DE19748173A1 - Elektronikbauelemente einschließlich Sensoren - Google Patents
Elektronikbauelemente einschließlich SensorenInfo
- Publication number
- DE19748173A1 DE19748173A1 DE1997148173 DE19748173A DE19748173A1 DE 19748173 A1 DE19748173 A1 DE 19748173A1 DE 1997148173 DE1997148173 DE 1997148173 DE 19748173 A DE19748173 A DE 19748173A DE 19748173 A1 DE19748173 A1 DE 19748173A1
- Authority
- DE
- Germany
- Prior art keywords
- electronic components
- phb
- hydroxybutyric acid
- poly
- shows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C05—FERTILISERS; MANUFACTURE THEREOF
- C05F—ORGANIC FERTILISERS NOT COVERED BY SUBCLASSES C05B, C05C, e.g. FERTILISERS FROM WASTE OR REFUSE
- C05F17/00—Preparation of fertilisers characterised by biological or biochemical treatment steps, e.g. composting or fermentation
-
- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12Q—MEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEIC ACIDS OR MICROORGANISMS; COMPOSITIONS OR TEST PAPERS THEREFOR; PROCESSES OF PREPARING SUCH COMPOSITIONS; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL OR ENZYMOLOGICAL PROCESSES
- C12Q1/00—Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions
- C12Q1/001—Enzyme electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/141—Feedstock
- Y02P20/145—Feedstock the feedstock being materials of biological origin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/40—Bio-organic fraction processing; Production of fertilisers from the organic fraction of waste or refuse
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Zoology (AREA)
- Proteomics, Peptides & Aminoacids (AREA)
- Wood Science & Technology (AREA)
- Biotechnology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microbiology (AREA)
- Molecular Biology (AREA)
- Immunology (AREA)
- Biophysics (AREA)
- Analytical Chemistry (AREA)
- Bioinformatics & Cheminformatics (AREA)
- General Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Genetics & Genomics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Description
Die Erfindung ist in der gesamten Elektronik einsetzbar.
Bekannt sind elektronische Bauelemente, die von der Funktion her mit unterschiedlichsten
Materialien aufgebaut sind. Die Entwicklungsziele orientieren auf die Erfüllung der Funktion
in hoher Qualität, eine möglichst große Lebensdauer und eine preiswerte Herstellung.
Erreicht ein damit aufgebautes Gerät das Ende seiner Lebensdauer oder soll es entsorgt
werden, so ist der anfallende Elektronikschrott schwer zu vernichten, zu recyclen oder sonst
wie zu verwenden.
Aufgabe der Erfindung ist, Elektronikbauelemente zu finden, die die Entsorgung einfach
gestalten.
Die Erfindung ist dadurch gekennzeichnet, daß elektronische Bauelemente einschließlich
dazugehörender physikalischer, chemischer, biologischer Sensoren auf der Grundlage
biologisch abbaubarer Biopolymere wie Poly-β-Hydroxybuttersäure (PHB) oder ihren Copoly
meren oder Mischungen mit diesen oder weiteren Vertretern der Poly-β-Hydroxyfettsäuren
realisiert sind. Diese sind biologisch mit Mikroorganismen oder Pflanzen herstellbar und
werden auch durch Mikroorganismen und Enzyme abgebaut. Von den elektronischen Bau
elementen bleiben nach dem biologischen Abbauprozeß nur Dotierungs-, Legierungs-,
Mischungs- und/oder Beschichtungsmaterialien übrig. Deren Anteil am elektronischen Bau
element ist in der Regel verschwindend klein.
Der biologische Abbauprozeß für eine Verschrottung kann auf dem Komposthaufen erfolgen
oder aber in einer dafür eingerichteten Anlage. Es können auch Depots in den Elektronik
bauelementen oder in ihrer Nähe eingerichtet sein, die den Abbau nach Initialisierung in
Gang bringen. Die Initialisierung kann sowohl durch einen Wärmeimpuls als auch durch
einen kombinierten Wärme-Feuchte-Impuls ausgelöst werden. Die Feuchte kann dabei
durch Einstellen des Taupunktes oder durch eine chemische Reaktion mit Wasserabspal
tung besorgt sein.
