DE3413109A1 - Method for soldering printed-circuit boards - Google Patents
Method for soldering printed-circuit boardsInfo
- Publication number
- DE3413109A1 DE3413109A1 DE19843413109 DE3413109A DE3413109A1 DE 3413109 A1 DE3413109 A1 DE 3413109A1 DE 19843413109 DE19843413109 DE 19843413109 DE 3413109 A DE3413109 A DE 3413109A DE 3413109 A1 DE3413109 A1 DE 3413109A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit boards
- soldering
- printed
- printed circuit
- scanned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000005476 soldering Methods 0.000 title claims abstract description 25
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 230000004907 flux Effects 0.000 claims description 7
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims description 3
- 239000003550 marker Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003909 pattern recognition Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0445—Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
SIEMENS AKTIENGESELLSCHAFT -3- Unser Zeichen Berlin und München VPA 84 P 1 29 0 OESIEMENS AKTIENGESELLSCHAFT -3- Our reference Berlin and Munich VPA 84 P 1 29 0 OE
Verfahren zum Löten von Leiterplatten.Process for soldering printed circuit boards.
Die Erfindung betrifft ein Verfahren zum Löten von Leiterplatten, bei dem die Leiterplatten nach ihrer Bestückung mit Bauelementen mehrere Stationen durchlaufen in welchen sie nacheinander einem Fluxvorgang, einem Vorheizvorgang und dem eigentlichen Lötvorgang ausgesetzt sind.The invention relates to a method for soldering printed circuit boards, in which the printed circuit boards after their assembly With components go through several stations in which they one after the other a flux process, a preheating process and are exposed to the actual soldering process.
Derartige Lötverfahren für Leiterplatten sind seit langer Zeit bekannt. Entsprechend dem Fortschritt der Elektronik sind auch rechnergesteuerte Lötverfahren bekannt, bei denen in den einzelnen Fertigungsstationen leiterplattenspezifische Parameter berücksichtigt werden können. Allen bekannten Lötverfahren ist jedoch gemeinsam, daß nach dem eigentlichen Lötvorgang lediglich ein Kühlen der mit den Bauelementen bestückten Seite der Leiterplatte erfolgt, und daß daran anschließend die fertige Leiterplatte zur weiteren Verwendung ausgeworfen wird. Bei einigen Lötverfahren erfolgt im Anschluß an den eigentlichen Lötvorgang noch ein Waschen der Leiterplatten, um Flußmittelrückstände zu beseitigen. Trotz rechnergesteuerter individueller Behandlung der einzelnen Leiterplatten ist der Anteil fehlerhafter Leiterplatten noch immer erheblich. Diese defekten Leiterplatten müssen dann anschließend an Handarbeitsplätzen mit großem Aufwand nachgearbeitet werden.Such soldering processes for printed circuit boards have been around for a long time Known time. In line with the advancement of electronics, computer-controlled soldering processes are also known which circuit board-specific parameters can be taken into account in the individual production stations. All known soldering process is common, however, that after the actual soldering process only a cooling with the Components populated side of the circuit board takes place, and that then the finished circuit board for further use is ejected. In some soldering processes, the actual soldering process is followed Another washing of the circuit boards to remove flux residues to eliminate. Despite the computer-controlled individual treatment of the individual circuit boards, the The proportion of faulty printed circuit boards is still significant. These defective circuit boards then have to be can be reworked at manual workstations with great effort.
Aufgabe der vorliegenden Erfindung ist es, ein Verfahren der eingangs genannten Art so zu gestalten, daß die Fehlerquote auf ein Minimum abgesenkt wird, gleichzeitig aber etwa noch vorhandene fehlerhaft gelötete Leiter-Som 1 Bo / 5.4.1984The object of the present invention is to design a method of the type mentioned so that the Error rate is reduced to a minimum, but at the same time any defective soldered conductor Som 1 Bo / April 5, 1984
3A 1 3 1 09 u 3A 1 3 1 09 and
^r - VPA W-P 1 29 00E^ r - VPA W-P 1 29 00E
platten automatisch ausgesondert werden.plates are sorted out automatically.
