DE19937784B4 - Two slices of fine grinding machine - Google Patents
Two slices of fine grinding machine Download PDFInfo
- Publication number
- DE19937784B4 DE19937784B4 DE1999137784 DE19937784A DE19937784B4 DE 19937784 B4 DE19937784 B4 DE 19937784B4 DE 1999137784 DE1999137784 DE 1999137784 DE 19937784 A DE19937784 A DE 19937784A DE 19937784 B4 DE19937784 B4 DE 19937784B4
- Authority
- DE
- Germany
- Prior art keywords
- drive shaft
- disc
- cooling
- grinding machine
- working
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 239000005068 cooling lubricant Substances 0.000 claims abstract description 17
- 239000002826 coolant Substances 0.000 description 12
- 239000012530 fluid Substances 0.000 description 7
- 238000005498 polishing Methods 0.000 description 5
- 239000000969 carrier Substances 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Zweischeiben-Feinschleifmaschine mit
– einem
Maschinengehäuse
(10) mit einem unteren und einem oberen Gehäuseteil (12, 14),
– einer
oberen und einer unteren Arbeitsscheibe (20,44), die jeweils an
einer oberen und einer unteren Trägerscheibe (18, 42) befestigt
sind, wobei in der der jeweiligen Arbeitsscheibe (20, 44) zugekehrten
Fläche
der Trägerscheibe
(18, 42) ein radial abgedichtetes Kühllabyrinth (34, 62) geformt
ist, das mehrere in Umfangsrichtung versetzt angeordnete Kammern
enthält,
die über
achsparallele Bohrungen (36, 64) der Arbeitsscheiben (20, 44) mit
deren Arbeitsfläche
verbunden sind,
– einer
oberen und einer unteren vertikalen Antriebswelle (22, 46) zum Antrieb
der Arbeitsscheiben (20, 44), die mittels Rollenlager im Maschinengehäuse (10)
drehbar gelagert und von einem Motor über Getriebemittel antreibbar sind,
wobei jede Antriebswelle (22, 46) mindestens einen achsparallelen
Kanal (84, 86, 120, 122) aufweist, der mit jeweils einer stationären Zuführvorrichtung
(26, 50) für
Kühlschmierflüssigkeit
und mit dem Kühllabyrinth
(34, 62) über mindestens
einen...Two-disc fine grinding machine with
A machine housing (10) having a lower and an upper housing part (12, 14),
- An upper and a lower working disc (20,44) which are respectively secured to an upper and a lower carrier disc (18, 42), wherein in the respective working disc (20, 44) facing surface of the carrier disc (18, 42) a radially sealed cooling labyrinth (34, 62) is formed, which contains a plurality of circumferentially offset chambers, which are connected via axially parallel bores (36, 64) of the working disks (20, 44) with the working surface,
- An upper and a lower vertical drive shaft (22, 46) for driving the working wheels (20, 44) which are rotatably mounted by means of roller bearings in the machine housing (10) and driven by a motor via gear means, each drive shaft (22, 46) Has at least one axially parallel channel (84, 86, 120, 122), each with a stationary supply device (26, 50) for cooling lubricant and with the cooling labyrinth (34, 62) via at least one ...
Description
Die Erfindung bezieht sich auf eine Zweischeiben-Feinschleifmaschine.The The invention relates to a two-disc fine grinding machine.
Aus
der
Aus
der
Aus
der
Aus
der
Der Erfindung liegt die Aufgabe zugrunde, eine Zweischeiben-Feinschleifmaschine zu schaffen, bei der sowohl die Kühlung als auch die Schmierung auf einfache Weise erfolgt.Of the Invention is based on the object, a two-disc fine grinding machine to create in both the cooling and the lubrication on simple way.
Diese Aufgabe wird durch die Merkmale des Patentanspruchs 1 gelöst.These The object is solved by the features of claim 1.
Vorteilhafte Ausgestaltungen und Weiterbildungen der Zweischeiben-Feinschleifmaschine sind Gegenstand der Unteransprüche.advantageous Embodiments and developments of the two-disc fine grinding machine are the subject of the dependent claims.
Bei der erfindungsgemäßen Zweischeiben-Feinschleifmaschine, die normalerweise eine Läppkinematik hat, ist in der der jeweiligen Arbeitsscheibe zugekehrten Fläche der Trägerscheibe mindestens ein radial abgedichtetes Kühllabyrinth geformt, das über achsparallele Bohrungen der Arbeitsscheiben mit deren Arbeitsflächen verbunden ist. In jeder Antriebswelle ist mindestens ein achsparalleler Kanal vorgesehen, der mit einer Quelle für Kühlschmierflüssigkeit über eine stationäre Zuführvorrichtung und über einen schrägen Verbindungskanal in der Trägerscheibe mit dem Kühllabyrinth verbunden ist.at the two-disc fine grinding machine according to the invention, usually a lapping kinematics has, is in the respective working disk facing surface of the carrier disc formed at least one radially sealed cooling labyrinth, the about paraxial Holes of the working wheels connected to their work surfaces is. In each drive shaft is at least one axis-parallel channel provided with a source of cooling lubricant via a stationary feeder and over a weird one Connecting channel in the carrier disc with the cooling labyrinth connected is.