Die Erfindung soll nachfolgend an Beispielen erläutert werden.
Fig. 1 zeigt den Aufbau und den Abbau von PHB, wobei die Enzyme β-Ketothiolase (1),
NADPH-abhängige Acetoacetyl-CoA-Reduktase (2), NADH-abhängige Acetoacetyl-CoA-
Reduktase (3), P(3HB)/PHF-Synthase (4), P(3HB)/PHF-Depolymerase (5), D-(-)-β-Hydroxy
buttersäure-Dimer-Hydrolase (6), D-(-)-β-Hydroxybuttersäure-Dehydrogenase (7) und Aceto
acetyl-CoA-Synthase (8) wirksam sind.
Fig. 2 zeigt ein allgemeines Substrat (9) aus PHB. In dieses Substrat sind durch Laser
Löcher gebohrt, die durch Verkupferung, Graphitierung oder Laserumwandlung leitend ge
macht wurden (10). Der Abbau erfolgt zunächst durch eine Depolymerase, die das Makro
molekül in Monomere und einen gewissen Anteil (15-20%) von Dimeren der Hydroxy
buttersäure zerlegt. Durch eine spezifische D-(-)-β-Hydroxybuttersäure-Dimer-Hydrolase
wird die Spaltung des Hydroxybuttersäure-Dimers katalysiert. Die entstandenen Monomere,
d. h. Hydroxybuttersäure-Moleküle fließen über eine ATP-verbrauchende, durch die Acetyl-
CoA-Synthase katalysierte Reaktion wieder in den Acetyl-CoA-pool der Zelle ein. Damit steht
dieses Molekül dem zentralen C-Metabolismus der Mikroorganismuszelle zur Verfügung und
kann zum Aufbau von zelleigenen Strukturen (Biomasse) oder zur Energiegewinnung ge
nutzt werden.
In letzterem Fall erfolgt letztlich über den Tricarbonsäure-Zyklus (TCA-Zyklus) und die
Atmungskette der Abbau zu Kohlendioxid (CO2) und Wasser. Da das PHB-Molekül nur aus
den Atomen C, O und H besteht, können beim vollständigen Abbau nur CO2 und Wasser
entstehen. Übrig bleiben minimale Mengen der leitenden Bahnen (10).
Fig. 3 zeigt ein Substrat wie in Fig. 2 aber mit einer Schicht aus einem leitenden Polymer
(11), z. B. Poly(2,5-furylen-vinylen) (PFV). Dieses regiert auf bestimmte Gase durch eine
Leitfähigkeitsänderung und ist damit ein Gassensor.
Fig. 4 zeigt schematisch auf einem Substrat nach Fig. 2 eine mäandrierende Widerstands
bahn (12) und eine laterale Kapazität (13).
Fig. 5 zeigt ein Substrat nach Fig. 2 mit zwei verschiedenen ionensensitiven Elektroden (14)
und (15).
Fig. 6 zeigt ein Substrat aus PHB mit eingelagerten Farbpigmenten (16) einer enantioselek
tiven Farbe z. B. zur Detektion eines pH-Wertes mittels Durchstrahlung durch eine Licht
quelle.
Fig. 7 zeigt ein Substrat aus PHB wie in Fig. 6 mit eingelagerten Farbreaktionen zeigenden
Enzymen (17). Bei Durchstrahlung und Einwirkung einer zu messenden Konzentration
ändert sich das Spektrum. Das kann für einen Sensor genutzt werden.
Fig. 8 zeigt auf einem PHB-Substrat aufgebrachte Leiterbahnen (18) aus Kupfer und
Lötbums (19) aus leitfähigem Kleber.
Fig. 9 zeigt die Ausgestaltung eines PHB-Substrats als Gehäuse (20) mit innen geführten
Leiterbahnen (21) und nach außen geführten Verbindungen (22).
Alle in Fig. 2 bis Fig. 9 gezeigten elektronischen Bauelemente bestehen aus dem Material
PHB, welches biologisch in Wasser und Kohlendioxid abgebaut wird, wenn die entspre
chenden Bedingungen geschafft werden.
