DE4112857A1 - Liquid crystal display - has isolating film with projecting conduction tracks on three sides - Google Patents
Liquid crystal display - has isolating film with projecting conduction tracks on three sidesInfo
- Publication number
- DE4112857A1 DE4112857A1 DE4112857A DE4112857A DE4112857A1 DE 4112857 A1 DE4112857 A1 DE 4112857A1 DE 4112857 A DE4112857 A DE 4112857A DE 4112857 A DE4112857 A DE 4112857A DE 4112857 A1 DE4112857 A1 DE 4112857A1
- Authority
- DE
- Germany
- Prior art keywords
- cover plate
- liquid crystal
- crystal display
- film section
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 15
- 239000004020 conductor Substances 0.000 claims description 26
- 238000005516 engineering process Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nonlinear Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Die vorliegende Erfindung betrifft eine Flüssigkristall- Anzeigevorrichtung nach dem Oberbegriff des Patentantspruches 1.The present invention relates to a liquid crystal Display device according to the preamble of Patent claim 1.
Derartige Flüssigkristall-Anzeigevorrichtungen sind be reits bekannt. Die Deckplatten bestehen im allgemeinen aus Glas. Das Aufbringen von Schaltkreisen zum Betreiben und Steuern der Flüssigkristallzelle auf eine der Deckplatten erfolgt im allgemeinen mittels der TAB-Technik (tape auto matic bonding) . Das Wesen dieses bekannten Verfahrens, das auch unter dem Begriff Filmtechnik bekannt ist, besteht darin, daß ein Filmband verwendet wird, auf dem bereits IC befestigt und mit Leiterbahnen auf dem Film verschaltet sind. Von diesem Film werden dann Abschnitte so abge trennt, daß frei überstehende Leiterbahnen vorhanden sind. Der oder die IC werden dann zusammen mit dem Filmabschnitt auf der Deckplatte befestigt und die überstehenden Leiterbahnen werden dann mit Leiterbahnen auf der Deckplatte elektrisch leitend verbunden. Solche TAB-Verfahren eignen sich besonders für einen automati sierten Fertigungsablauf.Such liquid crystal display devices are already known. The cover plates generally consist of Glass. The application of circuits for operation and Control the liquid crystal cell on one of the cover plates is generally done using TAB technology (tape auto matic bonding). The essence of this known process, the is also known as film technology in that a film tape is used on which IC attached and interconnected with conductor tracks on the film are. Sections of this film are then shown separates that freely protruding conductor tracks available. The IC or IC will then be together with the film section attached to the cover plate and the protruding traces are then with traces electrically connected on the cover plate. Such TAB processes are particularly suitable for an automat production process.
Werden solche Flüssigkristallanzeigen als Teilstücke in größeren Anzeigetableaus verwendet, besteht der Wunsch, den überstehenden Bereich der einen Deckplatte möglichst klein zu machen, damit der Abstand zwischen den einzelnen Anzeigeteilstücken nicht störend groß wird.Are such liquid crystal displays as sections in larger display panels, there is a desire to the protruding area of one cover plate if possible to make small so the distance between each Display sections is not disturbingly large.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, bei einer Flüssigkristall-Anzeigevorrichtung der eingangs ge nannten Art eine raumsparende und einfach zu beherrschende Anordnung und Verschaltung eines nach einem TAB-Verfahren aufgebrachten IC anzugeben.The present invention is based on the object a liquid crystal display device of the introduction called a space-saving and easy to control Arrangement and interconnection of a TAB method to indicate applied IC.
Diese Aufgabe wird durch die im Kennzeichen des Pa tentanspruches 1 angegebenen Merkmale gelöst.This task is carried out by the Pa Tent claim 1 specified features solved.
Die beschriebene Anordnung der IC und deren Verschaltung auf dem Filmabschnitt ermöglicht eine einfache Führung der Versorgungsleiterbahnen auf dem überstehenden Teil der Deckplatte bei gleichzeitig geringem Platzbedarf. Insbe sondere wird eine möglichst schmale Ausbildung der über stehenden Teils der Deckplatte ermöglicht. Es wird weiter hin eine überkreuzungsfreie Führung der Leiterbahnen ermöglicht, so daß zusätzliche Arbeitsschritte zum Aufbringen von Isolierschichten entfallen können.The described arrangement of the IC and its wiring on the film section allows easy guidance of the Supply conductor tracks on the protruding part of the Cover plate with a small footprint. In particular special is the narrowest possible training of the standing part of the cover plate allows. It will continue towards a crossover-free routing of the conductor tracks enables so that additional steps to Application of insulating layers can be omitted.
Anhand des in den Fig. 1 und 2 schematisch dargestell ten Ausführungsbeispiels wird die Erfindung nachfolgend näher erläutert.Based on the schematically shown in FIGS. 1 and 2 exemplary embodiment, the invention is explained in more detail below.
Die Fig. 1 zeigt eine Aufsicht und die Fig. 2 einen Querschnitt eines Teils eines erfindungsgemäßen Ausfüh rungsbeispiels. Fig. 1 shows a plan view and Fig. 2 shows a cross section of a portion of an exemplary embodiment according to the invention.
Der optisch aktive Teil der FK-Anzeige besteht aus den beiden gläsernen Deckplatten 1 und 2 zwischen welchen sich in an sich bekannter Weise eine dünne Schicht des Flüs sigkristallmaterials befindet. Eine im Umfangsbereich der kleineren Deckplatte vorgesehene Dichtnaht 7 schließt das Flüssigkristallmaterial in bekannter Weise ein.The optically active part of the LC display consists of the two glass cover plates 1 and 2 between which there is a thin layer of the liquid crystal material in a manner known per se. A sealing seam 7 provided in the peripheral region of the smaller cover plate encloses the liquid crystal material in a known manner.
Die eine Deckplatte 1 ist größer als die Deckplatte 2. Auf ihrem überstehenden streifenförmigen Teil befinden sich Leiterbahnen die mit darauf befindlichen IC 3 verschaltet sind. Die IC 3 sind in bekannter Weise im TAB-Verfahren aufgebracht unter Verwendung eines Filmabschnitts 4 aus isolierendem Material. Dieser Filmabschnitt weist eben falls Leiterbahnen auf, die einerseits mit dem IC 3 kon taktiert sind und andererseits in frei überstehenden Lei terbahnen-Enden 5 enden, die wiederum mit Leiterbahnen auf der Deckplatte 1 elektrisch leitend verbunden sind, z. B. durch Löten oder Kleben mit leitfähigem Kleber.The one cover plate 1 is larger than the cover plate 2 . On its protruding strip-shaped part there are conductor tracks which are connected to the IC 3 located thereon. The IC 3 are applied in a known manner in the TAB process using a film section 4 made of insulating material. This film section also has conductor tracks, which are clocked on the one hand with the IC 3 and, on the other hand, end in freely protruding conductor tracks ends 5 , which are in turn electrically connected to conductor tracks on the cover plate 1 , for. B. by soldering or gluing with conductive adhesive.
Überstehende Leiterbahnen-Enden 5 des Filmabschnitts be finden sich nur auf drei Seiten des Filmabschnitts 4. Die der freien Kante 8 der Deckplatte 1 parallel zugewandte Kante 6 des Filmabschnitts 4 weist keine überstehende Leiterbahnen-Enden 5 auf, was durch entsprechende Führung der Leiterbahnen auf dem Filmabschnitt erreicht ist. Des weiteren ist eine der beiden gegenüberliegenden Seiten 9, 10, bei dem dargestellten Ausführungsbeispiel die Seite 10, die in etwa senkrecht zu der freien Kante 8 der Deck platte 1 verläuft nur zum Teil mit frei überstehenden Lei terbahnen-Enden 5 versehen. Ein Bereich 11 von der Breite X ist frei gelassen, d. h. er weist keine überstehenden Leiterbahnen-Enden auf.Protruding conductor ends 5 of the film section be found only on three sides of the film section 4th The edge 6 of the film section 4 facing the free edge 8 of the cover plate 1 in parallel does not have any protruding conductor track ends 5 , which is achieved by correspondingly guiding the conductor tracks on the film section. Furthermore, one of the two opposite sides 9 , 10 , in the illustrated embodiment, the side 10 , which runs approximately perpendicular to the free edge 8 of the cover plate 1 only partially with free protruding Lei terbahnen ends 5 . A region 11 of width X is left free, ie it has no protruding conductor track ends.
