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DE60006586D1 - Laserstrahlvorrichtung zum zielen und verfahren zum schneiden oder markieren eines werkstücks - Google Patents

Laserstrahlvorrichtung zum zielen und verfahren zum schneiden oder markieren eines werkstücks

Info

Publication number
DE60006586D1
DE60006586D1 DE60006586T DE60006586T DE60006586D1 DE 60006586 D1 DE60006586 D1 DE 60006586D1 DE 60006586 T DE60006586 T DE 60006586T DE 60006586 T DE60006586 T DE 60006586T DE 60006586 D1 DE60006586 D1 DE 60006586D1
Authority
DE
Germany
Prior art keywords
laser beam
laser
article
marking
targeting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60006586T
Other languages
English (en)
Other versions
DE60006586T2 (de
Inventor
Alan Hastings
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raylase GmbH
Original Assignee
Raylase GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raylase GmbH filed Critical Raylase GmbH
Publication of DE60006586D1 publication Critical patent/DE60006586D1/de
Application granted granted Critical
Publication of DE60006586T2 publication Critical patent/DE60006586T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Steroid Compounds (AREA)
DE60006586T 2000-01-13 2000-09-06 Laserstrahlvorrichtung zum zielen und verfahren zum schneiden oder markieren eines werkstücks Expired - Lifetime DE60006586T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GBGB0000632.0A GB0000632D0 (en) 2000-01-13 2000-01-13 Apparatus for and method of targeting
GB0000632 2000-01-13
PCT/EP2000/008703 WO2001051244A1 (de) 2000-01-13 2000-09-06 Apparatus for and method of targeting
US10/191,542 US6763045B2 (en) 2000-01-13 2002-07-10 Apparatus for and method of targeting

Publications (2)

Publication Number Publication Date
DE60006586D1 true DE60006586D1 (de) 2003-12-18
DE60006586T2 DE60006586T2 (de) 2004-05-13

Family

ID=32313972

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60006586T Expired - Lifetime DE60006586T2 (de) 2000-01-13 2000-09-06 Laserstrahlvorrichtung zum zielen und verfahren zum schneiden oder markieren eines werkstücks

Country Status (7)