Diese Aufgabe wird für ein Verfahren der eingangs genannten Art gemäß der Erfindung dadurch gelöst, daß die Baugruppen im Anschluß an den Lötvorgang in einer weiteren Station soweit erwärmt werden, daß bestehende Lötzinnbrücken abgeschmolzen werden, und daß in einer sich daran anschließenden Station die Unterseiten der Leiterplatten optisch abgetastet werden, und als fehlerhaft erkannte Leiterplatten anschließend ausgesondert werden.This task is for a method of the aforementioned Kind according to the invention in that the assemblies in connection with the soldering process in a further Station are heated to the extent that existing solder bridges are melted, and that in one of them subsequent station, the undersides of the printed circuit boards are optically scanned and identified as faulty PCBs are then sorted out.
Durch gezielte Erwärmen der Leiterplatten nach dem eigentlichen Lötvorgang, mit dem ein Abschmelzen der Lötzinnbrücken bewirkt wird, wird eine erhebliche Fehlerquelle beseitigt, so daß die Leiterplatten mit derartigen Fehlern für eine Nachbearbeitung nicht mehr in Betracht kommen. Durch das daraufhin stattfindende optische Abtasten werden die meisten der fehlerhaft gelöteten Leiterplatten erkannt, Durch diese automatische Beschaffenheitsprüfung können als fehlerhaft erkannte Leiterplatten direkt ohne eine weitere Prüfung einer Reparatur-Station zugeführt werden.Through targeted heating of the circuit boards after the actual soldering process, which melts the solder bridges is effected, a significant source of failure is eliminated, so that the circuit boards with such defects can no longer be considered for post-processing. The optical scanning that then takes place Most of the incorrectly soldered circuit boards can be detected through this automatic condition check PCBs identified as faulty can be sent directly to a repair station without further testing.
Weitere vorteilhafte Ausgestaltungen des erfindungsgemäßen Verfahrens ergeben sich aus den Unteransprüchen sowie aus der nachfolgenden Beschreibung eines Verfahrens zum Löten von Leiterplatten gemäß der vorliegenden Erfindung.Further advantageous refinements of the method according to the invention emerge from the subclaims and from the following description of a method for soldering printed circuit boards according to the present invention Invention.
Nachfolgend sollen die einzelnen Stationen eines Verfahrens zum Löten von Leiterplatten gemäß der Erfindung kurz beschrieben werden.The individual stations of a method for soldering printed circuit boards according to the invention are briefly described below to be discribed.
In einer ersten Station werden die Leiterplatten mit den entsprechenden Bauelementen bestückt. Nachdem die Bauelemente auf der gedruckten Leiterplatte plaziert wordenIn a first station, the circuit boards with the equipped with the corresponding components. After the components have been placed on the printed circuit board
-i- VPA NPI 29 ODE -i- VPA NPI 29 ODE
sind, in dem ihre Anschlußleitungen in die Öffnungen der Platte eingesteckt worden sind, werden diese Anschlußleitungen abgeschnitten und unterhalb der Platte umgebogen. In einer zweiten Station wird die Unterseite der gedruckten Leiterplatte mit Flußmittel versehen, beispielsweise dadurch, daß die Leiterplatte durch eine stehende Welle eines flüssigen Flußmittels durchgezogen wird. Nach dem Fluxen der Unterseite der gedruckten Leiterplatte wird diese dann in einer dritten Station vorgeheizt, um das Lösungsmittel des Flußmittels verdampfen zu lassen und um einen Hitzeschock durch das Löten zu vermeiden. In einer darauf folgenden Station wird die vorgeheizte Leiterplatte dann mit flüssigem Lötmittel in Berührung gebracht, beispielsweise durch Vorbeibewegen einer stehenden Welle dieses Lötmittels. Das heiße Lötmittel heizt die gedruckte Leiterplatte und die Anschlußleitungen noch weiter auf, wodurch das Flußmittel in die Öffnungen der Leiterplatte hineingetrieben wird, gefolgt vom Lötmittel selbst, so daß schließlich die An-Schlußleitungen mit den gedruckten Leiterzügen verlötet sind.are, in which their connection lines have been inserted into the openings in the plate, these connection lines are cut off and bent over below the plate. In a second station the bottom the printed circuit board provided with flux, for example by the fact that the circuit board by a standing wave of a liquid flux is pulled through. After fluxing the bottom of the printed circuit board this is then preheated in a third station in order to evaporate the solvent of the flux and to avoid heat shock from soldering. In a subsequent station, the preheated circuit board is then brought into contact with liquid solder, for example by moving it past a standing wave of this solder. The hot solder heats the printed circuit board and leads even further, whereby the flux is driven into the openings of the circuit board, followed by the solder itself, so that finally the connecting leads are soldered to the printed conductor tracks are.
