DE4022829A1 - Electronic memory card - with connection leads aiding fixing of chip onto card - Google Patents

Abstract

A memory card (e.g. cheque card, telephone card, store card, access card, credit card or identity card) has an electronic memory, an IC and surface contact areas, the novelty being that the contact areas (11) are spaced from the electronic portion, esp. a surface-mounted chip (13) but are connected to the electronic portion by connection lines (12,15) which extend along the card surface and which contribute to mechanical fixing of the electronic portion onto the card (10). The card consists of copper plated plastics (epoxy resin) the chip (13) is surrounded by cast plastics in a card window opening (16) and the cast plastics also forms a handling portion of the card. ADVANTAGE - The card has a simple structure, is inexpensive to mfr. has high reliability and is resistant to loosening of the chip.

Description

"State of the art"

The invention is based on a portable memory Card according to the preamble of claim 1.

Such portable memory cards, usually the form of a check card, a phone card or the like are widely known and in use, since it has proven practical, buying processes or other payments, especially with tele telephone, refueling u. to do so, that such memory cards with externally accessible electrical contact fields used and in inclusion openings of assigned devices and machines leads, then a corresponding amount is debited from the memory card. this happens usually in that the memory content, the  can correspond to a certain amount of money becomes. Such a memory card can be designed in this way be that after debiting the last available Amount can be thrown away because the memory over cannot be set again or should.

In a known memory card of this type (EP-01 28 822-B1) is an integrated circuit provided, which also includes a memory and on a first side of an insulating substrate in Form of a module pill is stored. On the other Suitable metal are on the side of this substrate lized contact fields via electrical connec cables with the connection areas of the electro African module are connected, so that there is a one lumpiness of the electronic module with substrate and electrical contact fields on the other side results. Such a unit has a thickness, which is necessarily less than the thickness of the Card that it must take up and the connection of the Module with the card can then be done as in of the above publication explained in detail; you soften areas of the card and press the module so in the map material that the contact areas side of the module more or less flush with the ent speaking card surface.

By softening those to be joined together Materials of the outer contact fields, the Spei cher and the integrated circuit Kon tact pill insert on the substrate and the map size  terials you also get a kind of "rivet connection", by softening card plastic through breakthrough flows in the substrate area and thus the entire module anchored even better in the material. On the other hand however, these measures also immediately show a problem matics with such an embedding of the contact surface module, namely the only one sufficient connection with the elastic card base material, which often leads to example if the card is subjected to bending stress, the module comes loose or there is a contact surface separation is coming. Indeed, there is between the flush contact area of the module with memory and integrated circuit and the actual map surface with your fingertips noticeable gap or a transition edge through the whole module is embedded and not is avoidable.

Another problem is the manufacture of the electri connections between the actual electrical module, i.e. the pill on the one hand and the con tact areas on the other hand, what in the well-known script is proposed according to EP-01 28 822-B1, this Connections either before the thermally assisted Sink the module into the map material or then make appropriate contact connections deliver, being in a comparatively complicated way in the support, which on the one hand has a bil of the contact fields scratched metallic layer has central and peripheral windows and one of the contact fields one of the  peripheral window and facing the memory and the pill containing the integrated circuit Area of the central window of the support is arranged. You can then have a first end of a verb Attach the wire to each terminal of the pill gen and then the wire through one of the named ten peripheral window so that it with his on the other end at the exposed electrical Contact field of the substrate can be attached. These Steps are taken after the module is in the material mentioned by the thermal softening it has been introduced. These electrical, otherwise made of extremely thin wires Contact connections cannot be mechanical Serve to fix the pill; on the other hand, they pose is a particularly complicated measure for the module, its thickness together with the substrate and the envelope in any case, it is generally smaller than the thickness the card is, with the required "inner" ver wire to provide the pill and the inside of it contained memory via the outer contact fields is responsive at all.

In contrast, the invention is based on the object to design such a portable memory card that special simplicity in structure and knockout very cheap to manufacture to a strapa dainty memory card that connect a high Reliability and where the Ge there is a loosening between the elec tronic building block and the map material comes.  

