[go: up one dir, main page]

DE20311701U1 - Cooling system for e.g. personal computer, uses flowing water to absorb heat and emit heat via radiator inside computer casing - Google Patents

Cooling system for e.g. personal computer, uses flowing water to absorb heat and emit heat via radiator inside computer casing Download PDF

Info

Publication number
DE20311701U1
DE20311701U1 DE20311701U DE20311701U DE20311701U1 DE 20311701 U1 DE20311701 U1 DE 20311701U1 DE 20311701 U DE20311701 U DE 20311701U DE 20311701 U DE20311701 U DE 20311701U DE 20311701 U1 DE20311701 U1 DE 20311701U1
Authority
DE
Germany
Prior art keywords
heat
cooling system
flowing water
personal computer
radiator inside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20311701U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHARKOON TECHNOLOGIES GmbH
Original Assignee
SHARKOON TECHNOLOGIES GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHARKOON TECHNOLOGIES GmbH filed Critical SHARKOON TECHNOLOGIES GmbH
Priority to DE20311701U priority Critical patent/DE20311701U1/en
Publication of DE20311701U1 publication Critical patent/DE20311701U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The computer components are cooled by water flowing along a conduit and the heat is then emitted via a radiator (4) inside the computer casing.

Description

Stand der Technik/Problemstellung:State of the art / problem:

Wasserkühlung herkömmlicher Art können nur nach Modifikation von Gehäuse und anderen Komponenten verbaut werden, da die Wärme zu einem Radiator außerhalb des Gehäuses abgeleitet wird. Eine Modifikation bedeutet immer einen Gewährleistungsverlust. Die Thermaltake Wasserkühlung kann in jedem Server oder Desktop PC verbaut werden, ohne diesen in Modifizieren zu müssen und ist somit universell einsetzbar.Water cooling of a conventional type can only after modification of housing and other components because the heat to a radiator outside of the housing is derived. A modification always means a loss of warranty. The Thermaltake water cooling can be installed in any server or desktop PC without it in having to modify and is therefore universally applicable.

Die Wasserkühlung dient zur Kühlung von Server und Desktop Peripherie aller Art.The water cooling is used to cool the server and desktop peripherals of all kinds.

Gebrauchsmusterbeschreibung Utility model description

Es handelt sich um ein komplettes System mit allen benötigten Bauteilen für einen Server- oder Desktop PC. Das System besteht aus Pumpe, Kühlblock, Reservebehälter, Radiator (Wärmetauscher) mit Lüfter, Schläuchen mit Knickschutz und Schlauchschellen, Befestigungssystem für alle CPU Typen (AMD; Intel, Via), Kühlmittelzusatz, Magnete zur Befestigung von Pumpe und Radiator sowie 2 selbstklebende Stahlplatten.It is a complete system with all the necessary components for a server or desktop PC. The system consists of a pump, cooling block, reserve tank, radiator (heat exchanger) with fan, hoses with kink protection and hose clamps, fastening system for all CPU types (AMD; Intel, Via), coolant additive, magnets for fastening the pump and radiator as well 2 self-adhesive steel plates.

