnees par fluorescence sur un support photosensible, support et dispositifs associes.
US8591078B2 (en) 2010-06-03 2013-11-26 Phoseon Technology, Inc. Microchannel cooler for light emitting diode light fixtures
US9357592B2 (en) 2010-11-18 2016-05-31 Phoseon Technology, Inc. Light source temperature monitor and control
US8113412B1 (en) * 2011-05-13 2012-02-14 Taiwan Semiconductor Manufacturing Company, Ltd Methods for detecting defect connections between metal bumps
US9120344B2 (en) 2011-08-09 2015-09-01 Kateeva, Inc. Apparatus and method for control of print gap
CN106299116B (zh) 2011-08-09 2019-07-12 科迪华公司 面向下的打印设备和方法
US8872137B2 (en) 2011-09-15 2014-10-28 Phoseon Technology, Inc. Dual elliptical reflector with a co-located foci for curing optical fibers
US9126432B2 (en) 2011-09-20 2015-09-08 Phoseon Technology, Inc. Differential Ultraviolet curing using external optical elements
EP2766762B1 (de) 2011-10-12 2019-07-17 Phoseon Technology, Inc. Mehrere lichtsammlungs- und linsenkombinationen mit benachbarten foki zur härtung von optischen fasern
US8823279B2 (en) 2011-10-27 2014-09-02 Phoseon Technology, Inc. Smart FET circuit
US8931928B2 (en) 2011-11-01 2015-01-13 Phoseon Technology, Inc. Removable window frame for lighting module
US8851715B2 (en) 2012-01-13 2014-10-07 Phoseon Technology, Inc. Lamp ventilation system
US8888336B2 (en) 2012-02-29 2014-11-18 Phoseon Technology, Inc. Air deflectors for heat management in a lighting module
US8678622B2 (en) 2012-04-27 2014-03-25 Phoseon Technology, Inc. Wrap-around window for lighting module
DE102013213894B4 (de) 2013-07-16 2018-07-05 Deutsches Zentrum für Luft- und Raumfahrt e.V. Effektor und Verfahren zum Prüfen von Werkstücken
US10468279B2 (en) 2013-12-26 2019-11-05 Kateeva, Inc. Apparatus and techniques for thermal treatment of electronic devices
US9343678B2 (en) 2014-01-21 2016-05-17 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
WO2015112454A1 (en) 2014-01-21 2015-07-30 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
WO2015168036A1 (en) 2014-04-30 2015-11-05 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
JP6572648B2 (ja) * 2015-07-07 2019-09-11 東レ株式会社 粒状樹脂検査装置ならびに検査方法
JP6117398B1 (ja) * 2016-03-30 2017-04-19 日新製鋼株式会社 鋼板の表面欠陥検査装置および表面欠陥検査方法
US10572992B2 (en) * 2017-12-28 2020-02-25 Intel Corporation 2D metrology technique for solder paste inspection
CN110930347B (zh) * 2018-09-04 2022-12-27 京东方科技集团股份有限公司 卷积神经网络的训练方法、焊点缺陷的检测方法及装置
US10939600B2 (en) * 2018-11-28 2021-03-02 International Business Machines Corporation Flux residue detection
TWI762913B (zh) * 2020-04-24 2022-05-01 牧德科技股份有限公司 檢測方法
CN112317913A (zh) * 2020-10-29 2021-02-05 义乌良霖贸易有限公司 一种用于电路板便于焊接的隐藏式固定装置
TWI830109B (zh) * 2021-12-27 2024-01-21 致茂電子股份有限公司 用於助焊劑檢測的照射光調整方法及使用該方法的檢測設備
CN120786811A (zh) * 2024-04-09 2025-10-14 泓瀚科技股份有限公司 电路板上调整助焊剂分布位置的方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH609777A5 (en) * 1976-12-10 1979-03-15 Block Engineering Photometric appliance for studying fluorescent materials, and method for operating the appliance
DE3422395A1 (de) * 1983-06-16 1985-01-17 Hitachi, Ltd., Tokio/Tokyo Verfahren und vorrichtung zum ermitteln von verdrahtungsmustern
JPS6144309A (ja) * 1984-08-08 1986-03-04 Hitachi Ltd プリント基板上の配線パターンの検査装置
US4679938A (en) * 1985-06-03 1987-07-14 International Business Machines Corporation Defect detection in films on ceramic substrates
JPS61290311A (ja) * 1985-06-19 1986-12-20 Hitachi Ltd はんだ付部の検査装置及びその方法
US5621811A (en) * 1987-10-30 1997-04-15 Hewlett-Packard Co. Learning method and apparatus for detecting and controlling solder defects
JPH03229436A (ja) * 1990-02-05 1991-10-11 Fujitsu Ltd ウエハ表面検査装置
IL95205A0 (en) * 1990-07-27 1991-06-10 Optrotech Ltd Method and apparatus for optical inspection of substrates
US5108024A (en) * 1991-06-03 1992-04-28 Motorola, Inc. Method of inspecting solder joints
JP2848086B2 (ja) * 1992-02-10 1999-01-20 日本電気株式会社 発光性プリント基板上のフラックス残渣測定法
JPH063129A (ja) * 1992-06-24 1994-01-11 Fujitsu Ltd バイアホール検査方法
JP3017606B2 (ja) * 1992-07-15 2000-03-13 株式会社日立製作所 回路基板パターンの寸法計測方法とその装置、並びに回路基板の良否選別方法とその装置
JP3004558B2 (ja) * 1995-01-23 2000-01-31 株式会社東邦計測研究所 水質測定装置
US5820697A (en) 1997-04-18 1998-10-13 International Business Machines Corporation Fluorescent water soluble solder flux
JPH10300672A (ja) * 1997-04-30 1998-11-13 Fuji Photo Film Co Ltd 蛍光画像読み取り方法および装置
JP2002514308A (ja) * 1997-06-11 2002-05-14 ネルコ ケミカル カンパニー 半導体蛍光光度計およびその使用方法
US5978093A (en) * 1997-07-17 1999-11-02 Mcms, Inc. Method for calibrating surface mounting processes in printed circuit board assembly manufacturing