Advantages of the invention

The invention solves this problem with the mark the features of claim 1 and has the advantage that the electronic structure containing the memory stone, by the way of any, also cost favorable form and structure can be spatially separated and in any case not on one level, in this respect lying below the contact fields, in the map and is brought. The thickness of the electro plays African building block only a subordinate role; he can also be thicker than the map itself, since it can now be in a location that anyway not in the slot of the match the device or unit is introduced. Through this separate positioning of the contact fields on the one hand it is also an electronic component possible, the contact fields the respective requirements to train and arrange accordingly.

In particular, the ge is simplified in this way entire map structure considerably, since it is also not necessary dig, the respective connecting elements, the one particularly critical and sensitive area of a represent such a contact field / electronic module in the extremely thin, just the thickness of the card level and in the intermediate area between the To arrange contact fields and the electronics pill, but it is now possible to make these connections over the map surface or inside the Guide the card in the longitudinal direction to this.  

Such a basic concept is a multitude of advantageous embodiments accessible.

For example, it is possible to use the card itself in a one-piece construction in the manner of a so-called and to produce a well-known printed circuit board for example from a suitable rigid plastic base material with an inseparable on it brought copper cladding, like this for assembly electrical components on printed circuit boards is widely known in itself. Such Print memory card can then also from a suitable solid and unbreakable plastic base material rial such as epoxy resin, on wel ches plate-shaped material with the desired then the copper cladding is applied.

Based on this configuration, the Kon tactical area then not necessary due to etching away Licher copper cladding areas, where the contact connections, i.e. the electrical connections final "wire connections" also simultaneously from when etching left copper compounds or Copper bars are noticed - this is also at the production of printed circuit boards and assembly known.

This then enables a further configuration in the The area of the memory card that consists of the Chip module, i.e. the electronic component as it is mainly to be mentioned in the following, the  the integrated circuit, the memory elements and contains other wiring, a prefabricated, one-piece electronic circuit element with the required number of connecting legs, So outward, quite stable wire connection can be bonds that simply go into one the cutout, i.e. in a punched-out memory card is used.

To take the benefits one step further, can this electronic component be formed by a so-called SMD element, which in the technical term is called and an abbreviation for "Surface Moun ting device "represents an electronic circuit element, which has been used very frequently recently simplified assembly of electrical and electronic components on printed circuit boards and which has the advantage that the respective Leg no longer through pre-drilled holes the circuit board must be cumbersome, but that Simply applies the element to the printed circuit board and its connecting legs as they are away from the element lead, attached to supplied copper bars, where through immediately the electrical connections be put. The attachment is usually done through a soldering process, for example dip soldering o. The like. This is the SMD component also tear-off immediately with the respective carrier plate connected and so to speak "bombproof" at the jewei ligen carrier plate and then in the following case on the Memory card anchored.  

As an electronic component with an integrated circuit and memory comes any suitable electronic construction element in question, even those thicker than the card te are themselves, because in a further embodiment present invention the electronic component more or less in the middle and so high in its fen steraussitz in the card that he example on both sides equally far, the thickness of the Exceeding the card, survives. At this point you can then combine on both sides at the back of the card te cover and handle plates are attached, the cover electronic module and therefore against additionally protect against accidental damage - In addition, for example, to potting Synthetic resin in its intake window opening if this is considered desirable - and at the same time provide a bracket for the operator on back end of the card when the card is with her front, carrying the electronic contact plates Part in the slot of a corresponding device is inserted. Usually the operator stops the card is stuck at the back end and pulls it back after editing out. The grip plates make this process easier Significantly since it is a better attack first offer space on the card and otherwise in one Embodiment of the invention towards the user conical can be increasing so that there is a good one Handle holder for secure grasping of the card gives.

Further embodiments of the invention are the subject  additional subclaims or are subordinate to take the following description.

drawing

Embodiments of the invention are in the drawing tion and are described in the following section spelling explained in more detail. Show it

Fig. 1 is a plan view of a memory card with removed, rear cover / handle scales and removed or not yet applied top coat and

Fig. 2 shows a section through the embodiment of the memory card of Fig. 1 along the line II-II;

Fig. 3 in the cutout for better understanding the introduction and attachment of the electronic chip module in the window of the card, just in case the cutout and

FIGS. 4 and 5 a possible exporting in plan view approximate shape of an upper and a lower deck-Ab handle shell.

