DE4038587A1 - Conveyor system for flat substrates - transports by liq. film flow along surface e.g. for handling at various work-stations - Google Patents
Conveyor system for flat substrates - transports by liq. film flow along surface e.g. for handling at various work-stationsInfo
- Publication number
- DE4038587A1 DE4038587A1 DE4038587A DE4038587A DE4038587A1 DE 4038587 A1 DE4038587 A1 DE 4038587A1 DE 4038587 A DE4038587 A DE 4038587A DE 4038587 A DE4038587 A DE 4038587A DE 4038587 A1 DE4038587 A1 DE 4038587A1
- Authority
- DE
- Germany
- Prior art keywords
- plate
- liquid
- transport device
- liq
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 37
- 230000032258 transport Effects 0.000 title description 24
- 239000007788 liquid Substances 0.000 claims description 37
- 238000001914 filtration Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000010408 film Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000011282 treatment Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Die Erfindung betrifft eine Transportvorrichtung für vorzugsweise flache Substrate. Eine solche Transportvorrichtung kann vorzugsweise innerhalb und zwischen Behandlungsanlagen für flache Substrate angewendet werden. Sie ist besonders in solchen Behandlungsanlagen von Vorteil, in denen hochreine nasse Prozesse unter Verwendung von Wasser, insbesondere hochreinem Wasser, oder flüssigen Chemikalien an solchen Substraten ablaufen. Dabei ist es meist wichtig, daß die Substratoberflächen zu keinem Zeitpunkt abtrocknen, da dadurch die Oberflächenreinheit der Substrate eingeschränkt werden könnte.The invention relates to a transport device for preferably flat substrates. Such a transport device can preferably inside and between treatment plants be used for flat substrates. It is special advantageous in treatment plants where high purity wet processes using water, in particular high-purity water, or liquid chemicals on such Run off substrates. It is usually important that the Do not dry substrate surfaces at any time because this limits the surface cleanliness of the substrates could be.
Außerdem müssen die Transportvorgänge so ablaufen, daß die Substrate dabei weder erschüttert noch verschmutzt werden.In addition, the transport operations must take place in such a way that the substrates are neither shaken nor dirty will.
Eine Aufgabe der Erfindung wird deshalb darin gesehen, die bekannten Transportvorrichtungen dieser Art im Hinblick auf die vorgenannten Kriterien zu verbessern.An object of the invention is therefore seen in the known transport devices of this type in view to improve on the aforementioned criteria.
Nach der Erfindung wird diese Aufgabe bei einer eingangs genannten Transportvorrichtung dadurch gelöst, daß die Substrate auf einem Flüssigkeitsfilm getragen und entlang dessen Strömung transportiert werden.According to the invention, this object is at the beginning mentioned transport device solved in that the Substrates carried on a liquid film and along whose flow is transported.
Dabei geht man mit besonderem Vorteil so vor, daß die Flüssigkeit von unten durch schräge Öffnungen in einer Platte nach oben strömt, auf die Oberfläche der Platte ausströmt und dort einen im wesentlichen gleichförmigen Film bildet, der in Richtung der Steigung dieser Öffnungen auf der Platte entlangströmt.It is particularly advantageous to proceed in such a way that the liquid from below through slanted openings in a plate flows above, flows onto the surface of the plate and forms a substantially uniform film there, the direction of the slope of these openings on the plate flows along.
Mit besonderem Vorteil werden die schrägen Bohrungen in der Platte von einem Raum oder einer Mehrzahl von Räumen unterhalb der Platte mit Flüssigkeit versorgt, wobei dieser Raum oder diese Räume mit einem entsprechenden Flüssigkeitsdruck beaufschlagt sind.The inclined bores in the plate of one room or a plurality of rooms supplied with liquid below the plate, this Room or these rooms with an appropriate fluid pressure are acted upon.