Anstelle
eines intern geschlossenen Kühlkreislaufes,
wie dieser bisher üblich
war, wird ein offener Kreislauf vorgesehen, und das Kühlmittel
ist gleichzeitig Schmier- bzw. Arbeitsmittel. Es versteht sich,
daß ein
geeignetes Kühlaggregat
vorgesehen ist, um die Kühlschmierflüssigkeit
auf eine niedrige Temperatur zu bringen, bevor es den Arbeitsflächen zugeführt wird.
Eine Pumpe dient zur Erzeugung eines ausreichenden Druckes der Kühlschmierflüssigkeit.
Das Auffangen der radial aus dem Spalt zwischen den Arbeitsflächen austretenden
Kühlschmierflüssigkeit
erfolgt in bekannter Weise, etwa wie in der
In einer Ausgestaltung der Erfindung ist vorgesehen, daß die Antriebswellen zwei oder mehr achsparallele Kanäle aufweisen, die mit der Zuführvorrichtung und mit in Umfangsrichtung versetzt angeordneten Kammern verbunden sind. Die achsparallelen Kanäle können mit Hilfe einer Hülse gebildet werden, die drehfest in der hohlen Antriebswelle sitzt und an der Außenseite einen oder mehrere achsparallele Nuten aufweist, welche die Kühlkanäle bilden.In An embodiment of the invention is provided that the drive shafts two or more paraxial channels having, with the feeding device and connected with circumferentially staggered chambers are. The paraxial channels can with the help of a sleeve be formed, which sits non-rotatably in the hollow drive shaft and on the outside Has one or more axially parallel grooves, which form the cooling channels.
Das Kühllabyrinth in den Trägerscheiben ist über mindestens einen schrägen Verbindungskanal in der Trägerscheibe über eine radiale Bohrung in der Antriebswelle mit den achsparallelen Kanälen in der Antriebswelle verbunden. Nach einer anderen Ausgestaltung der Erfindung hat die untere Trägerscheibe Speichen, welche eine Nabe mit einem Tragabschnitt verbinden. Der Verbindungskanal kann dann in einer oder mehreren Speichen geformt sein.The cooling labyrinth in the carrier disks is over at least one oblique Connecting channel in the carrier disc over a radial bore in the drive shaft with the axis-parallel channels in the drive shaft connected. According to another embodiment of the invention, the lower carrier disk Spokes which connect a hub with a support section. Of the Connecting channel can then be shaped in one or more spokes be.
Die Zuführvorrichtung an den Antriebswellen wird nach einer weiteren Ausgestaltung der Erfindung mit einem die Antriebswelle umgebenden stationären Verteilerring versehen, an dem mindestens eine Zuführleitung angebracht ist. Diese ist über eine radiale Bohrung im Verteilerring mit einer achsparallelen Ringkammer verbunden, die zwischen Verteilerring und Antriebswelle ausgebildet ist. Über eine radiale Bohrung in der Antriebswelle ist dann die Ringkammer mit mindestens einem achsparallelen Kanal in der Antriebswelle verbunden.The feeder on the drive shafts is according to a further embodiment of the Invention comprising a stationary distributor ring surrounding the drive shaft provided on which at least one supply line is attached. These is over a radial bore in the distributor ring with an axially parallel annular chamber connected, which formed between distributor ring and drive shaft is. about a radial bore in the drive shaft is then the annular chamber connected to at least one axis-parallel channel in the drive shaft.
Die Erfindung wird nachfolgend anhand eines in Zeichnungen dargestellten Ausführungsbeispiels näher erläutert.The Invention will be described below with reference to an illustrated in drawings embodiment explained in more detail.