Description of the embodiments

The basic idea of the present invention is the external electrical con tactical field compared to the electronic, the inte circuit and the pill containing the memory separate the electrical connection  paths are the same between these two main areas timely as at least one of the fastening options training for the electronic component and on the other hand, the electrical contact fields are so safe without additional operations, such as Soften and insert a module on the surface che to attach the card that in addition to the simple basic structure of the map and ensured by this also at rauhester Treatment guaranteed reliability and robustness remains.

It is of particular importance that based on such a basic concept from now to different manufacturing mechanisms with available electronic components, ins worked especially the so-called SMD elements can be, making the map decidedly cheaper, at the same time, now achieved excellent reliability. Such Basic concept also makes it conceivable in the Card, if desired, for special purposes in addition, batteries or other energy storage to be arranged, especially in the area of the cover handle sufficient space remains for this.

In Fig. 1, the credit card according to the invention is designated 10 ; it has in the rear part, that is where the handle scales are also attached to cover the electronic component, has bilateral, stepped tapering 10 a, 10 b, so that the two, unequal handle half shells, as in Figures 4 and 5 shown can be better attached.

Fig. 1 shows the memory card 10 without a cover coating to be applied later, for example a cover varnish, so that the electrical line connections are clearly visible.

In an advantageous embodiment, the electrical, externally accessible contact fields 11 a, 11 b (the distribution is arbitrary) are shown in the front area, that is to say the right area of the memory card 10 in FIG. 1, with line connections 12 a and 12 b, which are from the contact fields 11 a, 11 b along the surface of the card run to a rear electronic component 13 which contains appropriate storage means, usually in conjunction with an integrated circuit organized depending on the structure and intended use of the memory card.

There is a particularly advantageous embodiment lying invention that the previously described, reason Additional structure is made so that one of suitable, preferably one-piece flat, also rigid base maps material of predetermined thickness, which, as in PCBs are known and also common, one extremely tight with the base plate material tete copper cladding. The base plate dimension material can be integrally formed, such as shown in the figures, and from a single layer a suitable epoxy resin; but there are laminates are also conceivable, if desired, whereby then the top layer has the copper cladding.  

Comparatively similar to the further preparation of a printed circuit board is then proceeded with the present memory card; it is made by appropriate marking and subsequent etching away of unnecessary copper cover layers, the line system ago in connection with a one-piece transition between this and the contact fields 11 a, 11 b, which are also left as copper cladding, the line connections then flat, on the cards Copper webs 12 a, 12 b lying on the surface are guided to the rear, that is to say to the left in the plane of the drawing, to the mounting location for the electronic chip module 13 .

A preferred embodiment in the production process of such a card is then that from the entire surface of the base card covering copper cladding is not necessarily removed the major part, but it can be done before, as shown in Fig. 1 in connection with the following explanation recognizable; here mean in the drawing black solid lines etching strips, from which the copper cladding is removed, so that it is only necessary to etch away copper in the area that is identified by the black lines in Fig. 1. There are, for example, in the area of the contact surface 11 a two individual contact surfaces 11 a 'and 11 a''. Then the one contact surface 11 a 'via a first remaining copper web 15 a', which lies between the two etched lines 14 , connected to the chip module 13 , while a further copper web 15 a '' the other partial contact surface 11 a '' connects to the electronics module 13 . In this way, there are relatively wide-area copper webs as with the usual printed circuit boards, which are of course extremely thin and which are guided into the area of the electronic chip module 13 .

The connection of this chip module with these conductor surfaces then takes place in contrast to the known type of mounting of the SMD scarf processing elements used here (Surfac Mounting Device) but not in that the chip module 13 is only placed on the card surface, as this may result However, a thickness that is too large results in whether such a measure is also still within the scope of the invention, but rather a window or a continuous opening 16 is punched into the card material, into which the usually rectangular or square chip, if desired, with all-round spacing if desired -Block with a given thickness is used. The connection pins of this chip module, which can originate from all sides of this and in the illustrated embodiment, for example on opposite sides as four wire connections, are then exposed to contact in the transition area on the copper conductors and can be secured by a conventional fastening gungstechnik with these both connected simultaneously and electrically contacting them, usually by a soldering process, for example dip soldering or the like. As with the other SMD circuit elements, this also results in a generally sufficient mechanical fastening of the device Chip module in addition to the electrical contacting, as can be seen without further ado, and in addition, with the larger dimensions that are possible here, a much higher level of security in the contacting and also against a possible tear-off resistance is achieved than in the previous versions known embodiments of such memory cards.