Mit besonderem Vorteil werden ferner entlang der gelochten Platte seitliche Kanten oder dergleichen vorgesehen, die zusammen mit der Platte eine Art Rinne bilden, innerhalb deren das Substrat während seiner - vorzugsweise horizontalen - Bewegung sicher geführt wird. Diese seitlichen Kanten werden mit besonderem Vorteil nicht vollkommen geschlossen ausgebildet, so daß die Flüssigkeit durch sie hindurch in eine geeignete Auffangrinne oder dergleichen abströmen kann, ohne daß die Funktion der seitlichen Kanten als Führungen eingeschränkt wird.With particular advantage are also punched along the Plate side edges or the like provided that form a kind of gutter together with the plate, inside whose the substrate during its - preferably horizontal - Movement is performed safely. These side edges will be with particular advantage not being completely closed, so that the liquid passes through it into a suitable one Drainage channel or the like can flow out without limited the function of the side edges as guides becomes.
Weiterhin hat es sich als besonders vorteilhaft erwiesen, die Substrate während des Transportvorgangs zusätzlich mit derselben Flüssigkeit, die den Flüssigkeitsfilm bildet, von oben zu besprühen, da dadurch an jedem Punkt der Substratoberfläche eine Trocknung verhindert wird.Furthermore, it has proven to be particularly advantageous the substrates during the transport process with the same liquid that forms the liquid film, to be sprayed from above, as this means that at every point on the substrate surface drying is prevented.
Weitere Einzelheiten und vorteilhafte Weiterbildungen der Erfindung ergeben sich aus dem im folgenden beschriebenen und in der Zeichnung dargestellten Ausführungsbeispiel, sowie aus den Unteransprüchen. Es zeigt:Further details and advantageous developments of the Invention result from that described below and the embodiment shown in the drawing, as well as from the subclaims. It shows:
Fig. 1 eine perspektivische Darstellung eines Teilstücks einer erfindungsgemäßen Transportvorrichtung, teilweise im Schnitt dargestellt; auf der Transportvorrichtung ist ein Substrat dargestellt, das gerade transportiert wird, Figure 1 is a perspective view of a portion of a transport device according to the invention, partially shown in section. a substrate is shown on the transport device which is currently being transported,
Fig. 2 einen Längsschnitt durch die Transportvorrichtung der Fig. 1, Fig. 2 is a longitudinal section through the transport device of Fig. 1,
Fig. 3 einen Querschnitt durch die Transportvorrichtung der Fig. 1, Fig. 3 shows a cross section through the transport device of Fig. 1,
Fig. 4 eine vergrößerte Einzelheit der Darstellung nach Fig. 2, mit zusätzlichen Informationen zum Steigungs winkel der Plattenöffnungen, und Fig. 4 is an enlarged detail of the illustration of FIG. 2, with additional information on the slope angle of the plate openings, and
Fig. 5 ein Schema einer Filtrations-Rückführungseinheit für die bei der Transportvorrichtung verwendete Flüssig keit. Fig. 5 is a diagram of a filtration return unit for the liquid used in the transport speed.
In Fig. 1 ist ein Teilstück einer erfindungsgemäßen Transportvorrichtung 10 perspektivisch dargestellt. Fig. 2 zeigt einen Längsschnitt durch diese Vorrichtung 10 etwa in deren Mitte, und Fig. 3 einen Querschnitt durch die Vorrichtung 10.In Fig. 1, a portion of a transport device 10 according to the invention is shown in perspective. FIG. 2 shows a longitudinal section through this device 10 approximately in the middle thereof, and FIG. 3 shows a cross section through the device 10 .
Beispielsweise in der Halbleitertechnik müssen Substrate, typisch in Form von flachen Scheiben (vgl. die Scheibe 16 der Fig. 1), zwischen verschiedenen Stellen einer Anlage transportiert werden. Solche Scheiben 16 können z. B. aus Silizium bestehen und haben heute typisch einen Durchmesser von 200 mm, doch kann dieser Durchmesser auch größer sein und z. B. 300 mm betragen.For example, in semiconductor technology, substrates, typically in the form of flat disks (cf. disk 16 in FIG. 1), have to be transported between different locations in a system. Such discs 16 can, for. B. consist of silicon and today typically have a diameter of 200 mm, but this diameter can also be larger and z. B. 300 mm.
