DE2054047A1 - Solder - for joining contact pieces to thermocouple legs - Google Patents
Solder - for joining contact pieces to thermocouple legsInfo
- Publication number
- DE2054047A1 DE2054047A1 DE19702054047 DE2054047A DE2054047A1 DE 2054047 A1 DE2054047 A1 DE 2054047A1 DE 19702054047 DE19702054047 DE 19702054047 DE 2054047 A DE2054047 A DE 2054047A DE 2054047 A1 DE2054047 A1 DE 2054047A1
- Authority
- DE
- Germany
- Prior art keywords
- solder
- composition
- contact pieces
- thermocouple legs
- metals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 150000002739 metals Chemical class 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 229910052737 gold Inorganic materials 0.000 claims abstract description 5
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 5
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 3
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 3
- 229910052703 rhodium Inorganic materials 0.000 claims abstract description 3
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 3
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims description 11
- 229910052797 bismuth Inorganic materials 0.000 claims description 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 4
- 229910002899 Bi2Te3 Inorganic materials 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 238000009736 wetting Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
Thermoelektrische Anordnung Zusatz zum Patent . , , , .(Anmeldung P 18 04 108.2;VPA 68/1492).Thermoelectric arrangement Addition to the patent. , , , .(Sign up P 18 04 108.2; VPA 68/1492).
Gegenstand des Hauptpatentes . . . . . (Anmeldung P 18 04 108.2) ist ein Lot zum Kontaktieren eines Thermoelementschenkels mit einem Kontaktstück, wobei Wismut eine Komponente des Lotes ist.Subject of the main patent. . . . . (Registration P 18 04 108.2) is a solder for contacting a thermocouple leg with a contact piece, wherein Bismuth is a component of solder.
Das Lot hat die Zusammensetzung BixMe1-x mit 0,6 t x # 0,99, wobei Me eines der Metalle Germanium Ge, Selen Se, Tellur Te, Kobalt Co, Nickel Ni, Rhodium Rh, Palladium.The solder has the composition BixMe1-x with 0.6 t x # 0.99, where Me one of the metals germanium Ge, selenium Se, tellurium Te, cobalt Co, nickel Ni, rhodium Rh, palladium.
Pd oder Platin Pt ist.Is Pd or platinum Pt.
Das Lot nach dem Hauptpatent erfüllt verschiedene Forderungen, die an ein Material gestellt werden, das zur Kontaktierung von Thermoelementschenkeln geeignet ist, die Wismut als Komponente enthalten. Es hat insbesondere etwa den gleichen Ausdehnungskoeffizienten wie das Schenkelmaterial und das Brückenmaterial sowie einen geringen thermischen und elektrischen Widerstand.The solder according to the main patent fulfills various requirements that be placed on a material that is used for contacting thermocouple legs which contain bismuth as a component is suitable. In particular, it has about the same expansion coefficient as the leg material and the bridge material as well as a low thermal and electrical resistance.
Damit ist ein guter Wirkungsgrad des Thermogenerators sichergestellt. Thermogeneratoren mit Schenkeln, die Wismut enthalten, können noch für Arbeitstemperaturen an der Heißseite bis etwa 4000C verwendet werden. Für solche Temperaturen ist das Lot nach dem Hauptpatent geeignet.This ensures a good efficiency of the thermal generator. Thermogenerators with legs that contain bismuth can still be used for working temperatures can be used on the hot side up to about 4000C. For temperatures like this this is Lot suitable according to the main patent.
Der Erfindung liegt die Aufgabe zu Grunde, Lote zu finden, welche die eingangs erwähnten Forderungen erfüllen und darüber hinaus die für höhere Betriebstemperaturen verwendbaren Kontaktmetalle, beispielsweise Kupfer, Palladium, Kobalt, Gold oder Eisen, insbesondere Nickel und Silber, gut benetzen und auf deren Oberflächen gut haften. Die Erfindung beruht nun auf der Erkenntnis, -2-daß neben den Metallkomponenten nach dem Hauptpatent noch weiter Metalle geeignet sind.The invention is based on the object of finding solders which meet the requirements mentioned at the beginning and also those for higher operating temperatures usable contact metals, for example copper, palladium, cobalt, gold or Wet iron, especially nickel and silver, well and on their surfaces well be liable. The invention is based on the knowledge that -2- Next the metal components according to the main patent are still further metals suitable.
Zur Lösung der genannten Aufgabe sind erfindungsgemäß als Metal komponenten des Lotes Kupfer, Silber, Gold und Zink vorgesehen.According to the invention, metal components are used to achieve the stated object of the solder provided copper, silver, gold and zinc.
