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DE60010959D1 - Resistzusammensetzungen und Bildaufzeichnungsverfahren - Google Patents

Resistzusammensetzungen und Bildaufzeichnungsverfahren

Info

Publication number
DE60010959D1
DE60010959D1 DE60010959T DE60010959T DE60010959D1 DE 60010959 D1 DE60010959 D1 DE 60010959D1 DE 60010959 T DE60010959 T DE 60010959T DE 60010959 T DE60010959 T DE 60010959T DE 60010959 D1 DE60010959 D1 DE 60010959D1
Authority
DE
Germany
Prior art keywords
imaging methods
resist compositions
resist
compositions
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60010959T
Other languages
English (en)
Other versions
DE60010959T2 (de
Inventor
Jun Hatakeyama
Tomohiro Kobayashi
Osamu Watanabe
Takanobu Takeda
Toshinobu Ishihara
Jun Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE60010959D1 publication Critical patent/DE60010959D1/de
Publication of DE60010959T2 publication Critical patent/DE60010959T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/10—Kinds or types of circular or polygonal cross-section without flanges, e.g. cop tubes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2402/00—Constructional details of the handling apparatus
    • B65H2402/50—Machine elements
    • B65H2402/51—Joints, e.g. riveted or magnetic joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/50—Storage means for webs, tapes, or filamentary material
    • B65H2701/51—Cores or reels characterised by the material
    • B65H2701/512—Cores or reels characterised by the material moulded
    • B65H2701/5126—Particles of fibres, e.g. lignocelluloses material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
DE60010959T 1999-03-26 2000-03-27 Resistzusammensetzungen und Bildaufzeichnungsverfahren Expired - Lifetime DE60010959T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8288599 1999-03-26
JP8288599 1999-03-26

Publications (2)

Publication Number Publication Date
DE60010959D1 true DE60010959D1 (de) 2004-07-01
DE60010959T2 DE60010959T2 (de) 2005-06-16

Family

ID=13786738

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60010959T Expired - Lifetime DE60010959T2 (de) 1999-03-26 2000-03-27 Resistzusammensetzungen und Bildaufzeichnungsverfahren

Country Status (5)