Claims (2)
1. Elektronikbauelemente einschließlich Sensoren, dadurch gekennzeichnet, daß sie aus
einem Biopolymer wie Poly-β-Hydroxybuttersäure (PHB) und/oder deren Copolymeren
oder Mischungen mit diesen oder weiteren Vertretern der Poly-β-Hydroxyfettsäuren be
stehen und eine definierte Verschrottung mittels biologischem Abbau auslösbar ist.
2. Elektronikbauelemente einschließlich Sensoren nach Anspruch 1, dadurch gekennzeich
net, daß sie ein Depot aus Mikroorganismen und/oder Enzymen enthalten oder in ihrer
Nähe ein solches vorhanden ist, welches durch Initialisierung für den biologischen Abbau
aktivierbar ist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1997148173 DE19748173A1 (de) | 1997-10-31 | 1997-10-31 | Elektronikbauelemente einschließlich Sensoren |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1997148173 DE19748173A1 (de) | 1997-10-31 | 1997-10-31 | Elektronikbauelemente einschließlich Sensoren |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19748173A1 true DE19748173A1 (de) | 1999-05-06 |
Family
ID=7847232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1997148173 Withdrawn DE19748173A1 (de) | 1997-10-31 | 1997-10-31 | Elektronikbauelemente einschließlich Sensoren |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE19748173A1 (de) |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008085904A1 (en) * | 2007-01-05 | 2008-07-17 | Charles Stark Draper Laboratory, Inc. | Biodegradable electronic devices |
| US8372726B2 (en) | 2008-10-07 | 2013-02-12 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US8440546B2 (en) | 2004-06-04 | 2013-05-14 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US8536667B2 (en) | 2008-10-07 | 2013-09-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US8666471B2 (en) | 2010-03-17 | 2014-03-04 | The Board Of Trustees Of The University Of Illinois | Implantable biomedical devices on bioresorbable substrates |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US8934965B2 (en) | 2011-06-03 | 2015-01-13 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
| US8975073B2 (en) | 2006-11-21 | 2015-03-10 | The Charles Stark Draper Laboratory, Inc. | Microfluidic device comprising silk films coupled to form a microchannel |
| US9024394B2 (en) | 2013-05-22 | 2015-05-05 | Transient Electronics, Inc. | Controlled transformation of non-transient electronics |
| US9159635B2 (en) | 2011-05-27 | 2015-10-13 | Mc10, Inc. | Flexible electronic structure |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| US9289132B2 (en) | 2008-10-07 | 2016-03-22 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| US9554484B2 (en) | 2012-03-30 | 2017-01-24 | The Board Of Trustees Of The University Of Illinois | Appendage mountable electronic devices conformable to surfaces |
| US9691873B2 (en) | 2011-12-01 | 2017-06-27 | The Board Of Trustees Of The University Of Illinois | Transient devices designed to undergo programmable transformations |
| US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
| US9765934B2 (en) | 2011-05-16 | 2017-09-19 | The Board Of Trustees Of The University Of Illinois | Thermally managed LED arrays assembled by printing |
| US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
| US10918298B2 (en) | 2009-12-16 | 2021-02-16 | The Board Of Trustees Of The University Of Illinois | High-speed, high-resolution electrophysiology in-vivo using conformal electronics |
| US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
| US11670165B2 (en) | 2015-10-20 | 2023-06-06 | Stc, Inc. | Systems and methods for roadway management including feedback |
| US11758579B2 (en) | 2018-10-09 | 2023-09-12 | Stc, Inc. | Systems and methods for traffic priority systems |
| US11756421B2 (en) | 2019-03-13 | 2023-09-12 | Stc, Inc. | Protected turns |
-
1997
- 1997-10-31 DE DE1997148173 patent/DE19748173A1/de not_active Withdrawn