Bei der Fertigung werden solche Substrate 16 Naßbehandlungen unterzogen. Sie werden z. B. gereinigt oder geätzt, und sie müssen zwischen den Stellen transportiert werden, an denen solche Naßbehandlungen erfolgen. Dabei ist es meistens wichtig, daß hierbei die Oberflächen dieser Substrate 16 zu keinem Zeitpunkt abtrocknen, da hierdurch die Reinheit der Oberflächen dieser Substrate verringert würde. Eine erfindungsgemäße Transportvorrichtung 10 dient also bevorzugt zum Transport im Bereich solcher Naßbehandlungen.Such substrates are subjected to 16 wet treatments during manufacture. You will e.g. B. cleaned or etched, and they must be transported between the locations where such wet treatments take place. It is usually important that the surfaces of these substrates 16 do not dry at any time, since this would reduce the cleanliness of the surfaces of these substrates. A transport device 10 according to the invention therefore preferably serves for transport in the area of such wet treatments.
Die dargestellte Transportvorrichtung 10 weist eine gelochte Platte 11 auf. Diese hat eine Vielzahl von schrägen Bohrungen 12 mit jeweils gleichen Durchmessern, z. B. von wenigen Millimetern. Diese Bohrungen 12 sind in einem gleichmäßigen Raster in der Platte 11 angeordnet, z. B. mit einem Abstand von einigen Millimetern voneinander. Unterhalb der Platte 11 ist ein Raum 13 vorgesehen, der im Betrieb der Transportvorrichtung 10 mit einer geeigneten Flüssigkeit unter Überdruck gefüllt wird. Dieser Raum 13 ist mit Anschlußvorrichtungen 14 versehen, an welche Schläuche oder Rohre angeschlossen werden, die diesen Raum 13 mit unter Druck stehender Flüssigkeit versorgen. Durch den im Raum 13 dann herrschenden Oberdruck wird die Flüssigkeit durch die Bohrungen 12 hindurchgedrückt, tritt an der Oberseite der Platte 11 aus diesen Bohrungen 12 aus und formt auf der Oberseite der Platte 11 einen Flüssigkeitsfilm 15, der in horizontaler Richtung entlang der Oberseite der Platte 11 strömt. Statt der Bohrungen 12, oder zusätzlich zu ihnen, könnten alternativ auch entsprechende schräge Schlitze vorgesehen werden.The transport device 10 shown has a perforated plate 11 . This has a plurality of oblique bores 12 each with the same diameter, for. B. of a few millimeters. These holes 12 are arranged in a uniform grid in the plate 11 , for. B. with a distance of a few millimeters from each other. A space 13 is provided below the plate 11 , which is filled with a suitable liquid under excess pressure during operation of the transport device 10 . This space 13 is provided with connecting devices 14 , to which hoses or pipes are connected, which supply this space 13 with pressurized liquid. By the then prevailing in the space 13. Upper pressure, the liquid is forced through the bores 12 of the plate 11 comes out from these holes 12 at the top and formed on the top of the plate 11 a liquid film 15 in the horizontal direction along the top of the plate 11 flows. Instead of the bores 12 , or in addition to them, corresponding oblique slots could alternatively also be provided.
Auf dem Wasserfilm 15 und von ihm wird das Substrat 16 getragen. Die Austrittsgeschwindigkeit der Flüssigkeit aus den Bohrungen sorgt dafür, daß das Substrat 16 nicht absinkt und die Oberfläche der Platte 11 nicht berührt. Dies ist für den Transport solcher Substrate 16 wichtig, da bei Reibungen zwischen dem Substrat 16 und anderen Oberflächen Partikel entstehen, die das Substrat 16 verschmutzen. Dies führt in der Halbleiterfertigung und ähnlichen Produktionsprozessen zu einer Verschlechterung der Prozeßergebnisse und zu Ausschuß. Ein besonderer Vorteil der Erfindung liegt darin, daß das Schwimmen des Substrats 16 auf dem Wasserfilm 15 einen außerordentlich schonenden Transport gewährleistet, während dessen das Substrat 16 nur mit einem Medium in Berührung kommt, mit dem es im Zuge des Prozesses ohnehin in Berührung kommen muß. Dadurch wird die Verschmutzungsgefahr wesentlich verringert.The substrate 16 is carried on and from the water film 15 . The exit velocity of the liquid from the holes ensures that the substrate 16 does not sink and does not touch the surface of the plate 11 . This is important for the transport of such substrates 16 , since particles occur between the substrate 16 and other surfaces, which contaminate the substrate 16 . In semiconductor manufacturing and similar production processes, this leads to a deterioration in the process results and to rejects. A particular advantage of the invention is that the floating of the substrate 16 on the water film 15 ensures an extremely gentle transport, during which the substrate 16 only comes into contact with a medium with which it must come into contact in the course of the process. This significantly reduces the risk of contamination.
Die Flüssigkeit strömt nach ihrem Austritt aus den Bohrungen 12 in Form eines dünnen Filmes 15 auf der Oberfläche der Platte 11 zunächst in Richtung der Bohrungen 12 der Platte 11. Dies ist durch kleine Pfeile 17 in Fig. 2 angedeutet. Die Geschwindigkeit der Längsströmung hängt u. a. von dem Steigungswinkel alpha der Bohrungen 12 in der Platte 11 ab. Dieser Steigungswinkel alpha (Fig. 4) kann dem Anwendungsfall angepaßt werden und damit etwa zwischen wenig über 0° (sehr flache Steigung, hohe Strömungsgeschwindigkeit in Längsrichtung der Platte 11) und 90° (sehr steile Steigung, keine Geschwindigkeit in Richtung der Plattenlängsachse) variieren. In den Fig. 2 und 4 ist beispielhaft eine Steigung alpha von etwa 45° dargestellt. Die Flüssigkeit strömt durch seitliche Rinnen 18 wieder von der Platte 11 ab. Deshalb strömt der Flüssigkeitsfilm insgesamt leicht schräg über die Platte 11, wie das durch die Pfeile 19 in Fig. 1 angedeutet ist.After emerging from the bores 12 in the form of a thin film 15 on the surface of the plate 11 , the liquid initially flows in the direction of the bores 12 of the plate 11 . This is indicated by small arrows 17 in Fig. 2. The speed of the longitudinal flow depends, among other things, on the pitch angle alpha of the bores 12 in the plate 11 . This angle of inclination alpha ( FIG. 4) can be adapted to the application and thus vary between a little over 0 ° (very flat gradient, high flow velocity in the longitudinal direction of the plate 11 ) and 90 ° (very steep gradient, no speed in the direction of the longitudinal axis of the plate) . In FIGS. 2 and 4, a slope alpha of approximately 45 ° is shown by way of example. The liquid flows out of the plate 11 again through lateral channels 18 . Therefore, the liquid film overall flows slightly obliquely over the plate 11 , as indicated by the arrows 19 in FIG. 1.
Für die Transportrichtung des Substrats 16 ist jedoch ausschließlich die Bewegungskomponente der Flüssigkeit in Längsrichtung der Platte 11 verantwortlich. Die seitlichen Komponenten heben sich im wesentlichen auf, da die Flüssigkeit etwa zu gleichen Teilen nach rechts und nach links von der Platte 11 abströmt. Das Substrat 16 bewegt sich deshalb in Richtung des in den Fig. 1 und 2 dargestellten Pfeiles 22. Zusätzlich sind kleine seitliche Kanten 20 als Führungen entlang der Platte 11 angebracht, die das Substrat 16 auf der Platte 11 führen, auch wenn es seitlich abdriften sollte. Diese seitlichen Kanten 20 sind in Fig. 1 nicht durchgehend, sondern in Form von Zinnen, ähnlich denen einer Burg, dargestellt, wobei diese Zinnen zwischen sich weniger hohe Lücken 20′ haben, durch welche die Flüssigkeit - nach Art eines Wehrs - in die seitlichen Rinnen 18 abströmen kann. Diese Flüssigkeitsdurchlässigkeit kann jedoch beispielsweise auch dadurch realisiert werden, daß in den seitlichen Kanten 20 entsprechende Löcher (nicht dargestellt) vorgesehen werden.However, the movement component of the liquid in the longitudinal direction of the plate 11 is solely responsible for the transport direction of the substrate 16 . The lateral components essentially cancel each other out, since the liquid flows off to the right and left of the plate 11 in approximately equal proportions. The substrate 16 therefore moves in the direction of the arrow 22 shown in FIGS . 1 and 2. In addition, small lateral edges 20 are attached as guides along the plate 11 , which guide the substrate 16 on the plate 11 , even if it should drift laterally. These side edges 20 are not continuous in Fig. 1, but in the form of battlements, similar to those of a castle, which battlements have less high gaps 20 'between them, through which the liquid - in the manner of a weir - into the side Can flow out channels 18 . However, this liquid permeability can also be achieved, for example, by providing corresponding holes (not shown) in the lateral edges 20 .
Für bestimmte Anwendungsfälle ist es von besonderem Vorteil, wenn das Substrat 16 während des Transportvorgangs zusätzlich von oben mit derselben Flüssigkeit besprüht wird, auf der es auch getragen wird. Dazu dienen die in den Fig. 2 und 3 dargestellten Sprühdüsen 25, die über eine Flüssigkeitsleitung 21 mit Flüssigkeit versorgt werden. Dadurch trocknet das Substrat 16 während des Transportvorgangs an keiner Stelle seiner Oberfläche. Dies kann beispielsweise zwischen den verschiedenen Behandlungsschritten innerhalb eines Reinigungsprozesses von entscheidender Bedeutung für das Reinigungsergebnis sein. Sobald nämlich eine Oberfläche des Substrats 16 unkontrolliert abtrocknet, haften die zuvor in dem Flüssigkeitsfilm enthaltenden Partikel mit großer Kraft auf dieser Oberfläche fest und verschlechtern dadurch das Reinigungsergebnis.For certain applications, it is particularly advantageous if the substrate 16 is additionally sprayed from above with the same liquid during which it is carried. The spray nozzles 25 shown in FIGS . 2 and 3 are used for this purpose and are supplied with liquid via a liquid line 21 . As a result, the substrate 16 does not dry at any point on its surface during the transport process. For example, this can be of crucial importance for the cleaning result between the different treatment steps within a cleaning process. As soon as a surface of the substrate 16 dries in an uncontrolled manner, the particles previously contained in the liquid film adhere firmly to this surface with great force and thereby worsen the cleaning result.