1 Die Pumpe (1) wird mit einem 3pin Molexstecker (2) an den CPU-Lüfter Anschluss des Mainboards angeschlossen. Diese fördert das Wasser kontinuierlich durch das System und sorgt so für eine konstante Temperatur der zu kühlenden Komponenten. Die Wärme wird im Kühlblock (3) aufgenommen, durch das Wasser zum Radiator (4) transportiert und im diesem wieder an die Umgebung abgegeben. Das so abgekühlte Wassergelangt durch den Kreislauf wieder zur Pumpe (1). Der Radiator (4) selbst wird zur besseren Konvektion von einen 80mm Lüfter (5) angeströmt, der an den Gehäuselüfteranschluss der Mainboards angeschlossen wird, ebenfalls mit einem 3pin Molexstecker (6). Die einzelnen Komponenten sind untereinander mit hochflexiblen Siliconschläuchen (8) verbunden. In den Siliconschläuchen (8) wird eine oxidationsfreie Stahlspirale (9) eingebracht, die ein Abknicken der Schläuche verhindert. An der Pumpe (1) ist weiterhin ein Reservebehälter (7) angeschlossen. Dieser gewährleistet, das sich immer die optimale Menge an Wasser im Kühlkreislauf befindet und dient zur Befüllung des leeren Systems. Pumpe (1), Reservebehälter (7) und Radiator (4) werden mittels sehr starker Magnetplättchen (10) am und im Gehäuse befestigt. Für Gehäuse aus nichtmagnetischen Materialien (z.B. Aluminium) liegen selbstklebende Stahlplatten (12) dem Set bei, die an den entsprechenden Befestigungsstellen angebracht werden. Alle Komponenten, mit Ausnahme des Reservebehälters, befinden sich im Gehäuse. Die Schläuche zum Reservebehälter werden durch bereits am Gehäuse befindlichen Öffnungen (sog. Slotöffnungen) für Erweiterungskarten nach außen geführt. Um die EMV Eigenschaften des Gehäuses nicht zu beeinflussen liegt dem Set ein sog. Slotblende (11) bei, die das so entstandene Loch wieder schließt und nur Aussparungen für die Schläuche besitzt. Somit ist keinerlei Modifikation des Gehäuses oder anderer Komponenten notwendig, die einen Gewährleistungsverlust zur Folge hätten. Je nach thermischer Leistung der zur kühlenden Komponenten werden unterschiedlich große Kühlblöcke, Radiatoren, Lüfter und Pumpen mit unterschiedlicher Förderleistung verwendet. 1 The pump ( 1 ) with a 3pin Molex connector ( 2 ) connected to the CPU fan connector on the mainboard. This conveys the water continuously through the system and thus ensures a constant temperature of the components to be cooled. The heat is in the cooling block ( 3 ) recorded through the water to the radiator ( 4 ) transported and released back into the environment. The water cooled in this way returns to the pump through the circuit ( 1 ). The radiator ( 4 ) itself is used for better convection by an 80mm fan ( 5 ), which is connected to the case fan connector on the mainboards, also with a 3pin Molex connector ( 6 ). The individual components are interconnected with highly flexible silicone hoses ( 8th ) connected. In the silicone hoses ( 8th ) becomes an oxidation-free steel spiral ( 9 ), which prevents the hoses from kinking. At the pump ( 1 ) is still a reserve container ( 7 ) connected. This ensures that there is always the optimal amount of water in the cooling circuit and is used to fill the empty system. Pump ( 1 ), Reserve container ( 7 ) and radiator ( 4 ) using very strong magnetic plates ( 10 ) attached to and in the housing. For housings made of non-magnetic materials (e.g. aluminum) there are self-adhesive steel plates ( 12 ) included in the set, which are attached to the corresponding attachment points. All components, with the exception of the reserve tank, are located in the housing. The hoses to the reserve tank are routed to the outside through openings in the housing (so-called slot openings) for expansion cards. In order not to influence the EMC properties of the housing, the set has a so-called slot cover ( 11 ), which closes the hole created in this way and only has recesses for the hoses. So no modification of the housing or other components is necessary, which would result in a loss of warranty. Depending on the thermal output of the components to be cooled, cooling blocks, radiators, fans and pumps of different sizes with different delivery rates are used.

Funktionsablauf:Functional sequence:

Die Pumpe fördert kontinuierlich Wasser durch das gesamte Kühlsystem. Die Wärme wird am Kühlblock aufgenommen, durch das Wasser weiter zum Radiator (Wärmetauscher) transportiert und dort an die Umgebung abgegeben.The pump continuously pumps water through the entire cooling system. The heat is on the cooling block recorded, through the water to the radiator (heat exchanger) transported and released there to the environment.

Anwendungsbeispiele:Application examples:

Die Wässerkühlung dient zur Kühlung von Server und Desktop Peripherie wie Zentralprozessoren (CPU), Grafikprozessoren (GPU), Chipsätzen von Mainboards und Controllern, Speichermodulen, Netzteilen, Festplatten, und anderen Komponenten die eine aktive Kühlung benötigen. Die Wasserkühlung ist bei guter Kühlleistung extrem Geräuscharm und ermöglicht so ein angenehmes, konzentriertes Arbeiten am Server oder Desktop PC.Water cooling is used to cool the server and desktop peripherals such as central processors (CPU), graphics processors (GPU), chipsets from Mainboards and controllers, memory modules, power supplies, hard drives, and other components that need active cooling. The water cooling is with good cooling performance extremely quiet and allows such a pleasant, concentrated work on the server or desktop PC.