Cited By (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10374072B2 (en) | 2004-06-04 | 2019-08-06 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US9768086B2 (en) | 2004-06-04 | 2017-09-19 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US9761444B2 (en) | 2004-06-04 | 2017-09-12 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US8440546B2 (en) | 2004-06-04 | 2013-05-14 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US9450043B2 (en) | 2004-06-04 | 2016-09-20 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US12074213B2 (en) | 2004-06-04 | 2024-08-27 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US8664699B2 (en) | 2004-06-04 | 2014-03-04 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US11088268B2 (en) | 2004-06-04 | 2021-08-10 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US8975073B2 (en) | 2006-11-21 | 2015-03-10 | The Charles Stark Draper Laboratory, Inc. | Microfluidic device comprising silk films coupled to form a microchannel |
| WO2008085904A1 (en) * | 2007-01-05 | 2008-07-17 | Charles Stark Draper Laboratory, Inc. | Biodegradable electronic devices |
| US8372726B2 (en) | 2008-10-07 | 2013-02-12 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US9012784B2 (en) | 2008-10-07 | 2015-04-21 | Mc10, Inc. | Extremely stretchable electronics |
| US9289132B2 (en) | 2008-10-07 | 2016-03-22 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| US8536667B2 (en) | 2008-10-07 | 2013-09-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
| US10918298B2 (en) | 2009-12-16 | 2021-02-16 | The Board Of Trustees Of The University Of Illinois | High-speed, high-resolution electrophysiology in-vivo using conformal electronics |
| US11057991B2 (en) | 2009-12-16 | 2021-07-06 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
| US8666471B2 (en) | 2010-03-17 | 2014-03-04 | The Board Of Trustees Of The University Of Illinois | Implantable biomedical devices on bioresorbable substrates |
| US9986924B2 (en) | 2010-03-17 | 2018-06-05 | The Board Of Trustees Of The University Of Illinois | Implantable biomedical devices on bioresorbable substrates |
| US9765934B2 (en) | 2011-05-16 | 2017-09-19 | The Board Of Trustees Of The University Of Illinois | Thermally managed LED arrays assembled by printing |
| US9159635B2 (en) | 2011-05-27 | 2015-10-13 | Mc10, Inc. | Flexible electronic structure |
| US8934965B2 (en) | 2011-06-03 | 2015-01-13 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
| US10349860B2 (en) | 2011-06-03 | 2019-07-16 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
| US10396173B2 (en) | 2011-12-01 | 2019-08-27 | The Board Of Trustees Of The University Of Illinois | Transient devices designed to undergo programmable transformations |
| US9691873B2 (en) | 2011-12-01 | 2017-06-27 | The Board Of Trustees Of The University Of Illinois | Transient devices designed to undergo programmable transformations |
| US10357201B2 (en) | 2012-03-30 | 2019-07-23 | The Board Of Trustees Of The University Of Illinois | Appendage mountable electronic devices conformable to surfaces |
| US10052066B2 (en) | 2012-03-30 | 2018-08-21 | The Board Of Trustees Of The University Of Illinois | Appendage mountable electronic devices conformable to surfaces |
| US9554484B2 (en) | 2012-03-30 | 2017-01-24 | The Board Of Trustees Of The University Of Illinois | Appendage mountable electronic devices conformable to surfaces |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| US9024394B2 (en) | 2013-05-22 | 2015-05-05 | Transient Electronics, Inc. | Controlled transformation of non-transient electronics |
| US11670165B2 (en) | 2015-10-20 | 2023-06-06 | Stc, Inc. | Systems and methods for roadway management including feedback |
| US12165509B2 (en) | 2015-10-20 | 2024-12-10 | Stc, Inc. | Systems and methods for roadway management including feedback |
| US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
| US11758579B2 (en) | 2018-10-09 | 2023-09-12 | Stc, Inc. | Systems and methods for traffic priority systems |
| US12167440B2 (en) | 2018-10-09 | 2024-12-10 | Stc, Inc. | Systems and methods for traffic priority systems |
| US11756421B2 (en) | 2019-03-13 | 2023-09-12 | Stc, Inc. | Protected turns |
| US12073719B2 (en) | 2019-03-13 | 2024-08-27 | Stc, Inc. | Protected turns |
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