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DE29915678U1 - Circuit board - Google Patents

Circuit board

Info

Publication number
DE29915678U1
DE29915678U1 DE29915678U DE29915678U DE29915678U1 DE 29915678 U1 DE29915678 U1 DE 29915678U1 DE 29915678 U DE29915678 U DE 29915678U DE 29915678 U DE29915678 U DE 29915678U DE 29915678 U1 DE29915678 U1 DE 29915678U1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
coil
printed
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29915678U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE29915678U priority Critical patent/DE29915678U1/en
Publication of DE29915678U1 publication Critical patent/DE29915678U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Description

" GR 99 G 4432 DE" GR 99 G 4432 EN

1
Beschreibung1
Description

LeiterplatteCircuit board

Die Erfindung betrifft eine Leiterplatte mit mindestens einer Lage, insbesondere eine Leiterplatte in MOV (Mehrschicht-Oberflächen-Verdrahtung) -Technologie, mit einer durch Leiterbahnen auf einer Lage der Leiterplatte ausgebildeten Spule und einer auf die Spule aufgebrachten Widerstandspaste.The invention relates to a printed circuit board with at least one layer, in particular a printed circuit board in MOV (multilayer surface wiring) technology, with a coil formed by conductor tracks on a layer of the printed circuit board and a resistance paste applied to the coil.

1010

In elektronischen Schaltungen werden häufig Leiterplatten als mechanische Träger und als elektrisches Verbindungselement für Bauelemente, z. B. Bauelemente in Form eines Widerstandes und einer zum Widerstand parallelgeschalteten Spule zur Verwirklichung eines Filters, verwendet. Dieses Filter, der beispielsweise zum Absorbieren von Strömen hoher Frequenz geeignet ist, benötigt Raum auf der Leiterplatte, welcher für eine schaltungstechnische Verwirklichung weiterer Schaltungsfunktionen nicht mehr verfügbar ist.In electronic circuits, printed circuit boards are often used as mechanical supports and as electrical connecting elements for components, e.g. components in the form of a resistor and a coil connected in parallel to the resistor to create a filter. This filter, which is suitable for absorbing high frequency currents, for example, requires space on the printed circuit board which is no longer available for the implementation of further circuit functions.

2020

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, eine Leiterplatte zu schaffen, bei der eine weitere Erhöhung der Packungsdichte ermöglicht wird.The present invention is based on the object of creating a printed circuit board which enables a further increase in the packing density.

Diese Aufgabe wird durch die im Anspruch 1 angegebenen Maßnahmen gelöst.This object is achieved by the measures specified in claim 1.

Die Erfindung wird nachfolgend anhand eines Ausführungsbeispiels unter Bezugnahme auf die einzige Figur der Zeichnung näher erläutert. Die Figur der Zeichnung zeigt eine Draufsicht auf eine Leiterplatte.The invention is explained in more detail below using an exemplary embodiment with reference to the single figure of the drawing. The figure of the drawing shows a plan view of a circuit board.

Eine Leiterplatte 1 ist mit mehreren in Form von Leiterbahnen ausgebildeten Spulen 2, 3, 4 versehen, auf die Widerstandspasten 5, 6, 7 aufgedruckt sind. Die Spule 2 mit dem aufgedruckten Widerstand 5 sowie die Spulen 3, 4 mit den aufgedruckten Widerständen 6, 7 stellen im Prinzip jeweils eineA circuit board 1 is provided with several coils 2, 3, 4 in the form of conductor tracks, on which resistance pastes 5, 6, 7 are printed. The coil 2 with the printed resistor 5 and the coils 3, 4 with the printed resistors 6, 7 each represent, in principle, a

GR 99 G 4432 DEGR 99 G 4432 EN

Parallelschaltung eines induktiven und eines ohmschen Widerstandes dar. Der induktive Teil des Gesamtwiderstandes der jeweiligen Parallelschaltung wird durch die jeweilige Führung der Leiterbahn der Spule 2, 3, 4, der ohmsche Teil des Gesamtwiderstandes durch die geometrischen Abmessungen der Widerstandspaste bestimmt. Im vorliegenden Ausführungsbeispiel ist die Leiterbahn im wesentlichen mäanderförmig ausgebildet. Die auf der Leiterplatte 1 integrierten Spulen sind durch die Wahl der Leiterbahnführungen und die Widerstände durch die geometrischen Abmessungen der auf den Spulen aufgebrachten Widerstandspaste derart dimensioniert/ daß &zgr;. B. die jeweilige Parallelschaltung aus Spule 2, 3, 4 und Widerstand 5, 6, 7 im Versorgungskreis eines CMOS-Schaltkreises die durch ein aktives Bauelement verursachten HF-Ströme in dem ohmschen Anteil der jeweiligen Parallelschaltung zum Teil in thermische Energie umwandelt.Parallel connection of an inductive and an ohmic resistor. The inductive part of the total resistance of the respective parallel connection is determined by the respective routing of the conductor track of the coil 2, 3, 4, the ohmic part of the total resistance by the geometric dimensions of the resistance paste. In the present exemplary embodiment, the conductor track is essentially meander-shaped. The coils integrated on the circuit board 1 are dimensioned by the choice of conductor track routing and the resistors by the geometric dimensions of the resistance paste applied to the coils in such a way that &zgr;. For example, the respective parallel connection of coil 2, 3, 4 and resistor 5, 6, 7 in the supply circuit of a CMOS circuit partially converts the HF currents caused by an active component in the ohmic part of the respective parallel connection into thermal energy.

Claims (2)

1. Leiterplatte mit mindestens einer Lage, insbesondere eine Leiterplatte in MOV (Mehrschicht-Oberflächen-Verdrahtung)- Technologie, mit einer durch Leiterbahnen auf einer Lage der Leiterplatte ausgebildeten Spule und einer auf die Spule aufgebrachten Widerstandspaste. 1. Printed circuit board with at least one layer, in particular a printed circuit board in MOV (multilayer surface wiring) technology, with a coil formed by conductor tracks on a layer of the printed circuit board and a resistance paste applied to the coil. 2. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, daß die Widerstandspaste auf die Spule aufgedruckt ist. 2. Printed circuit board according to claim 1, characterized in that the resistance paste is printed on the coil.
DE29915678U 1999-09-06 1999-09-06 Circuit board Expired - Lifetime DE29915678U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29915678U DE29915678U1 (en) 1999-09-06 1999-09-06 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29915678U DE29915678U1 (en) 1999-09-06 1999-09-06 Circuit board

Publications (1)

Publication Number Publication Date
DE29915678U1 true DE29915678U1 (en) 2000-10-12

Family

ID=8078544

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29915678U Expired - Lifetime DE29915678U1 (en) 1999-09-06 1999-09-06 Circuit board

Country Status (1)

Country Link
DE (1) DE29915678U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2907191A4 (en) * 2012-10-15 2016-04-13 Raytheon Co RADIOFREQUENCY ABSORPTION FILTER

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
09092952 A *
11045802 A *
JP Patents Abstracts of Japan: 5-145210 A.,E-1437,Sept. 22,1993,Vol.17,No.528 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2907191A4 (en) * 2012-10-15 2016-04-13 Raytheon Co RADIOFREQUENCY ABSORPTION FILTER

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Legal Events

Date Code Title Description
R163 Identified publications notified
R207 Utility model specification

Effective date: 20001116

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20021217

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20051206

R152 Utility model maintained after payment of third maintenance fee after eight years

Effective date: 20071210

R071 Expiry of right