Country Link
US (1) US6455223B1 (de)
EP (1) EP1039346B1 (de)
KR (1) KR100540968B1 (de)
DE (1) DE60010959T2 (de)
TW (1) TWI263861B (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI228203B (en) * 2000-03-22 2005-02-21 Shinetsu Chemical Co Chemical amplification positive resist material and method for forming pattern
JP4042142B2 (ja) * 2000-09-08 2008-02-06 Ｊｓｒ株式会社 Ｅｌ表示素子の隔壁形成用感放射線性樹脂組成物、隔壁およびｅｌ表示素子
TW594383B (en) * 2001-02-21 2004-06-21 Fuji Photo Film Co Ltd Positive resist composition for electron beam
JP4092083B2 (ja) * 2001-03-21 2008-05-28 富士フイルム株式会社 電子線又はｘ線用ネガ型レジスト組成物
JP4645789B2 (ja) * 2001-06-18 2011-03-09 Ｊｓｒ株式会社 ネガ型感放射線性樹脂組成物
JP3981830B2 (ja) * 2003-05-26 2007-09-26 信越化学工業株式会社 レジスト材料及びパターン形成方法
CN100503666C (zh) * 2003-12-22 2009-06-24 狮王株式会社 超支化聚合物及其制造方法、以及含有该超支化聚合物的抗蚀剂组合物
JP4448705B2 (ja) * 2004-02-05 2010-04-14 富士フイルム株式会社 感光性組成物及び該感光性組成物を用いたパターン形成方法
US7494759B2 (en) * 2004-05-31 2009-02-24 Tokyo Ohka Kogyo Co., Ltd. Positive resist compositions and process for the formation of resist patterns with the same
US8003293B2 (en) * 2004-09-30 2011-08-23 Intel Corporation Pixelated photoresists
US8137895B2 (en) * 2005-08-09 2012-03-20 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for improving photoresist pattern adhesion
US7875415B2 (en) * 2005-12-30 2011-01-25 Intel Corporation Helical pixilated photoresist
US7615329B2 (en) * 2006-03-02 2009-11-10 Intel Corporation Branching self-assembling photoresist with decomposable backbone
US20080008956A1 (en) * 2006-06-23 2008-01-10 Eastman Kodak Company Positive-working imageable members with branched hydroxystyrene polymers
TW200830050A (en) * 2006-09-21 2008-07-16 Fujifilm Corp Resist composition and pattern-forming method using the same
EP1906239A3 (de) * 2006-09-29 2009-02-18 FUJIFILM Corporation Positive Resistzusammensetzung und Verfahren zur Strukturformung damit
JP5013119B2 (ja) * 2007-09-20 2012-08-29 信越化学工業株式会社 パターン形成方法並びにこれに用いるレジスト材料
US8168367B2 (en) 2008-07-11 2012-05-01 Shin-Etsu Chemical Co., Ltd. Resist composition and patterning process
JP5290129B2 (ja) * 2008-12-25 2013-09-18 信越化学工業株式会社 化学増幅ポジ型レジスト組成物及びレジストパターン形成方法
KR20130032071A (ko) * 2011-09-22 2013-04-01 주식회사 동진쎄미켐 Ｉ-선 포토레지스트 조성물 및 이를 이용한 미세패턴 형성 방법
JP5846061B2 (ja) 2012-07-09 2016-01-20 信越化学工業株式会社 パターン形成方法
JP6247858B2 (ja) * 2013-08-01 2017-12-13 富士フイルム株式会社 パターン形成方法、及びこれを用いた電子デバイスの製造方法
CN115353576A (zh) * 2022-10-19 2022-11-18 北京八亿时空液晶科技股份有限公司 一种高收率窄分布聚羟基苯乙烯树脂的制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491628A (en) 1982-08-23 1985-01-01 International Business Machines Corporation Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone
EP0249139B2 (de) 1986-06-13 1998-03-11 MicroSi, Inc. (a Delaware corporation) Lackzusammensetzung und -anwendung
JP2578646B2 (ja) 1988-07-18 1997-02-05 三洋電機株式会社 非水系二次電池
US4939229A (en) 1989-05-12 1990-07-03 Rohm And Haas Company Method for preparing lithographically sensitive branched novolaks using a mannich base intermediate
CA2015721A1 (en) 1989-05-12 1990-11-12 Karen Ann Graziano Method of using highly branched novolaks in photoresists
US5041516A (en) * 1989-06-21 1991-08-20 Cornell Research Foundation, Inc. Dendritic molecules and method of production
EP0537524A1 (de) * 1991-10-17 1993-04-21 Shipley Company Inc. Strahlungsempfindliche Zusammensetzungen und Verfahren
JPH06266099A (ja) 1993-03-15 1994-09-22 Hitachi Ltd パターン形成材料，パターン形成方法，及びそれを用いた機能性素子形成方法
US5688628A (en) * 1993-11-11 1997-11-18 Nippon Zeon Co., Ltd. Resist composition
US5587441A (en) * 1994-11-08 1996-12-24 Cornell Research Foundation, Inc. Hyperbranched polymers from AB monomers
US5942367A (en) * 1996-04-24 1999-08-24 Shin-Etsu Chemical Co., Ltd. Chemically amplified positive resist composition, pattern forming method, and method for preparing polymer having a crosslinking group
EP0803775B1 (de) * 1996-04-25 2002-08-07 Fuji Photo Film Co., Ltd. Positiv-arbeitende lichtempfindliche Zusammensetzung
JPH1160735A (ja) * 1996-12-09 1999-03-05 Toshiba Corp ポリシランおよびパターン形成方法
TW574629B (en) * 1997-02-28 2004-02-01 Shinetsu Chemical Co Polystyrene derivative chemically amplified positive resist compositions, and patterning method
JP4183293B2 (ja) * 1997-07-09 2008-11-19 日本曹達株式会社 （メタ）アクリル酸エステル系重合体及びその製造方法
AU746445B2 (en) 1997-07-17 2002-05-02 E.I. Du Pont De Nemours And Company Branched polyolefin synthesis
TW546543B (en) * 1997-10-08 2003-08-11 Shinetsu Chemical Co Resist material and patterning process
TW480370B (en) 1997-10-08 2002-03-21 Shinetsu Chemical Co Polystyrene-based polymer compound, chemical amplification positive type resist material and pattern formation

Also Published As

Publication number Publication date
DE60010959T2 (de) 2005-06-16
US6455223B1 (en) 2002-09-24
KR100540968B1 (ko) 2006-01-10
EP1039346A1 (de) 2000-09-27
EP1039346B1 (de) 2004-05-26
TWI263861B (en) 2006-10-11
KR20000076961A (ko) 2000-12-26

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