Eine Steigerung sowohl der Wirtschaftlichkeit als auch der Reinheit des Transportvorgangs ist erreichbar, indem die verwendete Flüssigkeit nach dem Abströmen von der Platte 11 durch einen geeigneten Filter geleitet und anschließend der Transportvorrichtung 10, d. h. dem Raum 13 unterhalb der Platte 11, wieder zugeführt wird. Eine entsprechende Anordnung ist beispielhaft in Fig. 5 dargestellt. Dabei wird die Flüssigkeit aus den seitlichen Ablaufrinnen 18 über Leitungen 26 einer Pumpe 23 zugeführt und von dort durch einen Partikelfilter 24 wieder in den Raum 13 gepumpt. Dadurch wird diese Flüssigkeit ständig gereinigt, und eine sehr hohe Reinheit des Transportvorgangs wird gesichert. Als Flüssigkeit wird gewöhnlich deionisiertes Wasser verwendet, doch sind auch andere Flüssigkeiten nicht ausgeschlossen.An increase in both the economy and the purity of the transport process can be achieved by passing the liquid used after flowing out of the plate 11 through a suitable filter and then feeding it back to the transport device 10 , ie the space 13 below the plate 11 . A corresponding arrangement is shown by way of example in FIG. 5. The liquid is fed from the side drainage channels 18 to a pump 23 via lines 26 and from there is pumped back into the room 13 through a particle filter 24 . As a result, this liquid is constantly cleaned and a very high level of purity of the transport process is ensured. Deionized water is commonly used as the liquid, but other liquids are not excluded.
Naturgemäß sind im Rahmen der Erfindung vielfache Abwandlungen und Modifikationen möglich.Naturally, multiple modifications are within the scope of the invention and modifications possible.
Claims (11)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4038587A DE4038587A1 (en) | 1990-12-04 | 1990-12-04 | Conveyor system for flat substrates - transports by liq. film flow along surface e.g. for handling at various work-stations |
| DE19904039313 DE4039313A1 (en) | 1990-12-04 | 1990-12-10 | Semiconductor wafer transport device - passes fluid film across surface of transport plate in required transport direction within and between handling stations |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4038587A DE4038587A1 (en) | 1990-12-04 | 1990-12-04 | Conveyor system for flat substrates - transports by liq. film flow along surface e.g. for handling at various work-stations |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE4038587A1 true DE4038587A1 (en) | 1992-06-11 |
Family
ID=6419532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE4038587A Withdrawn DE4038587A1 (en) | 1990-12-04 | 1990-12-04 | Conveyor system for flat substrates - transports by liq. film flow along surface e.g. for handling at various work-stations |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE4038587A1 (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE29517588U1 (en) * | 1995-11-06 | 1996-02-08 | Cimatec GmbH Produkte für Leiterplatten, 67292 Kirchheimbolanden | Machine for the liquid treatment of objects, in particular circuit boards in the production of printed circuit boards |
| EP0970899A1 (en) * | 1998-07-07 | 2000-01-12 | Angewandte Solarenergie - ASE GmbH | Method and device for processing articles, especially slice-shaped articles like plates, glaspanes, circuit boards, ceramic substrates |
| EP1734574A1 (en) * | 2005-06-15 | 2006-12-20 | Lam Research Corporation | Method and apparatus for transporting a substrate using non-newtonian fluid |
| US7441299B2 (en) | 2003-12-23 | 2008-10-28 | Lam Research Corporation | Apparatuses and methods for cleaning a substrate |
| US7737097B2 (en) | 2003-06-27 | 2010-06-15 | Lam Research Corporation | Method for removing contamination from a substrate and for making a cleaning solution |
| US7799141B2 (en) | 2003-06-27 | 2010-09-21 | Lam Research Corporation | Method and system for using a two-phases substrate cleaning compound |
| US7862662B2 (en) | 2005-12-30 | 2011-01-04 | Lam Research Corporation | Method and material for cleaning a substrate |
| US7897213B2 (en) | 2007-02-08 | 2011-03-01 | Lam Research Corporation | Methods for contained chemical surface treatment |