Typically, the electrical connection legs 17 of the chip module, viewed over its thickness, start approximately centrally from it, so that, as the detail enlargement of FIG. 3 shows, the legs 17 can be bent so that the chip module 13 is mechanically pressed into the window opening 16 , while the legs 17 rest on the card surface, more precisely said ge on the copper webs located at this point of the "printed circuit board coating" and can be welded; Corresponding sweat droplets are outlined in dashed lines in FIG. 3 and denoted by 18 .

It is understood that the details in the figures shown special construction also deviate from this, however throughout lying within the inventive framework can be led; of course, the elec trical contact fields are arranged differently; the Chip chip does not need in a window to sit, but can also from a deepening of the Map to be included, because by the anyway later optional handle cover still a lot number of possibilities are given regarding the  Assembly of the chip module. Instead of one, of course can preferably be used SMD circuit element other chip modules are also used, such as them earlier for assembling electronic chip Blocks on printed circuit boards with correspondingly smaller ones Dimensions were used - the only essential is the separation of the geometric positions between Contact area on the one hand and the chip component on the other on the one hand and to a lesser extent integrated training of the contact surfaces as a copper coating on a Plastic carrier surface, which then also the Possibilities of a significantly simplified manufacture line connections between the contact surfaces Chen and result in the electrical chip chip.

A first possibility for further securing the chip module 13 in its receiving opening 16 in the Kartenma material can then be that the chip-building stone surrounds with a suitable synthetic resin material, so to speak, so to speak, as this in the construction of certain PCBs for safe and on all sides protected arrangement of the electrical circuit elements is known per se; In addition to this synthetic resin coating, which is shown in dash-dot lines in Fig. 3 and is provided with the reference numeral 19 , it may be useful to pour the entire rear loading area inside the two handle half-shells shown in FIGS . 4 and 5 with synthetic resin , so that this also results in an excellent connection of the two synthetic resin shells un with each other and with the rear area of the memory card.

The cover / handle scales can be designed such that an upper, overlapping handle shell 20 is vorgese hen, which, as the top view of FIG. 4 in conjunction with the cross-sectional view of FIG. 2 shows, except for a front, tapered edge Kan te has a border 21 which is suitable for so far to the two sides and to the rear after hanging on the rear area of the memory card, but with the outer dimensions to complete the usual dimensions of a memory credit card that the second smaller cover / - Grip half-shell 22 is received by this border 21 .

Advantageously, the first size right half-shell 20 also has inner projections 23 a, 23 b on both sides, directed towards the memory card, which engage in corresponding, aligned openings 24 a, 24 b of the memory card 10 (see FIG. 1) and enforce them flush, for example, to the other side, the memory card striking at the same time with its retracted rear edge edges 10 a, 10 b on inner edge edges 25 a, 25 b of the larger cover half-shell 20 . At the inner edge 21 formed by the border 21 then lies the outer border of the second half-shell 22 .

Both half-shells are also advantageously designed so that they are seen from the right in the plane of FIG. 2 to the rear conically rising, so that good handling is offered and also sufficient distance in the cavity between these two half-shells 20 , 22nd remains, so that the thickness of the memory card can also be recorded and secured covered with a rising chip component. For this purpose, recesses 20 a, 22 a can be provided in the material of the grip half-shells 20 , 22 approximately in the middle where the chip module 13 comes to rest in the memory card 10 . All cavities, including the distances between the chip module 13 and the surrounding wall areas of the window cutout 16 in the chip card 10 and the entire cavity areas between the two handle shells can be filled with a suitable synthetic resin, which also holds the handle shells together; Another cohesion arises from the fact that in the bore 23 a ', 23 b', which are formed by the ring increases 23 a, 23 b on both sides, still pins 26 a, 26 b from the other side, ie from the engage smaller lower handle shell 22 , so that there is also a good Vorabfi xation of the two handle shells during assembly and until the plastic material hardens.

In conclusion, it is pointed out that the claims and in particular the main claim wording che of the invention without extensive knowledge of the state of technology and therefore without restrictive prejudice are. Therefore, everyone in the description, the An say and the features shown in the drawing probably individually as well as in any combination be essential to the invention with each other.