Country Link
US (1) US6763045B2 (de)
EP (1) EP1246712B1 (de)
AT (1) ATE254005T1 (de)
AU (1) AU7516200A (de)
DE (1) DE60006586T2 (de)
GB (1) GB0000632D0 (de)
WO (1) WO2001051244A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10154363C1 (de) * 2001-07-25 2002-12-19 Raylase Ag Verfahren und Vorrichtung zur Steuerung der Laserstrahlenergie eines Laserstrahls
DE50210560D1 (de) * 2001-11-06 2007-09-06 Raylase Ag Verfahren und Vorrichtung zur Steuerung des Laserstrahlenergiemittels zweier in eine entgegengesetzte Richtung drehenden Brewster-Elemente
EP1415756B1 (de) * 2001-11-06 2007-07-25 Raylase Ag Verfahren und Vorrichtung zur Steuerung des Laserstrahlenergiemittels zweier in eine entgegengesetzte Richtung drehenden Brewster-Elemente
AUPS023002A0 (en) * 2002-01-31 2002-02-21 Q-Vis Limited Variable attenuator
DE10347978B4 (de) * 2003-10-15 2006-03-02 Raylase Ag Polarisationsmeßeinrichtung und Verfahren zur Bestimmung der Polarisation eines Laserstrahls
US7345256B2 (en) * 2004-04-08 2008-03-18 Ziyun Chen Methods and apparatus for delivering laser energy for joining parts
DE202004009856U1 (de) * 2004-06-23 2004-09-30 Raylase Ag Vorrichtung zur Regelung der Leistung eines Laserstrahls
CA2560238A1 (en) * 2006-09-20 2008-03-20 Institut National D'optique Laser-based ablation method and optical system
US20080090396A1 (en) * 2006-10-06 2008-04-17 Semiconductor Energy Laboratory Co., Ltd. Light exposure apparatus and method for making semiconductor device formed using the same
JP2009142865A (ja) * 2007-12-14 2009-07-02 Keyence Corp レーザ加工装置、レーザ加工方法及びレーザ加工装置の設定方法
KR20130039955A (ko) * 2011-10-13 2013-04-23 현대자동차주식회사 용접용 레이저 장치
KR102477630B1 (ko) * 2015-11-11 2022-12-14 삼성디스플레이 주식회사 표시 장치
DE102016109909A1 (de) * 2016-05-30 2017-11-30 Precitec Gmbh & Co. Kg Vorrichtung zur Prozessüberwachung bei der Laserbearbeitung
CN111142254B (zh) * 2020-02-13 2022-07-19 之江实验室 分离式调控角度漂移与位置漂移的激光束指向稳定装置
KR102793341B1 (ko) * 2020-05-21 2025-04-09 삼성디스플레이 주식회사 레이저 장치
US12403548B2 (en) * 2020-08-19 2025-09-02 Panasonic Intellectual Property Management Co., Ltd. Laser processing apparatus and laser processing method
CN113178767A (zh) * 2021-05-28 2021-07-27 北京同方华光系统科技有限公司 一种多光束多维度扫描的激光杀毒杀菌装置和方法
WO2023129925A1 (en) * 2021-12-29 2023-07-06 Milwaukee Electric Tool Corporation Laser level with internal adjustable platform
DE112022004570T5 (de) 2021-12-29 2024-07-18 Milwaukee Electric Tool Corporation Lasernivellier mit innerer verstellbarer plattform
CN115266650A (zh) * 2022-09-30 2022-11-01 安徽创谱仪器科技有限公司 一种分光光度计系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3657707A (en) * 1969-03-17 1972-04-18 Precision Instr Co Laser recording system with both surface defect and data error checking
US3655268A (en) * 1970-06-01 1972-04-11 Sylvania Electric Prod Laser beam attenuator
US4547651A (en) 1981-05-28 1985-10-15 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus
JPS61256321A (ja) * 1985-05-10 1986-11-13 Hitachi Ltd 液晶投射型表示装置
US4775220A (en) 1987-11-23 1988-10-04 Advanced Research And Applications Corporation Optical system with laser pulse energy control
US4908493A (en) 1988-05-31 1990-03-13 Midwest Research Institute Method and apparatus for optimizing the efficiency and quality of laser material processing
US5051334A (en) 1989-04-21 1991-09-24 E. I. Du Pont De Nemours And Company Solid imaging method using photohardenable compositions containing hollow spheres
US5014207A (en) 1989-04-21 1991-05-07 E. I. Du Pont De Nemours And Company Solid imaging system
DE4106151A1 (de) * 1990-05-02 1991-11-07 Osaka Fuji Kogyo Kk Verfahren und vorrichtung zur bearbeitung metallischer oberflaechen durch laserstrahlen
US5268554A (en) * 1992-06-29 1993-12-07 General Electric Co. Apparatus and system for positioning a laser beam
JP2588281Y2 (ja) * 1992-11-25 1999-01-06 株式会社小松製作所 レーザマーキング装置
JP3179963B2 (ja) * 1994-04-26 2001-06-25 松下電器産業株式会社 レーザ加工装置とレーザ加工方法

Also Published As

Publication number Publication date
US20040007563A1 (en) 2004-01-15
US6763045B2 (en) 2004-07-13
ATE254005T1 (de) 2003-11-15
EP1246712B1 (de) 2003-11-12
DE60006586T2 (de) 2004-05-13
WO2001051244A1 (de) 2001-07-19
GB0000632D0 (en) 2000-03-01
AU7516200A (en) 2001-07-24
EP1246712A1 (de) 2002-10-09

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