| US7913703B1 (en) | 2003-06-27 | 2011-03-29 | Lam Research Corporation | Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate |
| US8043441B2 (en) | 2005-06-15 | 2011-10-25 | Lam Research Corporation | Method and apparatus for cleaning a substrate using non-Newtonian fluids |
| US8316866B2 (en) | 2003-06-27 | 2012-11-27 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
| US8388762B2 (en) | 2007-05-02 | 2013-03-05 | Lam Research Corporation | Substrate cleaning technique employing multi-phase solution |
| US8475599B2 (en) | 2005-12-30 | 2013-07-02 | Lam Research Corporation | Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutions |
| US8480810B2 (en) | 2005-12-30 | 2013-07-09 | Lam Research Corporation | Method and apparatus for particle removal |
| US8522799B2 (en) | 2005-12-30 | 2013-09-03 | Lam Research Corporation | Apparatus and system for cleaning a substrate |
| US8522801B2 (en) | 2003-06-27 | 2013-09-03 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
| US8758522B2 (en) | 2007-12-14 | 2014-06-24 | Lam Research Corporation | Method and apparatus for removing contaminants from substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3717381A (en) * | 1969-07-25 | 1973-02-20 | Texas Instruments Inc | Transporting and positioning system |
| GB1358513A (en) * | 1971-06-01 | 1974-07-03 | Ibm | Pneumatic transport system for flat objects |
| DE8804814U1 (en) * | 1988-04-13 | 1988-06-01 | Caprice Schuhproduktion GmbH, 66955 Pirmasens | Device for coating small parts |
| EP0287838A2 (en) * | 1987-03-31 | 1988-10-26 | Fujitsu Limited | An apparatus for transporting an electrically conductive wafer |
| EP0305260A1 (en) * | 1987-08-11 | 1989-03-01 | Commissariat à l'Energie Atomique | Conveying device for stackable plates in cassettes |
-
1990
- 1990-12-04 DE DE4038587A patent/DE4038587A1/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3717381A (en) * | 1969-07-25 | 1973-02-20 | Texas Instruments Inc | Transporting and positioning system |
| GB1358513A (en) * | 1971-06-01 | 1974-07-03 | Ibm | Pneumatic transport system for flat objects |
| EP0287838A2 (en) * | 1987-03-31 | 1988-10-26 | Fujitsu Limited | An apparatus for transporting an electrically conductive wafer |
| EP0305260A1 (en) * | 1987-08-11 | 1989-03-01 | Commissariat à l'Energie Atomique | Conveying device for stackable plates in cassettes |
| DE8804814U1 (en) * | 1988-04-13 | 1988-06-01 | Caprice Schuhproduktion GmbH, 66955 Pirmasens | Device for coating small parts |
Non-Patent Citations (5)
| Title |
|---|
| HASSAN, J.K.: A New Air Film Technique for Low Contact Handling of Silicon Wafers. In: Solid State Technology, April 1980, Nr.4, S.148-155 * |
| KEHAGIOGLOU, T. * |
| LONSER, D.E.: Air conveyor wafer transport. In: IBM Technical Disclosure Bulletin, Vol.17, No.8, Jan. 1975, S.2319-20 * |
| PAIVANAS, J.A. * |
| US-Z.: IBM, Technical Disclosure Bulletin, Vol.17,Nr.8, Jan. 75, S.2319/2330 * |
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| EP0970899A1 (en) * | 1998-07-07 | 2000-01-12 | Angewandte Solarenergie - ASE GmbH | Method and device for processing articles, especially slice-shaped articles like plates, glaspanes, circuit boards, ceramic substrates |
| US6306224B1 (en) | 1998-07-07 | 2001-10-23 | Angewandte Solarenergie-Ase Gmbh | Process and device for treatment of sheet objects in a liquid bath |
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| US8043441B2 (en) | 2005-06-15 | 2011-10-25 | Lam Research Corporation | Method and apparatus for cleaning a substrate using non-Newtonian fluids |
| US7416370B2 (en) | 2005-06-15 | 2008-08-26 | Lam Research Corporation | Method and apparatus for transporting a substrate using non-Newtonian fluid |
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| US7897213B2 (en) | 2007-02-08 | 2011-03-01 | Lam Research Corporation | Methods for contained chemical surface treatment |
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| US8758522B2 (en) | 2007-12-14 | 2014-06-24 | Lam Research Corporation | Method and apparatus for removing contaminants from substrate |
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