Diese Lote erfüllen ebenfalls die erwähnten Forderungen und zei gen gute Lötfähigkeit und gute Benetzbarkeit auf Wismuttellurid Bi2Te3 und ähnlichen Mischkristallen, wie beispielsweise AgBiTe2 sowie auf den erwähnten Kontaktmetallen und auch deren Legierungen. Diese Lote sind beständig in inerter Atmosphäre oder Vakuum bis wenigstens etwa 400°C und ihre Kontaktzonen sogar bis wenigstens etwa 500°C. Ihre Schmelzpunkte Fp liegen im Temperaturbereich zwischen etwa 300 und 41500.These solders also meet the requirements mentioned and show good solderability and good wettability on bismuth telluride Bi2Te3 and similar Mixed crystals such as AgBiTe2 as well as on the mentioned contact metals and also their alloys. These solders are stable in an inert atmosphere or Vacuum up to at least about 400 ° C and their contact zones even up to at least about 500 ° C. Their melting points, mp are in the temperature range between about 300 and 41,500.
Nach der Erfindung vorzugsweise geeignet für eine thermoelektrische Anordnung sind Lote mit folgender Zusammensetzung und den zugehörigen Schmelzpunkten Fp: 1. Bi0,97Cu0,03 Fp # 400°C 2. Bi0,9Ag0,1 Fp # 300°C 3. Bi0,7Ag0,3 Fp # 380°C 4. 3i0,6Ag0,4 F 4000C p 5. Bi0,7Au0,3 Fp « 330°C 6. Bi0,6Au0,4 Fp # 415°C 7. Bi0,8Zn0,2 Fp # 340°C Da die Anwesenheit oxidierender Gase für die Bindekraft schädlich ist, wird der Lötvorgang zweckmäßig in inerter Atmosphäre ausgeführt. Als Schutzgas sind Argon, Helium oder ihre Mischungen geeignet. Argon oder Helium mit einer Reinheit von etwa 99,99% sind für diesen Zweck ausreichend.According to the invention, preferably suitable for a thermoelectric Arrangement are solders with the following composition and the associated melting points M.p .: 1. Bi0.97 Cu0.03 mp # 400 ° C 2. Bi0.9Ag0.1 mp # 300 ° C 3. Bi0.7Ag0.3 mp # 380 ° C 4. 3i0.6Ag0.4 F 4000C p 5. Bi0.7Au0.3 m.p. 330 ° C 6. Bi0.6Au0.4 m.p. # 415 ° C 7. Bi0.8Zn0.2 Fp # 340 ° C Since the presence of oxidizing gases is detrimental to the binding force, the soldering process is expediently carried out in an inert atmosphere. As protective gas are Argon, helium or their mixtures are suitable. Argon or Helium with a purity of about 99.99% is sufficient for this purpose.
8 Patentansprüche O Figuren8 claims O figures
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19702054047 DE2054047A1 (en) | 1968-10-19 | 1970-11-03 | Solder - for joining contact pieces to thermocouple legs |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19681804108 DE1804108A1 (en) | 1968-10-19 | 1968-10-19 | Solder containing bismuth as the main component for - making thermocouple contact |
| DE19702054047 DE2054047A1 (en) | 1968-10-19 | 1970-11-03 | Solder - for joining contact pieces to thermocouple legs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2054047A1 true DE2054047A1 (en) | 1972-05-04 |
Family
ID=5787050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19702054047 Pending DE2054047A1 (en) | 1968-10-19 | 1970-11-03 | Solder - for joining contact pieces to thermocouple legs |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE2054047A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997000977A1 (en) * | 1995-06-21 | 1997-01-09 | Asarco Incorporated | Machinable lead-free copper alloys and additive and method for making the alloys |
| DE10309677A1 (en) * | 2003-02-27 | 2004-09-30 | Infineon Technologies Ag | Thin-film solder for connecting micro-electromechanical components, comprises mixture of gold and bismuth, e.g. in eutectic mixture |
-
1970
- 1970-11-03 DE DE19702054047 patent/DE2054047A1/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997000977A1 (en) * | 1995-06-21 | 1997-01-09 | Asarco Incorporated | Machinable lead-free copper alloys and additive and method for making the alloys |
| US5614038A (en) * | 1995-06-21 | 1997-03-25 | Asarco Incorporated | Method for making machinable lead-free copper alloys with additive |
| DE10309677A1 (en) * | 2003-02-27 | 2004-09-30 | Infineon Technologies Ag | Thin-film solder for connecting micro-electromechanical components, comprises mixture of gold and bismuth, e.g. in eutectic mixture |
| DE10309677B4 (en) * | 2003-02-27 | 2008-07-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Microelectromechanical component and method for producing a microelectromechanical component |
| US7402910B2 (en) | 2003-02-27 | 2008-07-22 | Micropelt Gmbh | Solder, microelectromechanical component and device, and a process for producing a component or device |
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