Also Published As

Publication number Publication date
IE20000263A1 (en) 2000-11-15
EP1175276A1 (de) 2002-01-30
US6697151B2 (en) 2004-02-24
US20020053589A1 (en) 2002-05-09
EP1175276B1 (de) 2004-06-23
WO2000059671A1 (en) 2000-10-12
JP2002541443A (ja) 2002-12-03
IES20000264A2 (en) 2000-11-15
AU3667900A (en) 2000-10-23
DE60011764T2 (de) 2005-07-07

Similar Documents

Publication Publication Date Title
DE50010505D1 (de) Gurtaufrollersystem
DE60011764D1 (de) Werkstoffsprüfung
DE122007000064I2 (de) Erythropoietinkonjugate
DE10084676T1 (de) Einmallanzettvorrichtung
DE50002834D1 (de) Handstempel
ATE357433T1 (de) 4-pyrimidinyl-n-acyl-l-phenylanine
DE60001283D1 (de) Celluloseetherfilme
ATE297895T1 (de) 4-pyridinyl-n-acyl-l-phenylalanine
DE60001894D1 (de) Busschienenverbindungsstruktur
DE59909346D1 (de) Zylinderkopfdichtung
DE50009570D1 (de) Wechselcorrugator
DE60001649D1 (de) Ziprasidonsuspension
DE50007953D1 (de) Beleuchtungsanordung
DE50008613D1 (de) Sicherungsring
DE50016100D1 (de) Gabtriebs
NO20020773L (no) Borkronekobling
DE60000107D1 (de) Formschliessvorrichtung
DE50000805D1 (de) Aufsitzspanner
DE50006899D1 (de) Antistatikum
DE10085008T1 (de) Oberflächenbehandlungsdüse
DE50012482D1 (de) Tibiamarknagel
DE60001471D1 (de) 4-Hydroxyisothiazolverbindungen
DE50003660D1 (de) Diacylhydrazinderivate
DE50006013D1 (de) Anschlagpuffer
DE60000940D1 (de) Wälzlagerstahl

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee