DE1988678U - ELECTRICAL COMPONENT WITH A LACQUER COVERING PRODUCED BY DIPPING. - Google Patents
ELECTRICAL COMPONENT WITH A LACQUER COVERING PRODUCED BY DIPPING.Info
- Publication number
- DE1988678U DE1988678U DES64612U DES0064612U DE1988678U DE 1988678 U DE1988678 U DE 1988678U DE S64612 U DES64612 U DE S64612U DE S0064612 U DES0064612 U DE S0064612U DE 1988678 U DE1988678 U DE 1988678U
- Authority
- DE
- Germany
- Prior art keywords
- electrical component
- dipping
- covering produced
- lacquer
- lacquer covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
- Paints Or Removers (AREA)
Description
SIEMENS AKTIENGESELLSCHAFT Berlin und MünchenSIEMENS AKTIENGESELLSCHAFT Berlin and Munich
ί E APR. 1968.ί E APR. 1968.
PM 68/0036 ölPM 68/0036 oil
Elektrisches Bau element mit -einer durch. Tauchen hergestellt enElectrical component with one through. Diving made
Die vorliegende Heuerung bezieht sich auf ein elektrisches Bauelement, insbesondere einen Halbleiter-Gleichrichter, mit einer durch Tauchen hergestellten Lackurnhüllung. Sie ist dadurch gekennzeichnet, daß die Umhüllung aus 25 bis 75 Gewichtsprozent eines oder mehrerer Polyaminoamide und im übrigen aus einem oder mehreren Epoxydharzen besteht. Die Umhüllung kann ■ ferner anorganische Füllstoffe, 2,B. Quarzmehl, Glimmer, vorzugsweise jedoch Titandioxyd in Pulverform enthalten.The present hiring relates to an electrical component, in particular a semiconductor rectifier a coating produced by dipping. It is characterized in that the envelope consists of 25 to 75 percent by weight one or more polyaminoamides and otherwise of one or more epoxy resins. The envelope can ■ also inorganic fillers, 2, B. Quartz flour, mica, preferably but contain titanium dioxide in powder form.
~-.1 -~ . -"χ ■'. '■ fsg/Iie~ -.1 - ~. - "χ ■ '.' ■ fsg / Iie
,68/ÖÖ3S: CK \.- :<: , 68 / ÖÖ3S : CK \ .- : < :
laokunMllung der angegebenen Zusammensetzung hat eine hohe Haftfestigkeit und stellt einen guten Feuchtigkeit«-" schutz dar. legen ihrer Härte ist sie unempfindlich'gegen. Zerkratzen und Abschaben der Kanten. Die mit der UisMllung versehenen Bauelemente sind "bereits nach einer Öfeütrocksosg τοπ einer Stunde schilttfähig. Ds der lack keine oxydativ -trocknenden Bindemittel enthält, ist die fisMlliing we it gehend beständig gegen theriaisehen Abbau und gegen Chemikalien- und lassereinwirkung. - - '.■'■'■.'LaokunMllung the specified composition has a high adhesive strength and provides good moisture «-" protection. It is insensitive to its hardness. Scratching and scraping the edges. The one with the UisMllung provided components are "already after an oven drying τοπ one hour switchable. The paint is not oxidative - Contains drying binders, the fisMlliing is going far resistant to thermal degradation and to chemicals and lassing action. - - '. ■' ■ '■.'
Im folgenden wird ein Bahrcenrezept für einen'lack zur Herstellung der Otahüllung angegeben:The following is a recipe for a Bahrcen'lack for production stated on the ota wrapping:
5 bis 15 Sew.-feile Polys&inossiide, vorzugsweise-.mit ■- einer Äiinsahl von 90 bis 406.5 to 15 sewing files Polys & inossiide, preferably with ■ - a number from 90 to 406.
15 bis 5 ßew.-feile Epoxydharze, vorwiegend auf der15 to 5 ßew.-file epoxy resins, mainly on the
Basis von Bispkenol A und Ipiclilorhydriit, ait einem "-■, - IpöXjd-lfuivalentgewicht von 175 bis. 1100.. . v,Basis of Bispkenol A and Ipiclilorhydriit, a with an "- ■, - IpöXjd-lfuivalent weight of 175 to. 1100 ... V ,
0,65 öew.-feile ferlaufmittelkombinaMoii, vor-0.65 öew. -Feile ferlaufmittelkombinaMoii, pre-
eugsweiae auf basis.eugsweiae on Base.
30 G-ew,-feile fitandioxyc 2,4 Sew.-feile \ organische farbpigieiite, E .B.30 G-ew, -feile fitandioxyc 2 , 4 Sew. -feile \ organic color pigments, E .B.
PJithalocjamißblau.Pjithalocjamis blue.
5 bis 45 '(Jew.-feile Lösungsmittel. 5 to 45 '(Jew. File solvent.
- 2- 2nd
V WiA 68/0036 GMV WiA 68/0036 GM
Als weiteres Verlaufmittel kann ein geringer Zusatz (0,01 CJewichtsteilö) Silicösol verwendet werde»., ils Lösungsmittel sind aromatische Kohlenwasserstoffe, Jlkotiole und · Sly ο ο litt her geeignet.A small addition can be used as an additional leveling agent (0.01 part by weight) Silica sol is used as a solvent are aromatic hydrocarbons, alcohols and sly ο ο suffered her suitable.
Die Schichtdicke der Lackierung kann durch entsprechende Wahl der Polyaiinosiiide, der Epoxydharze und. des Anteiles 'm anorganischen Füllstoffen in weiten Grenzen. variiert werden. The layer thickness of the coating can be determined by the appropriate choice of polyaiinosides, epoxy resins and. the proportion 'm inorganic fillers within wide limits. can be varied.
In der Zeichnung ist ein Selen-Kleingleichrichter, der mit einer lackumhüllung gemäß der leuerung versehen ist, dargestellt. Pie Figuren 1 und 2 zeigen zwei Ansichten des Gleichrichters mit aufgeschnittener lackurahüllung, die Figur 3 einen Schnitt durch das Gleiehrichtersystem.The drawing shows a small selenium rectifier which is provided with a lacquer coating in accordance with the control system. Pie FIGS. 1 and 2 show two views of the rectifier with the lacquer casing cut open, FIG. 3 a section through the rectifier system.
Wie atis Figur 3 erkennbar ist, umfaßt das Sleichrichtersystea Tier Selen-fileichrichtertaMetteii 1, die von einer aetalli-■schea Klaimaer 2■ .umfaßt sind. Auf der Oberseite ,des Stapels aus den Öleichrichter-Tabletten 1 liegt' eine Blattfeder 3, die lit der llamsier 2 in elektrischem Kontakt steht. Im ürbigeii ist die Ilainsier 2 gegen die Tabletten I durch, eine . Isolierfolie 4 isoliert. An. der Unterseite; des Stapels liegt ein: insehlusfiblech 5. Bie: flaumer 2 ist ait■' eiser insehluS- ■. ·■,, fahnt 2a, das inschluSblech 5 mit einer Anschi«Sfshne 5# ■Tersehen. Bas: ileichrichtersysteffi und" ein feil dtrAs can be seen in FIG. 3, the Sleichrichtersystea animal includes selenium-fileichrichtertaMetteii 1, which are encompassed by an metallic ■ schea Klaimaer 2 ■. On top of the stack of oil rectifier tablets 1 lies a leaf spring 3, which is in electrical contact with the llamsier 2. In the ürbigeii the Ilainsier 2 is against the tablets I through, one. Insulating foil 4 insulated. At. the bottom; of the stack is one: insehlusfiblech 5. Bie : fluff 2 is ait ■ 'eiser insehluS- ■. · ■ ,, fahnt 2a, the inschluSblech 5 with a Anschi "Sfshne 5 # ■ Marketers marriages. Bas: ileichrichtersysteffi and "ein feil dtr
PLI. 68/0036PLI. 68/0036
fahnen ist 70η einer Laökumhällim§ 6 dar angegebenen aetiuflg umgeben. ; ;flags is 70η of a Laökumhäll in § 6 indicated aetiuflg surrounded. ; ;
Die LackimhÜllung kann in der leise hergestellt werden, daß der Sieichrichter an den InaohluJfahneE 2a und. 5a gef sit und in den Lack eingetaucht' wird. Sann lird der Gleichrichter langsam (in etwa 10 bis 20 see) fco angezogen vmä. auf einem Fließpapier mm Abfangen der eich'bildenden Kropfes, tbfe·- stelit. Danach wird der -G-Ieichrichter etwa. ©1η§ Stunde bei 80° C in einen Trockenschrank gesetzt. Saoh dem Höra^sBÄien und Abkühlen ist die Lackümhülllung soweit ausgehirtet, daß. die Gleichrichter geschüttet werden können, ohne änß ein \ Verkratzen der Laekoberfläche oder ein.Yerfcieben der CLeichrieht er zu befürchten ist. innerhalb, von 100 Stunden trocknet der lack bia mir endgültigen Härte aus.The LackimhÜllung can be produced in the quiet that the Sieichrichter on the InaohluJfahneE 2a and. 5a is gef sit and immersed in the paint '. Then the rectifier is slowly tightened (in about 10 to 20 seconds) fco. on a blotting paper mm interception of the calibrating goiter, tbfe · - stelit. Thereafter, the -GI e ichrichter about. Set in a drying cabinet at 80 ° C. for 1 hour. Even after hearing and cooling down, the lacquer coating has been worn out to such an extent that. the rectifier can be poured without änß a \ scratching the Laekoberfläche or ein.Yerfcieben he CLeichrieht is to be feared. within 100 hours the lacquer dries out to its final hardness.
3 figuren. ■ ·■, ■ ' '- ■■■.'-. * '-., . ' 2-Ansprüche , . \ \. --. " .3 figures. ■ · ■, ■ '' - ■■■ .'-. * '-.,. '2 claims ,. \ \. -. ".
Claims (2)
dadurch gekenßzeichöet, daB äie Umhüllung aus 25 "bis .Gewichtsprozent eines oder meiirerer Polyaainoamiie und in übrigen aus einem oder stehrereii Bpoxydlharzen besteht.he r 1 ehts, with one just made by rope
This is characterized by the fact that the cover consists of 25 "to .Weight percent of one or more polyacrylates and the rest of one or more epoxy resins.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES64612U DE1988678U (en) | 1968-04-05 | 1968-04-05 | ELECTRICAL COMPONENT WITH A LACQUER COVERING PRODUCED BY DIPPING. |
| JP44026110A JPS4935869B1 (en) | 1968-04-05 | 1969-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES64612U DE1988678U (en) | 1968-04-05 | 1968-04-05 | ELECTRICAL COMPONENT WITH A LACQUER COVERING PRODUCED BY DIPPING. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1988678U true DE1988678U (en) | 1968-07-04 |
Family
ID=33383713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DES64612U Expired DE1988678U (en) | 1968-04-05 | 1968-04-05 | ELECTRICAL COMPONENT WITH A LACQUER COVERING PRODUCED BY DIPPING. |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS4935869B1 (en) |
| DE (1) | DE1988678U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014103432B4 (en) | 2013-03-14 | 2021-08-12 | Infineon Technologies Austria Ag | Semiconductor package with top-side insulating layer and method for manufacturing the same |
-
1968
- 1968-04-05 DE DES64612U patent/DE1988678U/en not_active Expired
-
1969
- 1969-04-04 JP JP44026110A patent/JPS4935869B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014103432B4 (en) | 2013-03-14 | 2021-08-12 | Infineon Technologies Austria Ag | Semiconductor package with top-side insulating layer and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4935869B1 (en) | 1974-09-26 |
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