Nach dem eigentlichen Lötvorgang wird der Leiterplatte über ein Heißluftgebläse über eine Düse eine so geringe Wärmemenge über Konvektion zugeführt, daß Zinnbrücken die erfahrungsgemäß von sehr geringer Dicke sind und dementsprechend eine niedrige Wärmekapazität besitzen, abgeschmolzen werden, ohne die übrigen Lötstellen zu gefährden. In einer darauffolgenden Station wird die Unterseite der Leiterplatten durch einen Laserstrahl bzw, durch einen Vidicon abgetastet und die Reflektionen an den Lötstellen über eine Pattern-Recognition-Einheit ausgewertet. Jede Leiterplatte, die dabei noch als schlecht erkannt wurde, wird z.B. durch einen automatisehen Markierer gekennzeichnet. Gleichzeitig wird ein Fehlersignal an den steuernden Computer weitergegeben,After the actual soldering process, the circuit board is made so small by means of a hot air blower via a nozzle Amount of heat supplied via convection that tin bridges which, experience has shown, are of very small thickness and accordingly have a low heat capacity, be melted off without the remaining solder points endanger. In a subsequent station, the underside of the circuit boards is is scanned by a vidicon and the reflections at the soldering points are scanned by a pattern recognition unit evaluated. Every circuit board that was recognized as bad is automatically seen, for example, by an Markers marked. At the same time, an error signal is passed on to the controlling computer,
3413103 c 3413103 c
/ WP 129 ODE/ WP 129 ODE
der die Abgabe der fehlerhaften Baugruppen an einer getrennten Station veranlaßt.which initiates the delivery of the defective assemblies to a separate station.
5 Patentansprüche5 claims
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843413109 DE3413109A1 (en) | 1984-04-06 | 1984-04-06 | Method for soldering printed-circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843413109 DE3413109A1 (en) | 1984-04-06 | 1984-04-06 | Method for soldering printed-circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3413109A1 true DE3413109A1 (en) | 1985-10-17 |
Family
ID=6232923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19843413109 Withdrawn DE3413109A1 (en) | 1984-04-06 | 1984-04-06 | Method for soldering printed-circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3413109A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0245188A3 (en) * | 1986-04-28 | 1989-12-06 | Société Talco | Soldering process of surface components on a printed board |
| EP0363136A3 (en) * | 1988-10-04 | 1990-08-08 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus of a reflow type |
| EP0373376A3 (en) * | 1988-12-15 | 1990-10-31 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Process for obtaining an optimum solder quality on printed-circuit boards using computer-controlled automatic soldering machines |
| EP1463390A3 (en) * | 2003-03-27 | 2007-01-03 | Pillarhouse International Limited | Soldering method and apparatus |
-
1984
- 1984-04-06 DE DE19843413109 patent/DE3413109A1/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0245188A3 (en) * | 1986-04-28 | 1989-12-06 | Société Talco | Soldering process of surface components on a printed board |
| EP0363136A3 (en) * | 1988-10-04 | 1990-08-08 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus of a reflow type |
| US5066850A (en) * | 1988-10-04 | 1991-11-19 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus of a reflow type |
| EP0373376A3 (en) * | 1988-12-15 | 1990-10-31 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Process for obtaining an optimum solder quality on printed-circuit boards using computer-controlled automatic soldering machines |
| EP1463390A3 (en) * | 2003-03-27 | 2007-01-03 | Pillarhouse International Limited | Soldering method and apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8139 | Disposal/non-payment of the annual fee |