Zunächst wird
Ein
Maschinengehäuse
Die
Schleifscheibe
Die
untere Trägerscheibe
Aus
Am
unteren Ende der Antriebswelle
Die
Schleifscheibe
Eine
mit
Wie
aus
Die
achsparallelen Kanäle
Ein
innerer Stiftkranz
Eine
Stange
Die
radial nach außen
austretende Kühlschmierflüssigkeit
wird durch eine Seitenwand
Claims (7)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1999137784 DE19937784B4 (en) | 1999-08-10 | 1999-08-10 | Two slices of fine grinding machine |
| EP20000113746 EP1075897B1 (en) | 1999-08-10 | 2000-06-29 | Lapping machine with two plates |
| DE50013453T DE50013453D1 (en) | 1999-08-10 | 2000-06-29 | Two slices of fine grinding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1999137784 DE19937784B4 (en) | 1999-08-10 | 1999-08-10 | Two slices of fine grinding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE19937784A1 DE19937784A1 (en) | 2001-02-22 |
| DE19937784B4 true DE19937784B4 (en) | 2006-02-16 |
Family
ID=7917886
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1999137784 Expired - Lifetime DE19937784B4 (en) | 1999-08-10 | 1999-08-10 | Two slices of fine grinding machine |
| DE50013453T Expired - Lifetime DE50013453D1 (en) | 1999-08-10 | 2000-06-29 | Two slices of fine grinding machine |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE50013453T Expired - Lifetime DE50013453D1 (en) | 1999-08-10 | 2000-06-29 | Two slices of fine grinding machine |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP1075897B1 (en) |
| DE (2) | DE19937784B4 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011082857A1 (en) | 2011-09-16 | 2013-03-21 | Siltronic Ag | Method for the simultaneous two-sided material removing machining of at least three workpieces |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10159848B4 (en) * | 2001-12-06 | 2004-07-15 | Siltronic Ag | Device for machining workpieces on both sides |
| DE10159832A1 (en) * | 2001-12-06 | 2003-06-26 | Wacker Siltronic Halbleitermat | Semiconductor wafer made from silicon used in the production of electronic components comprises a polished front side and a polished rear side |
| DE10218483B4 (en) * | 2002-04-25 | 2004-09-23 | Siltronic Ag | Device for simultaneously machining workpieces on both sides of material |
| EP1366854A1 (en) * | 2002-05-29 | 2003-12-03 | PETER WOLTERS Werkzeugmaschinen GmbH | Double sided polisher apparatus |
| CN100566938C (en) * | 2002-12-27 | 2009-12-09 | 株式会社荏原制作所 | Substrate polishing method |
| JP4448297B2 (en) * | 2002-12-27 | 2010-04-07 | 株式会社荏原製作所 | Substrate polishing apparatus and substrate polishing method |
| DE102006037490B4 (en) * | 2006-08-10 | 2011-04-07 | Peter Wolters Gmbh | Double-sided processing machine |
| DE102007056627B4 (en) | 2007-03-19 | 2023-12-21 | Lapmaster Wolters Gmbh | Method for grinding several semiconductor wafers simultaneously |
| DE102007013058B4 (en) | 2007-03-19 | 2024-01-11 | Lapmaster Wolters Gmbh | Method for grinding several semiconductor wafers simultaneously |
| DE102009052070A1 (en) * | 2009-11-05 | 2011-05-12 | Peter Wolters Gmbh | Apparatus and method for double side machining of flat workpieces |
| DE102010024040A1 (en) | 2010-06-16 | 2011-12-22 | Siltronic Ag | Process for polishing a semiconductor wafer |
| DE102010032501B4 (en) | 2010-07-28 | 2019-03-28 | Siltronic Ag | Method and device for dressing the working layers of a double-side sanding device |
| DE102010042040A1 (en) | 2010-10-06 | 2012-04-12 | Siltronic Ag | Method for material removal processing of sides of semiconductor wafers in e.g. microelectronics, involves bringing side of wafer in contact with sandpaper, so that material removal from side of wafer is caused in processing step |
| DE102011003006B4 (en) | 2011-01-21 | 2013-02-07 | Siltronic Ag | A method for providing each a level working layer on each of the two working wheels of a double-sided processing device |
| DE102011003008B4 (en) | 2011-01-21 | 2018-07-12 | Siltronic Ag | Guide cage and method for simultaneous two-sided material abrading processing of semiconductor wafers |
| DE102011080323A1 (en) | 2011-08-03 | 2013-02-07 | Siltronic Ag | Method for simultaneously abrasive processing e.g. front surface of single crystalline silicon wafer in semiconductor industry, involves locating wafer and ring in recess of rotor disk such that edge of recess of disk guides wafer and ring |