In diesem Bereich 11 verlaufen auf dem überstehenden Teil der Deckplatte 1 die Versorgungsleiterbahnen 12 für die IC. Die Breite X des freien Bereichs 11 ist derart ge wählt, daß er der FormelIn this area 11 , the supply conductor tracks 12 for the IC run on the protruding part of the cover plate 1 . The width X of the free area 11 is selected such that it has the formula
X = n × pX = n × p
entspricht, wobei n die Anzahl der Versorgungsleitungen 12 und p das Rastermaß der Leiterbahnen 12 (Entfernung von Mitte Leiterbahn zu Mitte der benachbarten Leiterbahn) ist. Die Versorgungsleitungen 12 verlaufen in diesem Bereich im wesentlichen parallel zur freien Kante 8 der Deckplatte 1. Dieser freie Bereich 11 des Filmabschnitts 3 befindet sich der freien Kante 8 zugewandt, d. h. der Kante 7 der Deckplatte 2 abgewandt. Es wird dadurch erreicht, daß die überstehenden Leiterbahnen- Enden 5 der Seite 10 überkreuzungsfrei mit Leiterbahnen auf der Deckplatte 1, die in die FK-Zelle hineinführen, kontaktiert werden können.corresponds, where n is the number of supply lines 12 and p is the pitch of the conductor tracks 12 (distance from the center of the conductor track to the center of the adjacent conductor track). In this area, the supply lines 12 run essentially parallel to the free edge 8 of the cover plate 1 . This free area 11 of the film section 3 is facing the free edge 8 , ie facing away from the edge 7 of the cover plate 2 . It is thereby achieved that the protruding conductor track ends 5 of the side 10 can be contacted without crossovers with conductor tracks on the cover plate 1 , which lead into the LC cell.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4112857A DE4112857C2 (en) | 1990-04-27 | 1991-04-19 | Liquid crystal display device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4013498 | 1990-04-27 | ||
| DE4112857A DE4112857C2 (en) | 1990-04-27 | 1991-04-19 | Liquid crystal display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE4112857A1 true DE4112857A1 (en) | 1991-11-14 |
| DE4112857C2 DE4112857C2 (en) | 1998-07-02 |
Family
ID=6405239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE4112857A Expired - Lifetime DE4112857C2 (en) | 1990-04-27 | 1991-04-19 | Liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE4112857C2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4431604A1 (en) * | 1994-09-05 | 1996-03-07 | Siemens Ag | Circuit arrangement with a chip card module and an associated coil |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3123241A1 (en) * | 1981-06-11 | 1983-01-20 | Siemens AG, 1000 Berlin und 8000 München | Method for producing a circuit module in the form of a board |
| DE3539531A1 (en) * | 1984-11-09 | 1986-05-22 | Hitachi, Ltd., Tokio/Tokyo | LIQUID CRYSTAL DISPLAY |
| GB2178231A (en) * | 1985-07-22 | 1987-02-04 | Quick Turnaround Logic Limited | Tape automatic bonding or circuitry to an electrical component |
-
1991
- 1991-04-19 DE DE4112857A patent/DE4112857C2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3123241A1 (en) * | 1981-06-11 | 1983-01-20 | Siemens AG, 1000 Berlin und 8000 München | Method for producing a circuit module in the form of a board |
| DE3539531A1 (en) * | 1984-11-09 | 1986-05-22 | Hitachi, Ltd., Tokio/Tokyo | LIQUID CRYSTAL DISPLAY |
| GB2178231A (en) * | 1985-07-22 | 1987-02-04 | Quick Turnaround Logic Limited | Tape automatic bonding or circuitry to an electrical component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4431604A1 (en) * | 1994-09-05 | 1996-03-07 | Siemens Ag | Circuit arrangement with a chip card module and an associated coil |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4112857C2 (en) | 1998-07-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8120 | Willingness to grant licences paragraph 23 | ||
| 8110 | Request for examination paragraph 44 | ||
| 8125 | Change of the main classification |
Ipc: G02F 1/1345 |
|
| 8127 | New person/name/address of the applicant |
Owner name: AEG GESELLSCHAFT FUER MODERNE INFORMATIONSSYSTEME |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| R071 | Expiry of right |