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DE3708529A1 - Cleansing module - Google Patents

Cleansing module

Info

Publication number
DE3708529A1
DE3708529A1 DE19873708529 DE3708529A DE3708529A1 DE 3708529 A1 DE3708529 A1 DE 3708529A1 DE 19873708529 DE19873708529 DE 19873708529 DE 3708529 A DE3708529 A DE 3708529A DE 3708529 A1 DE3708529 A1 DE 3708529A1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
slot nozzle
nozzle
slotted nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19873708529
Other languages
German (de)
Other versions
DE3708529C2 (en
Inventor
Karl Dipl Ing Frener
Friedrich Kraus
Georg Dipl Ing Mueller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19873708529 priority Critical patent/DE3708529A1/en
Publication of DE3708529A1 publication Critical patent/DE3708529A1/en
Application granted granted Critical
Publication of DE3708529C2 publication Critical patent/DE3708529C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention relates to a cleansing module for horizontally running, perforated printed circuit board blanks 2 which are guided by transportation rollers arranged on both sides, in the case of which cleansing module, a slotted nozzle is arranged underneath the printed circuit board blank 2. After the drilling process, the walls of the drilled holes of printed circuit boards are covered with drilling residue (swarf), such as epoxy resin or glass. It is thus initially necessary to carry out coarse mechanical cleaning of the drilling residues of the whole walls before the subsequent chemical fine cleaning. For this purpose, the invention provides that the slotted nozzle 1 is arranged on a linkage 3 such that it can move transversely with respect to the printed circuit board movement direction and that a cleansing means is forced through the slotted nozzle 1 at high pressure, for example at 30 bar. <IMAGE>

Description

Die Erfindung betrifft ein Spülmodul für horizontal durchlau­ fende durch beidseitig angeordnete Transportwalzen geführte ge­ lochte Leiterplattennutzen, bei dem unterhalb der Leiterplat­ tennutzen eine Schlitzdüse angeordnet ist.The invention relates to a rinsing module for horizontally transparent fende guided by transport rollers arranged on both sides perforated PCB benefit, in the case below the PCB Use a slot nozzle.

Eine einfache mechanische Reinigung ließe sich mit Hilfe des Naßsandstrahlens erzielen. Dieses Verfahren erfordert jedoch einen hohen Wartungsaufwand, lange Bearbeitungszeiten und eine schlecht zu realisierende Be- und Entladung. Zudem ist dieses Verfahren für gestiegene Anforderungen nicht ausreichend.A simple mechanical cleaning can be done with the Achieve wet sandblasting. However, this procedure requires a high level of maintenance, long processing times and a loading and unloading difficult to implement. In addition, this is Process not sufficient for increased requirements.

Aufgabe der vorliegenden Erfindung ist es, ein Spülmodul für die mechanische Grobreinigung von Bohrlöchern von Mehrlagenlei­ terplatten zu schaffen, das auch noch für hohe Anforderungen an die Rückstandsfreiheit in den Bohrlöchern geeignet ist.The object of the present invention is to provide a rinsing module for the mechanical rough cleaning of boreholes of multi-layer lead To create terplatten that also for high demands the absence of residues in the boreholes is suitable.

Zur Lösung dieser Aufgabe wird gemäß der Erfindung das Spülmodul derart ausgebildet, daß die Schlitzdüse auf einem Gestänge quer bewegbar zur Leiterplattendurchlaufrichtung angeordnet ist und daß ein Reinigungsmittel durch die Schlitzdüse mit hohem Druck z.B. von etwa 30 bar gepreßt wird.According to the invention, the rinsing module is used to achieve this object formed such that the slot nozzle transversely on a linkage is arranged movably to the direction of the printed circuit board and that a cleaning agent through the slot nozzle at high pressure e.g. is pressed from about 30 bar.

Dabei ist es vorteilhaft, die Transportgeschwindigkeit der Lei­ terplattennutzen in einem solchen Verhältnis zum Verfahrweg der Schlitzdüse zu bringen, daß die Nutzen zweimal durchlaufen wer­ den.It is advantageous to change the transport speed of the lei terplatte benefit in such a ratio to the travel of Bring slot nozzle that the benefits go through twice the.

Durch diese Maßnahmen wird eine allen Anforderungen gerecht werdende mechanische Grobreinigung der Bohrlöcher gewährleistet. These measures meet all requirements mechanical rough cleaning of the boreholes is guaranteed.  

Durch eine variable Schlitzbreite der Düse kann die Durchfluß­ menge und der Sprühdruck des Mediums eingestellt werden. Gute Reinigungsergebnisse werden dabei im Druckbereich von etwa 30 bar erreicht. Der Abstand der Düse zum durchlaufenden Leiter­ plattennutzen ist abhängig von der Leiterplattendicke und dem Lochdurchmesser. Es empfiehlt sich daher, eine vertikale Ver­ stellbarkeit der Schlitzdüse vorzusehen.Through a variable slot width of the nozzle, the flow can quantity and the spray pressure of the medium can be set. Quality Cleaning results are in the pressure range of about 30 bar reached. The distance from the nozzle to the continuous conductor board usage depends on the board thickness and the Hole diameter. It is therefore recommended to use a vertical ver adjustability of the slot nozzle.

Anhand des Prinzipschaltbilds nach der Figur wird die Erfindung näher erläutert. In der Figur ist schematisch die Schlitzdüse 1, die auf einem Gestänge 3 in horizontaler Längsrichtung ver­ schiebbar ist, dargestellt. Die Düsenbewegung 6 ist durch Pfei­ le dargestellt. Der Wasseraustritt 7 erfolgt an der Oberseite der mit einem Schlitz versehenen Düse 1. Senkrecht zur Bewe­ gungsrichtung 6 der Schlitzdüse 1 verläuft die mit einem Pfeil 4 angedeutete Bewegungsrichtung der durch das Spülmodul mittels nicht dargestellter Walzen hindurchgeführter Leiterplatten, die mit einem Lochbild 5 versehen sind. Durch die aufeinander ver­ tikal stehenden Komponenten der Plattendurchlaufrichtung und der Düsenbewegung wird eine Zwangsspülung der Bohrlöcher er­ reicht, die allen Anforderungen gerecht wird.The invention is explained in more detail using the basic circuit diagram according to the figure. In the figure, the slot nozzle 1 is shown schematically, which is slidable ver on a linkage 3 in the horizontal longitudinal direction. The nozzle movement 6 is shown by Pfei le. The water outlet 7 occurs at the top of the nozzle 1 provided with a slot. Perpendicular to the direction of movement 6 of the slot nozzle 1 , the direction of movement indicated by an arrow 4 extends through the circuit boards which are passed through the washing module by means of rollers (not shown) and which are provided with a hole pattern 5 . The vertically aligned components of the plate flow direction and the nozzle movement ensure that the boreholes are flushed, which meets all requirements.

Claims (4)

1. Spülmodul für horizontal durchlaufende durch beidseitig an­ geordnete Transportwalzen geführte gelochte Leiterplattennut­ zen, bei dem unterhalb der Leiterplattennutzen eine Schlitzdüse angeordnet ist, dadurch gekennzeichnet, daß die Schlitzdüse (1) auf einem Gestänge (3) quer bewegbar zur Leiterplattendurchlaufrichtung (4) angeordnet ist und daß ein Reinigungsmittel durch die Schlitzdüse mit hohem Druck z.B. von 30 bar gepreßt wird.1. Flushing module for horizontally continuous perforated circuit board groove guided on both sides to arranged transport rollers, in which a slot nozzle is arranged below the circuit board benefits, characterized in that the slot nozzle ( 1 ) is arranged on a linkage ( 3 ) which can be moved transversely to the circuit board passage direction ( 4 ) and that a cleaning agent is pressed through the slot nozzle at high pressure, for example of 30 bar. 2. Spüldmodul nach Anspruch 1, dadurch ge­ kennzeichnet, daß die Transportgeschwindigkeit der Leiterplattennutzen (2) in einem solchen Verhältnis zum Verfah­ rensweg der Schlitzdüse (1) steht, daß die Leiterplattennutzen (2) zweimal durchflutet werden.2. Flushing module according to claim 1, characterized in that the transport speed of the circuit board benefit ( 2 ) is in such a relation to the procedural rensweg the slot nozzle ( 1 ) that the circuit board benefit ( 2 ) are flooded twice. 3. Spülmodul nach einem der vorhergehenden Ansprüche, da­ durch gekennzeichnet, daß die Schlitz­ breite der Schlitzdüse (1) verstellbar ist.3. Flushing module according to one of the preceding claims, characterized in that the slot width of the slot nozzle ( 1 ) is adjustable. 4. Spülmodul nach einem der vorhergehenden Ansprüche, da­ durch gekennzeichnet, daß die Schlitzdüse in vertikaler Richtung verstellbar ist.4. Rinsing module according to one of the preceding claims, there characterized in that the slot nozzle is adjustable in the vertical direction.
DE19873708529 1987-03-16 1987-03-16 Cleansing module Granted DE3708529A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19873708529 DE3708529A1 (en) 1987-03-16 1987-03-16 Cleansing module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873708529 DE3708529A1 (en) 1987-03-16 1987-03-16 Cleansing module

Publications (2)

Publication Number Publication Date
DE3708529A1 true DE3708529A1 (en) 1988-09-29
DE3708529C2 DE3708529C2 (en) 1988-12-29

Family

ID=6323210

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873708529 Granted DE3708529A1 (en) 1987-03-16 1987-03-16 Cleansing module

Country Status (1)

Country Link
DE (1) DE3708529A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997011209A3 (en) * 1995-09-06 1997-07-31 Atotech Deutschland Gmbh Process and device for treating holes or recesses in workpieces with liquid treatment agents
EP0967845A1 (en) * 1998-04-30 1999-12-29 Tokyo Kakoki Co., Ltd. Liquid injector
EP1080798A3 (en) * 1999-09-02 2003-01-15 Wesero Maschinenbau GmbH Device for removing resin residues from a metal press plate
WO2004091819A3 (en) * 2003-04-08 2004-12-02 Neogen Llc Methods of an apparatus for washing high-density microplates
DE102004002421A1 (en) * 2004-01-16 2005-08-18 Atotech Deutschland Gmbh nozzle assembly
DE10255884B4 (en) * 2002-11-29 2006-05-11 Atotech Deutschland Gmbh nozzle assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0037483A1 (en) * 1980-03-21 1981-10-14 Siemens Aktiengesellschaft Method of intensifying the rinsing and cleaning processes for perforations in pieces

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0037483A1 (en) * 1980-03-21 1981-10-14 Siemens Aktiengesellschaft Method of intensifying the rinsing and cleaning processes for perforations in pieces

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997011209A3 (en) * 1995-09-06 1997-07-31 Atotech Deutschland Gmbh Process and device for treating holes or recesses in workpieces with liquid treatment agents
US6240934B1 (en) * 1995-09-06 2001-06-05 Atotech Deutschland Gmbh Method and device for treating holes or recesses extending into workpieces with liquid treatment media
EP0967845A1 (en) * 1998-04-30 1999-12-29 Tokyo Kakoki Co., Ltd. Liquid injector
EP1080798A3 (en) * 1999-09-02 2003-01-15 Wesero Maschinenbau GmbH Device for removing resin residues from a metal press plate
DE10255884B4 (en) * 2002-11-29 2006-05-11 Atotech Deutschland Gmbh nozzle assembly
US7650897B2 (en) 2002-11-29 2010-01-26 Atotech Deutschland Gmbh Nozzle arrangement
WO2004091819A3 (en) * 2003-04-08 2004-12-02 Neogen Llc Methods of an apparatus for washing high-density microplates
US7516749B2 (en) 2003-04-08 2009-04-14 Neogen, Llc Methods of and apparatus for washing high-density microplates
DE102004002421A1 (en) * 2004-01-16 2005-08-18 Atotech Deutschland Gmbh nozzle assembly

Also Published As

Publication number Publication date
DE3708529C2 (en) 1988-12-29

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE

8339 Ceased/non-payment of the annual fee