| DE102011089570A1 (en) | 2011-12-22 | 2013-06-27 | Siltronic Ag | Guide cage for grinding both sides of at least one disc-shaped workpiece between two rotating working wheels of a grinding device, method for producing the guide cage and method for simultaneous two-sided grinding of disc-shaped workpieces using the guide cage |
| DE102014220888B4 (en) | 2014-10-15 | 2019-02-14 | Siltronic Ag | Apparatus and method for double-sided polishing of disc-shaped workpieces |
| CN107671728A (en) * | 2017-11-15 | 2018-02-09 | 深圳赛贝尔自动化设备有限公司 | A kind of upper disk magnetism servo-electric motor water-cooling of polishing grinding machine |
| CN115026698A (en) * | 2022-07-01 | 2022-09-09 | 深圳市易天自动化设备股份有限公司 | Grinding and cleaning assembly, control method thereof and grinding and cleaning device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2780038A (en) * | 1954-09-08 | 1957-02-05 | Glaceries Sambre Sa | Glass grinding and polishing method and apparatus |
| US4665658A (en) * | 1984-05-21 | 1987-05-19 | Commissariat A L'energie Atomique | Double face abrading machine and device for transmitting current and fluid between a rotary structure and a non-rotary structure |
| DE19547085A1 (en) * | 1995-12-15 | 1997-06-19 | Wolters Peter Werkzeugmasch | Polishing machine for finishing workpiece |
| US5674116A (en) * | 1996-10-09 | 1997-10-07 | Cmi International Inc. | Disc with coolant passages for an abrasive machining assembly |
| EP0803329A2 (en) * | 1996-04-25 | 1997-10-29 | Fujikoshi Kikai Kogyo Kabushiki Kaisha | Polishing machine |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1261131A (en) * | 1969-06-06 | 1972-01-19 | Burmah Oil Trading Ltd | Improvements in or relating to lapping machines |
| DE2442081C3 (en) * | 1974-09-03 | 1979-11-15 | Jmj-Werkzeugmaschinen Gmbh Fuer Feinbearbeitung, 4020 Mettmann | Lapping machine |
| DE3411120A1 (en) * | 1983-03-26 | 1984-11-08 | TOTO Ltd., Kitakyushyu, Fukuoka | Lapping device |
-
1999
- 1999-08-10 DE DE1999137784 patent/DE19937784B4/en not_active Expired - Lifetime
-
2000
- 2000-06-29 DE DE50013453T patent/DE50013453D1/en not_active Expired - Lifetime
- 2000-06-29 EP EP20000113746 patent/EP1075897B1/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2780038A (en) * | 1954-09-08 | 1957-02-05 | Glaceries Sambre Sa | Glass grinding and polishing method and apparatus |
| US4665658A (en) * | 1984-05-21 | 1987-05-19 | Commissariat A L'energie Atomique | Double face abrading machine and device for transmitting current and fluid between a rotary structure and a non-rotary structure |
| DE19547085A1 (en) * | 1995-12-15 | 1997-06-19 | Wolters Peter Werkzeugmasch | Polishing machine for finishing workpiece |
| EP0803329A2 (en) * | 1996-04-25 | 1997-10-29 | Fujikoshi Kikai Kogyo Kabushiki Kaisha | Polishing machine |
| US5674116A (en) * | 1996-10-09 | 1997-10-07 | Cmi International Inc. | Disc with coolant passages for an abrasive machining assembly |
Non-Patent Citations (3)
| Title |
|---|
| JP 11058233 A, in: Patent abstracts of Japan * |
| JP 58017256 A, in: Patent abstracts of Japan * |
| JP 58-17256 A, in: Patent abstracts of Japan |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011082857A1 (en) | 2011-09-16 | 2013-03-21 | Siltronic Ag | Method for the simultaneous two-sided material removing machining of at least three workpieces |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1075897A1 (en) | 2001-02-14 |
| DE19937784A1 (en) | 2001-02-22 |
| DE50013453D1 (en) | 2006-10-26 |
| EP1075897B1 (en) | 2006-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: PETER WOLTERS GMBH, 24768 RENDSBURG, DE |
|
| R081 | Change of applicant/patentee |
Owner name: LAPMASTER WOLTERS GMBH, DE Free format text: FORMER OWNER: PETER WOLTERS GMBH, 24768 RENDSBURG, DE |
|
| R082 | Change of representative |
Representative=s name: HAUCK PATENTANWALTSPARTNERSCHAFT MBB, DE |
|
| R081 | Change of applicant/patentee |
Owner name: LAPMASTER WOLTERS GMBH, DE Free format text: FORMER OWNER: LAPMASTER WOLTERS GMBH, 24768 RENDSBURG, DE |
|
| R082 | Change of representative |
Representative=s name: HAUCK PATENTANWALTSPARTNERSCHAFT MBB, DE |
|
| R081 | Change of applicant/patentee |
Owner name: LAPMASTER WOLTERS GMBH, DE Free format text: FORMER OWNERS: LAPMASTER WOLTERS GMBH, 24768 RENDSBURG, DE; SILTRONIC AG, 81737 MUENCHEN, DE |
|
| R082 | Change of representative |
Representative=s name: HAUCK PATENTANWALTSPARTNERSCHAFT MBB, DE |
|
| R071 | Expiry of right |