Claims (1)

Aktivwasserkühlung für PCs- und Workstationsysteme, die dadurch gekennzeichnet ist, dass die Wärmeabnahme am Mikroprozessor oder anderen wärmempfindlichen Bauteilen durch einen flüssigkeitsführenden Kühlkörper erfolgt und die Wärme über einen Radiator innerhalb des Gehäuses wieder freigegeben wird.Active water cooling for PC and workstation systems, which is characterized in that the heat is removed from the microprocessor or other heat-sensitive components by a liquid-carrying heat sink and the heat is released again via a radiator inside the housing.
DE20311701U 2003-07-25 2003-07-25 Cooling system for e.g. personal computer, uses flowing water to absorb heat and emit heat via radiator inside computer casing Expired - Lifetime DE20311701U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20311701U DE20311701U1 (en) 2003-07-25 2003-07-25 Cooling system for e.g. personal computer, uses flowing water to absorb heat and emit heat via radiator inside computer casing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20311701U DE20311701U1 (en) 2003-07-25 2003-07-25 Cooling system for e.g. personal computer, uses flowing water to absorb heat and emit heat via radiator inside computer casing

Publications (1)

Publication Number Publication Date
DE20311701U1 true DE20311701U1 (en) 2003-11-27

Family

ID=29719620

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20311701U Expired - Lifetime DE20311701U1 (en) 2003-07-25 2003-07-25 Cooling system for e.g. personal computer, uses flowing water to absorb heat and emit heat via radiator inside computer casing

Country Status (1)

Country Link
DE (1) DE20311701U1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005088429A3 (en) * 2004-03-09 2005-10-27 Curamik Electronics Gmbh Cooling system for electronic devices and device with such a cooling system
DE102004020642A1 (en) * 2004-04-22 2005-11-10 Höhne, Sven, Dipl.-Ing (FH) Cooling device for electronic microprocessors operates with a gravity cooling element with a flow of liquid expanding during heating and a radiator for contracting liquid
DE102004031251B4 (en) * 2004-06-29 2007-03-22 Sebastian Jaksch Device for liquid cooling of microprocessors in computer systems
US8241016B2 (en) 2004-09-10 2012-08-14 Ebm-Papst St. Georgen Gmbh & Co. Kg Fluid transporting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005088429A3 (en) * 2004-03-09 2005-10-27 Curamik Electronics Gmbh Cooling system for electronic devices and device with such a cooling system
DE102004020642A1 (en) * 2004-04-22 2005-11-10 Höhne, Sven, Dipl.-Ing (FH) Cooling device for electronic microprocessors operates with a gravity cooling element with a flow of liquid expanding during heating and a radiator for contracting liquid
DE102004031251B4 (en) * 2004-06-29 2007-03-22 Sebastian Jaksch Device for liquid cooling of microprocessors in computer systems
US8241016B2 (en) 2004-09-10 2012-08-14 Ebm-Papst St. Georgen Gmbh & Co. Kg Fluid transporting device

Similar Documents

Publication Publication Date Title
US7420804B2 (en) Liquid cooling system including hot-swappable components
CN1957316B (en) Systems for cooling heat-generating electronic equipment
DE60113264T2 (en) DEVICE AND METHOD FOR COOLING A COMPUTER
US4945980A (en) Cooling unit
US20050083657A1 (en) Liquid cooling system
CN107479625A (en) External function expanding device
US20030201092A1 (en) Liquid cooling system for processors
DE60311177D1 (en) Pump motor with liquid cooling system
KR100465088B1 (en) The water cooling system for electronic device
US8611083B2 (en) System and method for cooling a computer
US10107303B2 (en) Fluid cooled server and radiator
Sahini et al. Comparative study of high ambient inlet temperature effects on the performance of air vs. liquid cooled IT equipment
US20080013278A1 (en) Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles
CN104423504A (en) Server
DE20311701U1 (en) Cooling system for e.g. personal computer, uses flowing water to absorb heat and emit heat via radiator inside computer casing
US11412636B2 (en) Single-phase immersion cooling system and method of the same
DE202004003644U1 (en) Cooling system for an electronic device, in particular a computer
DE20306889U1 (en) Active water cooling for computers has water pumped to a radiator having electric fan and fixed to housing
US10356957B2 (en) Adaptive cooling assembly
CN105848447A (en) Heat radiating device and heat radiating system
CN113170595A (en) A device that cools a high-performance computer or circuit by temperature regulation
DE19645709A1 (en) Central processing unit cooling system adaptor
DE29912206U1 (en) Active cooler for microprocessors
CN207040118U (en) Can the movable cabinet level server system of quick change part soon heat abstractor
DE10259191A1 (en) Industrial computer has components within heat dissipating metal housing with fluid heat pipes to transfer heat energy

Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20040108

R156 Lapse of ip right after 3 years

Effective date: 20070201