Claims (13)

1. Portable memory card for any application, as a credit card, phone card, purchase card, access card, credit card, identity card and. Like., With an electronic memory, an integrated circuit and with external contacting accessible contact fields on the card surface, characterized in that the contact fields ( 11 a, 11 a ', 11 a'', 11 b) spatially separated to electronic area are arranged and of these contact fields ( 11 a, 11 a ', 11 a'', 11 b) elec trical connecting lines ( 12 a, 12 b; 15 a', 15 a '') along the card surface to the electronic area are performed and at the same time make a contribution to the mechanical fastening of the electronic area on the memory card ( 10 ). 2. Portable memory card according to claim 1, characterized in that the electronic area is formed by an integrated circuit with memory bil denden chip module ( 13 ), which with its own connecting feet ( 17 ) at the same time elec trically contacting the supplied electrical connecting lines ( 12 a, 12 b; 15 a ′, 15 a ′ ′) is attached. 3. Portable memory card according to claim 1 or 2, characterized in that the electronic chip module is a surface-mountable electrical component (SMD = Surfac Mounting Device), which sits in a window cutout ( 16 ) of the memory card ( 10 ) and with its connecting legs ( 17 ) across the window, the electrical connection cables running on the surface are contacted and soldered to them. 4. A portable memory card according to any one of claims 1-3, characterized in that the material of the memory card ( 10 ) similar to a printed circuit board is an insoluble copper liner carrying plastic (epoxy resin) in card form and that the Kupferka schierung both the electrical contactable from the outside through surfaces Contact field of ( 11 a, 11 b; 11 a ', 11 a'') forms as well as to the chip module ( 13 ) led electrical connec tion lines, which are formed by etching away unnecessary copper areas. 5. A portable memory card according to claim 4, characterized in that the copper cladding for forming the electrical connecting lines is removed only in the area immediately surrounding the connecting lines in such a way that the planar contact surfaces ( 11 a, 11 b; 11 a ', 11 a '') starting with this one-piece Kupferver connecting webs as electrical connecting lines, which lead up to the area of the window cutout ( 16 ) for the chip module ( 13 ) and are contacted there by the connecting legs. 6. Portable memory card according to one or more of claims 1-5, characterized in that le diglich the outer contact surfaces ( 11 a, 11 b; 11 a ', 11 a'') leaving at least the card surface wearing the copper lining insulating top coat or other coating is coated. 7. Portable memory card according to one or more of claims 1-6, characterized in that the seated with all-round spacing in the window recess ( 16 ) of the memory card electronic chip module ( 13 ) from a plastic potting compound is ben. 8. A portable memory card according to any one of claims 1-7, characterized in that for further protection of the electronic chip module and / or for easy handling of the memory card of the at the rear edge of the memory card ( 10 ) seated chip module of grips ( 20 , 22 ) is surrounded, which are attached to the rear edge of the memory card, while the contact surfaces ( 11 a, 11 b; 11 a ', 11 a'') are in the front region of the memory card ( 10 ). 9. A portable memory card according to claim 8, characterized in that the combined cover / handle shells the rear edge and the chip block ( 13 ) containing window cutout ( 16 ) of the chip card from both sides are fully inserted and secured in one another. 10. A portable memory card according to claim 9, characterized characterized that the handle half shells inside filled with plastic potting compound and with each other and with the surrounding part of the store card are thereby glued. 11. A portable memory card according to claim 9 or 10, characterized in that a larger cover / handle shell ( 20 ) is provided, which with lateral edge edges cutouts ( 10 a, 10 b) of the memory card ( 10 ) in the rear area and in which the smaller cover / grip shell ( 22 ) is inserted and received within a further peripheral edge ( 21 ) from the other side. 12. A portable memory card according to any one of claims 1-11, characterized in that the two-sided cover / grip shells in the region of the thickness of the memory card exceeding chip module have inner recesses ( 20 a, 22 a) into which the chip module protrudes . 13. Portable memory card according to one or more of claims 1-12, characterized in that the two cover / handle scales ( 20 , 22 ) through a passage openings ( 24 a, 24 b) of the memory card ( 10 ) penetrating ring opening / pin connection ( 23 a, 23 b; 26 a, 26 b) are connected to one another and centered on one another.